LHCb calorimeter main features

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Presentation transcript:

LHCb calorimeter main features The calorimeter system is used in several stages for Level 0 and Level 1 triggers and off-line analysis Provide hadrons, photons and electrons candidates Measurement of their energy and position . Selectivity and fast response Provide identification of photons Good background rejection Preshower detector High level0 rate , high occupancy Full information every 25 ns Level0 yes possible every 25 ns Cost/performance compromise. Ecal based on Shashlik technology. Scintillating tile geometry for the Hcal. Common front-end electronics for Ecal and Hcal

The LHCb detector

The LHCb calorimeters and muon chambers

Requirements for the calorimeter front-end electronics Provide a fast signal : Fast Pms covering the whole dynamic range of the 2 calorimeters WLS Fibers with fast decay time Shape the input signals from PMs with total pile-up independence Perform analog to digital conversion on 12 bits at 40 MHz Perform a LF noise rejection Convert data into energy thanks to LUTs for trigger and readout Buffer data during the Level0 trigger latency Derandomize and buffer data during the Level1 trigger latency Perform a event formatting Look for local energy maxima over the channels Send the trigger information to the Trigger Validation Boards

WLS fiber measurement setup Measurement of the pulse shape properties using both X7 test beam and ultra violet N2 laser

Pulseshape :Scintillator+fiber+PM Results of fiber study Pulseshape :Scintillator+fiber+PM 1 = BCF 92 Fibers 4 = Y11 fiber -10ns 15ns

Hcal prototype overview

Front-End Electronics overview Trigger Validation 9U crate on the top of the Calorimeter Crate Controller Readout Controler ~ 6000 + 1500 calorimeter channels located in 14 Ecal and 4 Hcal crates FEB FEB FEB FEB CROC CC TVB 2 x 8 Front-End boards Cable (10m) PM To Trigger Selection Crate optical Clip (10ns) electrical ECS (Experiment Control System) optical Variable network From TTC optical To DAQ

Front_End elements Purpose : Specifications : 50 W - 8 to 10 m Circuit Shaper ADC 12 bits PM Clip Purpose : To shape PM pulses in less than 25ns to avoid electronics pile-up. Specifications : Input Signal 20mA over 25W Dynamic Range : 1V at the input of the ADC (250 W) Residue < 2% after 25ns. Sampling with 1% precision over +/- 3ns after shaping. RMS Noise < 1 ADC Count (i.e. 250 v) Since we expect a 40 Mhz beam the FE electronics aims to shape the signal in less than 25ns to avoid pile-up. The spec are thje following: 1/ we receive a signal of 20mA at the maximum over 25 Ohms. 2/ we expect 1V dynamic range at the input of the ADC with a residue less than 1% 25ns after the strobe. 3/ we expect a flat-top of at least 3 ns for 1% error in case of jitter 4/ the RMS noise should not exceed 1 ADC channel (250uV)

Simulated Input Signal PM Output Current Clipped Current As our purpose is to integrate the signal we should have consequently to the clip integrate the whole charge after 10ns.

Principle of the Integrator Filter Analog chip Rf = 12 MW 50 W Cf = 2pF PM - + 100 W 5ns - 50 W ADC 25ns - 100 W 22nF 100nF 100 W Buffer Integrator The circuit is then very easy to implement. It consists of a differential input buffer which supplies the 2 opposite charges to the integrator. It is linked to the integrator by an AC coupling. The integration capacitance value is 2pF and the feedback resistor is a dynamic circuit (Icon) which provides a high resistance (about 12MOhms). BiCMOS 0.8um ASIC 4 Channels per chip

Integrator Filter signals Buffer output current before integration T=0 T=25ns Output integrated signal Our solution consists of the integration of the PM charge and its opposite 25ns later. Therefore the integrated signal return to 0 and we fulfill the condition about the residue. Thanks to a very high gain we can get a very large flat-top. Strobe on the flat top ( » 10ns). Shaping : h(t) = [i(t) - i(t+25ns)] dt

PM input pulse and integrator output Both signals have been sampled by digital oscilloscope

Current Test Bench Results : Integrator Filter performances on test bench Simulation Results : Dynamic Range : 1.4V Non Linearity : 0.5% Residue after 25 ns : <0.5% RMS Noise after subtraction 1 Adc count Power Consumption : 40mW / Channel Open-Loop Gain : ~60dB gm (Input PMOS) = 34mA / V Fall Time : 3us Rise Time (?) : 2.5ns Input Impedance : 190W Current Test Bench Results : <=> 1.4V <=> <1% <=> <1% <=> 1.1 Adc count <=> 38mW / Channe <=> ~60dB <= > 18mA / V <=> 2us <=> 5ns <=> 270W

Block diagram of the Front-End Board

Block diagram of the baseline subtractor FE adjusted 40MHz clock Board global 40MHz clock

Top view of the 16 channel prototype front-end board

Bottom view of the 16 channel prototype front-end board

Front-end Board versus LeCroy ADCs On this plot, one can compare 2 different types of readout channels for the same PM.

Test beam results MS -25ns 6 successive samples of ECAL pulses (samples=ADC measurements every 25 nsec) Sample 5 contains the integrated charge information (note the different scale) Other samples have contributions less than 2% MS +25ns Main Sample (MS) RMS Noise : - without subtraction (=> full integrator bandwidth) : ~ 20 adcc - with subtraction : 1.1 adcc

Trigger related operations on Front-End Board ADC data converted to 8 bits in a Look-Up Table (LUT) Allows any coding. But should be additive We foresee to use ET coded on 8 bits, up to 5.12 GeV by .02 GeV steps Data is sent to neighbors on the card via the backplane => takes only one clock cycle. or via short, serially multiplexed LVDS intercrate lines => could take more than one clock cycle. Data is summed 2 by 2 in vertical lines These sums are summed 2 by 2 in horizontal lines The 32 sums (clusters) are compared and the highest one selected Performed by a pyramid of "compare and select” Should fit in 6 steps if the 45 energies enter the same big FPGA (~400I/O) Currently fits in 10 steps within 4 “smaller” FPGAs Confirmed by Verilog simulations Could probably fit in 8 steps (under study)

Next steps of the developments Board design : Validation board (trigger concentrator), CROC (Crate and Readout Controller) and Backplane. Technical points : Study on LVDS signals from 10MHz@100m to 280MHz@10m. SEU problems : More precise knowledge of the radiation environment required. Board test setup for proton/neutron irradiation.