Japan PI&C Committee Liaison Report NA Spring Standards Meetings, 2012 San Jose, California

<Region> <Committee> Outline Leadership Organization Chart Meeting Information Ballot Results/Upcoming Ballots New TFOF/SNARF TF reports STEP <Month> <Year> <Region> <Committee>

<Region> <Committee> Leadership Committee Co-chairs Shoji Komatsu (Acteon) Tsuyoshi Nagashima (Miraial) Tsutomu Okabe (TDK) Technical Architect Takao Nojima(Intel) <Month> <Year> <Region> <Committee>

Current Japan PI&C Committee Structure Physical Interfaces & Carriers Committee C: Shoji Komatsu / Acteon C: Tsuyoshi Nagashima / Miraial C: Tsutomu Okabe / TDK TA: Takao Nojima / Intel Global PI&C Standards Maintenance TF JA: Shoji Komatsu / Acteon NA: Larry Hartsough/ UA Associates Int’l PI&C 450mm TF JA: Shoji Komatsu / Acteon NA: Mutaz Haddadin/Intel Int’l Reticle SMIF Pod and LP Interoperability TF L: Astrid Gettel (GLOBALFOUNDRIES) L: Tom Kielbaso (Entegris) L: Koji Oyama (Dainichi Shoji) JA Shipping Box TF (under Japan Si Wafer Committee) Yasuhiro Shimizu/ Consultant Shoji Komatasu/ Acteon International 450mm Shipping Box TF (under Japan Si Wafer Committee) Yasuhiro Shimizu/ Consultant Tom Quinn/ Intel Int’l Process Module Physical Interface (IPPI) TF L: Supika Mashiro (TEL) L: Richard Oechsner (Fraunhofer) <Month> <Year> <Region> <Committee>

<Region> <Committee> Meeting Information Last meeting 9 December, 2011 In conjunction with SEMICON Japan 2011, Chiba, Japan Next meeting 13 April, 2012 SEMI Japan, Tokyo, Japan <Month> <Year> <Region> <Committee>

Recently Published Documents AUX023-1211, Overview Guide to SEMI Standard for 450 mm <Month> <Year> <Region> <Committee>

Ballot Result/ Upcoming Ballot Doc. 5205, Revision to SEMI E154-1110, Mechanical Interface Specification for 450 mm Load Port was developed by 450 mm IPIC TF was passed with editorial changes at the previous Japan PI&C Committee last December 2011. will be published soon. Upcoming Ballots – Cycle1, 2012 Doc. 5363, Removal of SEMI E31-0093, Specification for Electrical Interface, Japan Only is adjudicated at the NA PIC Committee in the NA Spring meetings 2012. Doc. 5364, Revision to SEMI E162-1111, Mechanical Interface Specification for 450 mm Front-Opening Shipping Box Load Port <Month> <Year> <Region> <Committee>

<Region> <Committee> New TFOF/SNARF New TFOF None New SNARF Doc. 5363, Removal of SEMI E31-0093, Specification for Electrical Interface, Japan Only Originated by the Global PIC Maintenance TF Doc. 5364, Revision to SEMI E162-1111, Mechanical Interface Specification for 450 mm Front-Opening Shipping Box Load Port Originated by the 450 mm IPIC TF <Month> <Year> <Region> <Committee>

<Region> <Committee> 450mm IPIC Task Force Leader Shoji Komatsu (Acteon) Current activity Doc. 5364, Revision to SEMI E162-1111, Mechanical Interface Specification for 450 mm Front-Opening Shipping Box Load Port Developed and balloted in Cycle1, 2012. <Month> <Year> <Region> <Committee>

Global PIC Standards Maintenance Task Force (JA Side) Leader Shoji Komatsu (Acteon) Current activity Doc. 5363, Removal of SEMI E31-0093, Specification for Electrical Interface, Japan Only Developed and balloted in Cycle1, 2012. <Month> <Year> <Region> <Committee>

Int’l Reticle SMIF Pod and LP Interoperability TF Leader Koji Oyama (Dainichi Shoji) Current activity Continuing revision activity of E111, E112, E19, and E19.4 Doc. 5261, Revisions to SEMI E111, Mechanical Specification for a 150 mm Reticle SMIF Pod (RSP150) Used to Transport and Store a 6 Inch Reticle SEMI E112, Mechanical Specification for a 150 mm Multiple Reticle SMIF Pod (MRSP150) Used to Transport and Store Multiple 6 Inch Reticles SEMI 19, Standard Mechanical Interface (SMIF) SEMI E19.4, 200 mm Standard Mechanical Interface (SMIF) Improving RSP sensing on RSP load ports <Month> <Year> <Region> <Committee>

International Process Module Physical Interface (IPPI) TF Leader Supika Mashiro (TEL) Current activity The TF carried out a survey for “450mm Process Module Physical Interface”. The results of the survey was reported at the TF meeting during NA Spring meeting 2012. <Month> <Year> PIC Liaison Report - September 2011 <Region> <Committee> 12

<Region> <Committee> SEMI Standards Technical Education Program (STEP) on 450 mm Wafer at SEMICON Japan 2011 Date: 9 December, 2011 Time: 13:00-16:45 Location: Int’l Conference Hall, Makuhari Messe, Chiba, Japan Supported by Japan PI&C committee, Japan Silicon Wafer Committee and Japan Packaging Committee Agenda: 13:00- Opening Remarks/ Shoji Komatsu, Acteon Corporation 13:05- The 450mm Transition: Consortium Status, Strategy, and Plans/ Mike Goldstein, SEMATECH 13:30- Overall Concepts of 450mm SEMI Standards/ Shoji Komatsu, Acteon Corporation 13:45- Basics of SEMI Standards(G88) on 450mm Packaging Process/ Sumio Masuchi, DISCO CORPARATION 14:00- 450mm Silicon Wafers Status Update/ Mike Goldstein, Intel Corporation 14:40- Explanations for 450 FOUP (E158) and MAC (E159), 450 FOSB (M80)/ Tsuyoshi Nagashima, Mirial Co., Ltd. 15:25- Explanations for 450 FOUP/ FOSB Load Port(E154)/ Tsutomu Okabe, TDK Corporation 16:00- 450mm PM Physical Interface Standard Activity/ Supika Mashiro, TOKYO ELECTRON LTD. 16:30- Q&A 16:45- Closing Remarks/ Makoto Yamamoto, Muratec Automation Co., Ltd. More than 80 participants. <Month> <Year> <Region> <Committee>

Regional Staff Contact Information Name Hiro’fumi Kanno E-mail hkanno@semi.org Phone +81.3.3222.6018 Office Address 4-7-15 Kudan-minami, Chiyoda-ku, Tokyo 102-0074 Japan Committees In charge Japan PIC Committee <Month> <Year> <Region> <Committee>