MEMS Two-Phase Vapor Escape Heat Exchanger

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Presentation transcript:

MEMS Two-Phase Vapor Escape Heat Exchanger Milnes David Tarun Khurana Christopher Anderson

Hydrophobic PTFE, AdvantecMFS Concepts Evaporator with hydrophobic, porous membrane Liquid channel Vapor channel Hydrophobic, porous membrane Vapor outlet Liquid inlet Silicon Heat flux Hydrophobic PTFE, AdvantecMFS Wet etched pores combined with porous membrane. Etched pores act as bubble traps [Meng, 06] Polycarbonate, GE

Process Flow Diffusion Clean Oxide Growth Al. Sputter Backside Pattern (heaters & sensors) Al Etch Ashing PRX 1000 Clean Backside LTO deposition Backside protect Front-side Oxide Etch (HF) Front-side pattern (channels) Front-side channel etch (STSDRIE) Backside pattern (bond pads) Pad etch

Process Layout Backside pattern (through etch) Through etch (STS DRIE) Final released device Adhesive coat on transfer substrate Contact printing of adhesive Membrane attachment via UV curing Attachment of patterned double sticky tape (vapor channel) Top cover integration

Materials Acquired: Membranes: Adhesives: Polycarbonate – 0.1 um. 0.2 um, 0.4 um and 3 um Teflon – 0.2 um Membrane characterization apparatus has been built. Teflon coating of Polycarbonate membranes using similar setup. Adhesives: 5 different types on order. Challenge: Temperature Stability (chosen adhesives stable to 180 oC). Adhesion to membrane and silicon. 3 of chosen adhesives work well with Polycarbonate and Si 2 of chosen adhesives work well with Polycarbonate and SiO2. No appropriate adhesive for Tefon and Si. Characterization apparatus to be designed.

Membrane Test Structure Acrylic Structure Membrane Fluid in

Membrane Test Setup Pressurized Liquid Chamber Membrane Test Structure Pressure Sensor Membrane Test Structure Pressurized Liquid Chamber Membrane Test Structure Pressure Sensor

Temperature Sensor Electronics

Power Supply