Why N2 FOUP Purge System ?

What’s the problem with FOUP ? (Possible Contamination Mechanism) FOUP polymers are able to attract AMC (Airborne Molecular Contaminants) from the equipment or from the just processed wafers. Later, FOUP outgas these contaminants to wafers, which results in an important issue to wafer environmental contamination control. Also, moisture and O2 content inside FOUP affects film quality and results in many process issues associated with moisture and O2 [source] Thi Quynh Nguyen,et al., “Identification and quantification of FOUP molecular contaminants inducing defects in integrated circuits manufacturing.” Microelectronic Engineering 105 (2013) 124-129.

Problems Solved with N2 FOUP Purge AMC (Airborne Molecular Contaminants) Decreased !!! FOUP IN OUT N2 Moisture and O2 content Decreased !!! N2 FOUP Purge System

Effects of N2 FOUP purge on Cu patterning Pictures of Cu-loss by F- inside FOUP Decreased yield due to the Cu-loss strongly depended on the wafer position and queue time between etching and wetclean. F-containing gas evaporates from the post-etch wafers and that the F- distribution inside FOUP Cu-oxidation model Reduction in Cu-loss by optimizing etch condition and controlling ambient gas [source] T.Kamoshima,et al., “Controlling ambient gas in slot-to-slot space inside FOUP to suppress Cu-loss after damascene patterning.” IEEE Trans. Semicon. Manufact., vol.21 (Renesas & Hitachi).

ZensM N2 FOUP Purge System (Diffusion Furnace) N2 Purge Load-Port (Cluster Type Equipment) Furnace FOUP Buffer Stage Buffer Stage Stage Outlet Nozzle FOUP IN OUT Inlet Nozzle Outlet Pressure Switch Inlet Nozzle #3 Inlet Nozzle#1 Inlet Nozzle #2 Outlet Nozzle Loadport Diffusion foup purge system vs Cluster type tool FOUP purge system ? Terminology 용어정리 .. Nozzle Regardless type of tool, Design of nozzle is same