MG CMOS Al Al SiO2 SiO2 P+ N+ N P

Slides:



Advertisements
Similar presentations
ISAT 436 Micro-/Nanofabrication and Applications MOS Transistor Fabrication David J. Lawrence Spring 2001.
Advertisements

Spencer/Ghausi, Introduction to Electronic Circuit Design, 1e, ©2003, Pearson Education, Inc. Chapter 3, slide 1 Introduction to Electronic Circuit Design.
VLSI INTERCONNECTS IN VLSI DESIGN - PROF. RAKESH K. JHA
Logic Gates M. AL-Towaileb1. Introduction Boolean algebra is used to model the circuitry of electronic devices. Each input and each output of such a device.
Figure 11.1 (p. 260) Trends of power supply voltage V DD, threshold voltage V T, and gate oxide thickness d versus channel length for CMOS logic technologies.
The reading is 7.38 mm. The reading is 7.72 mm.
CMOS Fabrication EMT 251.
05-1 Digital Integrated Circuits 05: Advanced Fabrication & Lithography Revision
Date of download: 7/8/2016 Copyright © 2016 SPIE. All rights reserved. Cross section of capacitor TEG. Figure Legend: From: Dielectric-thickness dependence.
Introduction to CMOS VLSI Design Lecture 0: Introduction.
EE314 IBM/Motorola Power PC620 IBM Power PC 601 Motorola MC68020 Field Effect Transistors.
Nonvolatile memories:
Government Engineering College,
LOGIC GATE TIMING DIAGRAM.
THE CMOS INVERTER.
A New Phase in Imaging Finding the odd atom
Resistors: Sheet resistances are process and material dependent. Typical values: - Gate poly-Si: Rsh= W/□ - High resistivity poly:
The MOS Transistor Figures from material provided with Digital Integrated Circuits, A Design Perspective, by Jan Rabaey, Prentice Hall, 1996.
MOS Field-Effect Transistors (MOSFETs)
Fabrication Flow VLSI Design UNIT I : Introduction to IC Technology
Why do we need “high-k” ? Why do we need ALD ? What is ALD ?
Manufacturing Process I
MOS TRANSISTOR (Remind the basics, emphasize the velocity saturation effects and parasitics) Structure of a NMOS transistor.
Design of AND and NAND Logic Gate Using
20-NM CMOS DESIGN.
Alternative process flows for reduction of steps
Chapter 1 & Chapter 3.
Date of download: 12/17/2017 Copyright © ASME. All rights reserved.
6.3.3 Short Channel Effects When the channel length is small (less than 1m), high field effect must be considered. For Si, a better approximation of field-dependent.
CAPACITANCE ESTIMATION
EE141 Chapter 3 VLSI Design The Devices March 28, 2003.
EMT362: Microelectronic Fabrication CMOS ISOLATION TECHNOLOGY Part 1
ENG2410 Digital Design “CMOS Technology”
In The Name of Allah درس: طراحی مدارهای VLSI
Photo 11/12/2018.
ترانزیستور MOSFET دکتر سعید شیری فصل چهارم از:
Lecture 19 OUTLINE The MOSFET: Structure and operation
Logic Gates L Al-zaid Math110.
SEMICONDUCTOR TECHNOLOGY -CMOS-
الکترونیک دیجیتال اجزای مدارات دیجیتال
منبع: & کتابMICROELECTRONIC CIRCUITS 5/e Sedra/Smith
Chemical Bonding What you need to know.
CMOS Complementary metal–oxide-semiconductor
Lecture 15 OUTLINE The MOS Capacitor Energy band diagrams
Lecture #25 OUTLINE Device isolation methods Electrical contacts to Si
Design Technologies Custom Std Cell Performance Gate Array FPGA Cost.
Department of Electronic Engineering
Layout of CMOS VLSI Circuits
Layout of CMOS VLSI Circuits
Manufacturing Process I
VLSI Lay-out Design.
Electronic structure of the SiO2 slab
Elements numbers 1-20.
V.Navaneethakrishnan Dept. of ECE, CCET
Lecture 19 OUTLINE The MOS Capacitor (cont’d) The MOSFET:
complementary metal–oxide–semiconductor Isolation Technology: Part 2
S8 + O2  SO3 C10H16 + Cl2  C + HCl MOLES REVIEW, NOV 26,2007MFC 12 8
Lecture 15 OUTLINE The MOS Capacitor Energy band diagrams
Lecture 19 OUTLINE The MOS Capacitor (cont’d) The MOSFET:

Surface Area of a Cylinder
Manufacturing Process I
FIGURE 5-1 MOS Transistor, Symbols, and Switch Models
Why do we need “high-k” ? Why do we need ALD ? What is ALD ?
Example: Precharge Evaluation.
The microchip-based drug delivery device and overview of study design
Table 2-1.
Presentation transcript:

MG CMOS Al Al SiO2 SiO2 P+ N+ N P Len pre potrebu SEI a.s. (For SEI a.s. use only)

MG CMOS invertor Metal Gate CMOS Invertor Invertor je základným prvkom logických obvodov. V prípade technológie CMOS sa skladá z p a n kanálového tranzistora v komplementárnom zapojení. The invertor is a basic of logical circuits. For CMOS (Complementary MOS) technology is constructed with p and n channel devices. p n U UG USS UDD U [V] UG [V] I Al N SiO2 P+ Al P SiO2 N+ Len pre potrebu SEI a.s. (For SEI a.s. use only)

MG CMOS štruktúra MG CMOS Cross Section Si typ N á100ń - fosfor (Phosphorus) 3,5-6,5 Wcm SiO2 P-jama (P-Well) - bór (Boron) 6,5 mm, 1,1kW/o AlSi 1mm P+ 2,2 mm, 46W/o PSG 820nm N+ 1,9 mm, 24W/o Si3N4 650nm Len pre potrebu SEI a.s. (For SEI a.s. use only)

BBr3 B Len pre potrebu SEI a.s. (For SEI a.s. use only)

POCl3 P Len pre potrebu SEI a.s. (For SEI a.s. use only)

Len pre potrebu SEI a.s. (For SEI a.s. use only)