Flat Air Moving Device TEAM MEMBERS ADVISORS Bruk Yimesgen

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Presentation transcript:

Flat Air Moving Device TEAM MEMBERS ADVISORS Bruk Yimesgen Karmand Rasheed Ben Furst Alexander Aseyev Dr. Faryar Etesami Jered Wikander

Mission Statement Design and build an air movement device that meets or exceeds the criteria specified. In particular, the device will have a thickness no greater than 3mm and be able to provide air flow characteristics that are standard in current fan technology used in the cooling of electronics.

Background INTEL Semi conductor x86microprocessor

Electronics Size Performance Heat generation * Air moving device Fan Technology “Mighty Mini Fan” (8mm x 8mm x 3mm)

Customers External Intel Buyers and consumer’s of Intel’s products Accounting Purchasing Manufacturing Maintenance Quality Control/Quality Assurance Legal

Customers Internal Intel’s Mobile Platform Research and development Division PSU’s capstone faculty director Dr. Faryar Etesami Flat air moving device capstone team

Product Design Specification

Product Design Specification

Product Design Specification

House of Quality

Risk Assessment Failure to meet air flow requirements Inability to complete fabrication of prototype due to needed parts being unavailable Mechanical failure of device due to component breaking Research and understand design possibilities Ensure availability of parts before construction begins Ensure a replicate is easily available

Conclusion Design and prototype an air moving device that provides air flow comparable to currently available devices and has a maximum thickness of 3 mm. Project will focus on developing a prototype that will meet the inflexible requirements and achieves or exceeds the flexible targets.

Questions? Flat Air Moving Device