North America HB-LED Committee (High-Brightness Light-Emitting Diode) Liaison Report April 2011

Outline Leadership Organization Chart Overview of Task Forces Highlights from Recent Meetings Feb 23, 2011 Meeting In conjunction with Strategies in Light Mar 31, 2011 Meeting In conjunction with the NA Standards Spring 2011 Meetings Upcoming Meeting Schedule April 2011 NA HB-LED Committee

Leadership Committee Co-chairs Iain Black (Philips Lumileds) Bill Quinn (Veeco) Chris Moore (Semilab) April 2011 NA HB-LED Committee

Current Committee Structure North America HB-LED Committee Iain Black (Philips Lumileds) Bill Quinn (Veeco) Chris Moore (Semilab) HB-LED Wafer TF Sunil Phatak (Rubicon) HB-LED Factory Automation Interface TF Daniel Babbs (Brooks) Jeff Felipe (Entegris) HB-LED Assembly TF Paul Reid (Kulicke & Soffa) April 2011 NA HB-LED Committee

Participating Companies AIS Automation Aixtron AkzoNobel Chemicals Amkor Brooks Automation Cimetrix Crossing Automation Diamond Mat’ls Tech Dow Corning Entegris EV Group GSI Group GT Solar Heraeus Hitachi High-Tech iNEMI Kulicke & Soffa LayTec Meyer Burger AG Miraial MKS Instruments Namiki Precision NeST Novellus OSRAM Oxford Instruments PEER Group Philips Lumileds Rubicon Rudolph Tech Semilab Seoul Semicon Shin-Etsu Polymer Silian Sinfonia Technology SUMCO SUSS Microtec TOK America TSMC TXC (LED Div) Umicore Veeco April 2011 NA HB-LED Committee

Task Force Overview HB-LED Wafer TF Charter: Define physical geometry of wafers used in HB-LED manufacturing starting with 150 mm diameter sapphire wafers Identified the following priorities Wafer Fiducial (notch vs flat) Wafer ID mark and location Center Point Thickness/TTV, Warp, Bow, and other “flatness” parameters Bulk Characteristic Issues April 2011 NA HB-LED Committee

Task Force Overview HB-LED Equipment Automation Interfaces TF Charter Define physical interfaces of substrate carriers as well as process and metrology tools of wafer/substrate carriers used in HB-LED manufacturing Discussions Developing a common vision for the future HB-LED factory How each of the factory elements would interface together Including software communications as well as process carriers and transport carriers in the TF scope Identifying which existing standards can be reused and only focus on the areas which are unique to LED Deciding on terminology for each of the carrier types which exist within an HB-LED factory April 2011 NA HB-LED Committee

Task Force Overview HB-LED Assembly TF Goal: To identify opportunities where the establishment of standards would: Lower costs of assembly Improve inter-operability among assembly steps or processes Increase potential for multi-sourcing assembly equipment, materials, or services Improve efficiency of assembly / packaging Increase yields and/or predictability and repeatability of assembly process steps Discussions LED wire bonding challenges Material handling variations, vision, wire loops Brainstorming/seeking inputs on “standards-ripe” topics April 2011 NA HB-LED Committee

TF Meetings at Strategies in Light February 23, 2011 Meeting Schedule Wednesday, February 23 HB-LED Wafer TF (1:00 PM to 2:00 PM) HB-LED Equipment Automation TF (2:00 PM to 3:00 PM) HB-LED Assembly TF (3:30 PM to 4:30 PM, Pacific) Santa Clara Convention Center in Santa Clara, California Attendance 30 in person (+ 5 people on the phone) Companies represented (partial list): OSRAM, Philips Lumileds, GT Solar, Silian, Aixtron, Veeco, LayTec, AIS Automation, Amkor, Brooks, Entegris, Novellus , Kulicke & Soffa, EV Group, GSI, iNEMI, NeST, Oxford Instruments, PEER Group, Semilab, SUSS MicroTec, TOK April 2011 NA HB-LED Committee 9

TF Meetings at Strategies in Light February 23, 2011 HB-LED Wafer TF ID Mark Wafer: flat, notch Location: backside, wafer edge Dimensions Message Content Wafer edge profile/template Survey on HB-LED 150 mm diameter sapphire wafer characteristics Reviewed responses to date Improvements Finalized and deployed in early March (broader distribution), review results at NA Spring meetings Preliminary discussion on format/structure of SEMI draft spec April 2011 NA HB-LED Committee

TF Meetings at Strategies in Light February 23, 2011 HB-LED Equipment Automation Interfaces TF Presentations Aixtron, “Ideas to Improve HB-LED Manufacturing by Higher Automation Level” OSRAM, “Considerations for standardizing basic requirements in fab automation” LayTec, “Special requirements to communication standards with respect to in-situ data” Leveraging existing SEMI Standards (e.g., SECS/GEM, Interface A), identifying gaps To establish agreement on types of carriers used as well as terminology To draft list of terminology then circulate for input April 2011 NA HB-LED Committee

TF Meetings at Strategies in Light February 23, 2011 HB-LED Assembly TF Reviewed Assembly TF charter and scope Agreement on definitions and terminology Review of LED assembly Scope within LED manufacturing (vs semiconductor) Wire bonding challenges Standardization challenges (variations, IP, etc.) Develop and deploy survey to collect inputs on areas that can be standardized April 2011 NA HB-LED Committee

HB-LED Standards Spring 2011 Meetings March 31, 2011 Wafer TF Reviewed wafer survey results received thus far Key discussions Wafer ID mark locations (top, bottom, edge) Edge chamfer spec Orientation fiducials Equipment Automation TF Automation software presentations Equipment Data Acquisition (EDA) overview & benefits SECS/GEM – EDA Comparison SEMI Standards needs for automated MOCVD tools Physical interfaces discussion Identified components and critical features Assembly TF Reviewed proposed HB-LED assembly improvements questionnaire HB-LED Technical Committee Considerations for HB-LED/EHS Standards Development Presentation proposal for Test & Measurements Task Force April 2011 NA HB-LED Committee

Calendar for HB-LED Next meetings Task Force meetings leading up to SEMICON West 2011 Conducted via teleconference/web meeting Please contact Paul Trio (ptrio@semi.org) for latest schedule SEMICON West 2011 (July 11-14) Thursday, July 14 (proposed) Wafer TF (8:00 AM to 10:00 AM) Equipment Automation TF (10:00 AM to 2:00 PM) Assembly TF (2:00 PM to 3:00 PM) HB-LED Committee (3:30 PM to 4:30 PM) San Francisco Marriott Marquis Hotel Across from Moscone Convention Center April 2011 NA HB-LED Committee 14

Call for Industry Participation HB-LED Wafer Survey 150 mm diameter sapphire wafers for HB-LED device fabrication http://www.keysurvey.com/survey/355917/e8a0/ Inputs on HB-LED Assembly Biggest cost drivers of LED assembly / packaging Assembly step or process that is inherently costly or inefficient Possible problem spots in: fixturing | materials | handling systems | dimensions (die, package, footprint, length) | optical or vision systems | compliance with specs April 2011 NA HB-LED Committee

Thank You! For more information or participate in any NA HB-LED activities, please contact Paul Trio at SEMI (ptrio@semi.org) April 2011 NA HB-LED Committee

Backup April 2011 NA HB-LED Committee

Timeline HB-LED Steering Committee Agreement to form HB-LED Standards Committee Agreed – Sept 23, 2010 NARSC Endorsement of Petition Completed – Oct 15, 2010 ISC Approval of Petition Completed – Nov 4, 2010 First NA HB-LED Standards Committee Meeting Completed – Nov 11, 2010 (in San Jose) April 2011 NA HB-LED Committee

Scope for Global and NA HB-LED Committee To include liaisons and synergies with other SEMI technical committees for the development of HB-LED-related standards. The HB-LED standards committee scope is limited to exploring and developing standards that pertain to common criteria, guidelines, methods for control and comparison of HB-LED-related materials, carriers and automation systems. It will seek to support the international need for increasing HB-LED product / process yield and reducing related HB-LED costs per Lumen. In addition to the above, the committee will also facilitate any industry initiatives towards product standardization needs. April 2011 NA HB-LED Committee

NA HB-LED Committee Kick-off Meeting Nov 11 in conjunction with NA Standards Fall 2010 Mtgs Attendance 18 people in person (+15 people on the phone) Companies represented include: Aixtron, AMAT, Brooks Automation, Cimetrix, Entegris, Kulicke & Soffa, Oxford Instruments, Philips, Semilab, SUMCO, Veeco Four TFs proposed Wafers, Carriers, Assembly, Automation Approved formation of the HB-LED Wafer Task Force April 2011 NA HB-LED Committee

Task Force Overview HB-LED Wafer TF (cont’d) First TF meeting held January 10 and identified the following priorities: Wafer Fiducial (notch vs flat) Wafer ID Mark Center Point Thickness/TTV, Warp, Bow, and other “flatness” parameters Bulk Characteristic Issues Second TF meeting held January 28 Technical discussion on preliminary values for 150 mm sapphire wafers for use in HB-LED device fabrication Diameter tolerance, center point thickness, TTV, bow & warp, orientation fiducial, ID mark, surface finish, edge profile, edge finish TF developing a survey covering these topics, to be deployed in early March for input April 2011 NA HB-LED Committee

Task Force Updates HB-LED Equipment Automation Interfaces TF Formerly Carrier TF and Automation TF Motivations for combining HB-LED Factory Requirements still developing The carrier is one component of the factory automation system But, it is the interface to multiple other components Load port, storage, lot ID, etc A combined TF will benefit from having all suppliers participate in the discussion of these interfaces and their inter-dependencies. As the basic requirements unfold sub-groups will be formed for focused discussion on each component of the factory automation. April 2011 NA HB-LED Committee

Task Force Updates HB-LED Assembly TF (cont’d) First TF meeting held February 3 Reviewed Assembly Task Force TFOF Agreement on definitions and terminology Quick review of LED "Assembly" to spur some thoughts from those not in assembly A touch of LED wire bonding challenges Material handling variations, vision, wire loops Suggestions for next meeting Brainstorming/collecting inputs on directions to take Looking for lowest hanging fruit to standardize April 2011 NA HB-LED Committee