VLSI Testing Lecture 2: Yield & Quality Dr. Vishwani D. Agrawal James J. Danaher Professor of Electrical and Computer Engineering Auburn University, Alabama 36849, USA vagrawal@eng.auburn.edu http://www.eng.auburn.edu/~vagrawal IIT Delhi, Aug 17, 2013, 11:00AM-12:00PM Copyright 2001, Agrawal & Bushnell Lecture 2 Yield & Quality

Lecture 2 Yield & Quality Contents Yield and manufacturing cost Clustered defect yield formula Defect level Test data analysis Example: SEMATECH chip Summary Problems to solve Copyright 2001, Agrawal & Bushnell Lecture 2 Yield & Quality

VLSI Chip Yield A manufacturing defect is a finite chip area with electrically malfunctioning circuitry caused by defects created by the fabrication process. A chip with no manufacturing defect is called a good chip. Fraction (or percentage) of good chips produced in a manufacturing process is called the yield. Yield is denoted by symbol Y. Cost of a chip: Cost of fabricating and testing a wafer ———————————————————————Yield x Number of chip sites on the wafer Copyright 2001, Agrawal & Bushnell Lecture 2 Yield & Quality

Clustered VLSI Defects Good chips Faulty chips Defects Wafer Unclustered defects Wafer yield = 12/22 = 0.55 Clustered defects (VLSI) Wafer yield = 17/22 = 0.77 Copyright 2001, Agrawal & Bushnell Lecture 2 Yield & Quality

Lecture 2 Yield & Quality Yield Parameters Defect density (d ) = Average number of defects per unit of chip area Chip area (A) Clustering parameter (α) Negative binomial distribution of defects, p (x ) = Prob (number of defects on a chip = x ) G (a+x ) (Ad /a) x = ─────── . ────────── x ! G (a) (1+Ad /a) a+x where Γ is the gamma function a = 0, p (x ) is a delta function (maximum clustering) a = ∞ , p (x ) is Poisson distribution (no clustering) Copyright 2001, Agrawal & Bushnell Lecture 2 Yield & Quality

Lecture 2 Yield & Quality Yield Equation Y = Prob ( zero defect on a chip ) = p (0) Y = ( 1 + Ad / a ) - a Example: Ad = 1.0, α = 0.5, Y = 0.58 Y = e – Ad Unclustered defects: α = ∞, Example: Ad = 1.0, α = ∞, Y = 0.37 too pessimistic ! Copyright 2001, Agrawal & Bushnell Lecture 2 Yield & Quality

Defect Level or Reject Ratio Defect level (DL) is the ratio of faulty chips among the chips that pass tests. DL is measured as parts per million (ppm). DL is a measure of the effectiveness of tests. DL is a quantitative measure of the manufactured product quality. For commercial VLSI chips a DL greater than 500 ppm is considered unacceptable. Copyright 2001, Agrawal & Bushnell Lecture 2 Yield & Quality

Lecture 2 Yield & Quality Determination of DL From field return data: Chips failing in the field are returned to the manufacturer. The number of returned chips normalized to one million chips shipped is the DL. From test data: Fault coverage of tests and chip fallout rate are analyzed. A modified yield model is fitted to the fallout data to estimate the DL. Copyright 2001, Agrawal & Bushnell Lecture 2 Yield & Quality

Modified Yield Equation Three parameters: Fault density, f = average number of stuck-at faults per unit chip area Fault clustering parameter, β Stuck-at fault coverage, T The modified yield equation: Y (T ) = (1 + TAf / b) – b Assuming that tests with 100% fault coverage (T = 1.0) remove all faulty chips, Y = Y (1) = (1 + Af / b) – b Copyright 2001, Agrawal & Bushnell Lecture 2 Yield & Quality

Lecture 2 Yield & Quality Defect Level Y (T ) – Y (1) DL (T ) = ——————— Y (T ) ( b + TAf ) b = 1 – —————— ( b + Af ) b Where T is the fault coverage of tests, Af is the average number of faults on the chip of area A, β is the fault clustering parameter. Af and β are determined by test data analysis. Copyright 2001, Agrawal & Bushnell Lecture 2 Yield & Quality

Example: SEMATECH Chip Bus interface controller ASIC fabricated and tested at IBM, Burlington, Vermont 116,000 equivalent (2-input NAND) gates 304-pin package, 249 I/O Clock: 40MHz, some parts 50MHz 0.8m CMOS, 3.3V, 9.4mm x 8.8mm area Full scan, 99.79% fault coverage Advantest 3381 ATE, 18,466 chips tested at 2.5MHz test clock Data obtained courtesy of Phil Nigh (IBM) Copyright 2001, Agrawal & Bushnell Lecture 2 Yield & Quality

Test Coverage from Fault Simulator Stuck-at fault coverage, T Vector number Copyright 2001, Agrawal & Bushnell Lecture 2 Yield & Quality

Lecture 2 Yield & Quality Measured Chip Fallout Measured chip fallout, 1 – Y (T ) Vector number Copyright 2001, Agrawal & Bushnell Lecture 2 Yield & Quality

Stuck-at fault coverage, T Model Fitting Chip fallout vs. fault coverage Y (1) = 0.7623 Chip fallout and computed 1 – Y (T ) Measured chip fallout Y (T ) for Af = 2.1 and b = 0.083 Stuck-at fault coverage, T Copyright 2001, Agrawal & Bushnell Lecture 2 Yield & Quality

Lecture 2 Yield & Quality Computed DL 237,700 ppm (Y = 76.23%) Defect level in ppm Stuck-at fault coverage (%) Copyright 2001, Agrawal & Bushnell Lecture 2 Yield & Quality

Lecture 2 Yield & Quality Summary VLSI yield depends on two process parameters, defect density (d ) and clustering parameter (α). Yield drops as chip area increases; low yield means high cost. Fault coverage measures the test quality. Defect level (DL) or reject ratio is a measure of chip quality. DL can be determined by an analysis of test data. For high quality: DL << 500 ppm, fault coverage ~ 99% Copyright 2001, Agrawal & Bushnell Lecture 2 Yield & Quality

Lecture 2 Yield & Quality Two Problems to Solve Using the expression for defect level on Slide 10, derive test coverage (T ) as a function of fault clustering parameter (β), defect level (DL), and average number of faults (Af ) on a chip. Find the defect level for: Fault density, f = 1.45 faults/sq. cm Fault clustering parameter, β = 0.11 Chip area = 1 cm2 Fault Coverage, T = 95% Copyright 2001, Agrawal & Bushnell Lecture 2 Yield & Quality

DL = 1 – [(β + TAf )/(β + Af )]β (1 – DL)1/β = (β + TAf )/(β + Af ) Solution to Problem 1 Defect level, DL, is given on Slide 10, as follows: DL = 1 – [(β + TAf )/(β + Af )]β where T is the fault coverage, Af is the average number of faults on a chip of area A, and β is a fault clustering parameter. Further manipulation of this equation leads to the following result: (1 – DL)1/β = (β + TAf )/(β + Af ) or T = [{(β + Af )(1 – DL)1/β – β}/(Af )] × 100 percent Copyright 2001, Agrawal & Bushnell Lecture 2 Yield & Quality

Solution to Problem 2 Defect level, DL, as given on Slide 10, is: DL(T ) = 1 – [(β + TAf )/(β + Af )]β Substituting, Fault density, f = 1.45 faults/sq. cm Fault clustering parameter, β = 0.11 Chip area = 1 cm2 Fault Coverage, T = 95% We get, DL(T ) = 0.00522 or 5,220 parts per million Copyright 2001, Agrawal & Bushnell Lecture 2 Yield & Quality