GLAST Large Area Telescope:

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Presentation transcript:

GLAST Large Area Telescope: Gamma-ray Large Area Space Telescope GLAST Large Area Telescope: Mechanical Systems Peer Review March 27, 2003 Section 4.6 - XLAT Thermal Design Boris Yendler Lockheed Martin Thermal Engineer Boris.Yendler@lmco.com

Topics Requirements Thermal Design Overview Thermal Model Results Summary & Future Work

Driving X-LAT Thermal Requirements Verification Methods A: Analysis, T: Test Based on: X-LAT Plate Performance Specification, LAT-TD-01240-D2, Draft, Dated 6 Mar 2003 X-LAT Plate Assy Source Control Drawing, LAT-DS-01247, Draft, Dated 7 Mar 2003 Mid-Plate Assy Source Control Drawing, LAT-DS-01257, Draft, Dated 7 Mar 2003 Agreement Reached at Electronic Box Thermal Design Red Team Mtg, 14 Mar 2003 Based on: X-LAT Plate Performance Specification, LAT-TD-01240-D2, Draft, Dated 6 Mar 2003 X-LAT Plate Assy Source Control Drawing, LAT-DS-01247, Draft, Dated 7 Mar 2003 Mid-Plate Assy Source Control Drawing, LAT-DS-01257, Draft, Dated 7 Mar 2003 Agreement Reached at Electronic Box Thermal Design Red Team Mtg, 14 Mar 2003

Thermal Design Overview All TEM/TPS Positions w/o an Electronic Module have EMPTY Boxes mounted to them. Thermal Design Goals Remove Heat from Stacks Reduce temperature gradient on X-LAT Provide temperature at the box baseplates 40 C EPU PDU EPU GASU EPU SIU 1 SIU 2 +X +Y +Z Four central TEM/TPS Positions have Comb Bracket mounted to them.

Comb Bracket

X-LAT plate Thermal Model Foot Print of Stacks Z Y Comb Bracket X heat pipe EPU PDU EPU heat pipe Empty Empty GASU middle plate Empty Empty heat pipe EPU SIU SIU Empty heat pipe heat pipe Hot Case

XLAT Thermal Model (cont) X-LAT plate consists of 3 plates AL 6061 T6 Plates are jointed by #6-32 bolts 1 in apart Side plates – 3.175 mm (1/8 in.) Middle plate -4.76 mm (3/16 in) CCHP flange is connected to X-LAT plate via RTV and rivets All stacks are thermally connected to X-LAT plate through 4 cm wide strips of Veltherm, fiber based material (150 W/m2-K) 10 stacks consist of 3 boxes: TEM, TPS assembly and EPU, SIU, or EMPTY box

Electronics Box Thermal Model 1 stack - 2 TEM/TPS assemblies connected to PDU 1 stack - 4 central TEM/TPS assemblies connected to GASU and to Comb Brackets Flange determines contact area between boxes in a stack. A box in a stack consists of four walls, top and bottom. Heat is generated on wall and /or top/bottom Each side of the box is represented by one node X-LAT plate is represented by 1763 nodes

Thermal Results (X-LAT plate) Y 17.3 17.3 17.3 EPU PDU EPU X 20.4 20.3 20.3 24.2 GASU 22.6 22.3 21.3 19.4 EPU SIU SIU 20.1

Thermal Results (box level) TEM TEM 35.6 C 33.8 C TPS TPS 33.7 C 33.5 C EPU SIU 23.4 C 26.5 C TEM 28.3 C TPS 27.4 C Empty 23.9 C Heat pipe temperature is assumed 17 C

Electronics Box Thermal Results (cont) TEM 35.2 C TPS 32.0 C PDU 24.4 C TEM 35.4 C TPS 32.8 C GASU GASU 26.8 C 30.0 C Comb Heat pipe temperature is assumed 17 C

Summary & Future Work Summary X-LAT Assembly Temperature Gradient is 5 C Maximum Electronics Box Baseplate Temperature is 35.6 C Future Work Update X-LAT Model Refine Nodalization Optimize Localized Plate Thickness Incorporate SLAC Electronics Box Model Heat Pipe Failure Analysis