3DS-IC Standards Comittee Taiwan Chapter Liaison Report

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Presentation transcript:

3DS-IC Standards Comittee Taiwan Chapter Liaison Report Dean Chang Senior Executive Consultant March. 26, 2017

Leadership Co-Chairs Chien-Chung Lin (ITRI) Wendy Chen (King Yuan Electronics) Roger Hwang (ASE) .

3DS-IC Standards Committee Organization Chart Taiwan 3DS-IC Committee Chairs: Chien-Chung Lin (ITRI) Wendy Chen (King Yuan Electronics) Roger Hwang (ASE) Testing Task Force Leader: Ming-Chin Tsai (KYEC ) Roger Hwang ( ASE) Shang-Chun Chen (ITRI) Middle End Process Task Force Leader: Arthur Chen (NTUST) Mike Chang (ITRI)

Meeting Information Previous Meeting Next Meeting (Tentative) 14:20-15:30, March 9, 2017 SEMI office, Hsinchu, Taiwan Next Meeting (Tentative) 14:30-16:00, June, 2017 SEMI office, Hsinchu, Taiwan

3DS-IC Standards Committee Highlights Evaluating the feasibility of setting up Fan-out Task Force. The draft of Doc#5800 “New Standard: Guide for Wafer Edge Trimming for 3DS-IC Process” will be completed before next TC meeting.

Regional Staff Contact Information Name Dean Chang E-mail dchang@semi.org Phone +886-3-560-1777# 801 Fax +886-3-560-1555 Office Address 11F-2, No. 1, Taiyuan 1st Street, Zhubei, City, Hsinchu, County 30265, Taiwan Committees In charge Standards Committees I&C / EHS / FPD / PV /3DS IC Sustainable Manufacturing Committee High Tech Facility Committee