IT 318: M13 PWB Assembly IT 318 - M13.

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IT 318: M13 PWB Assembly IT 318 - M13

PWB Assembly Industry $1 Trillion (2013) (Printed Circuit Design & Fab/Circuits Assembly, Dec 2013, p. 26) (Compared to $280 Billion IC manufacturing industry) PWBs PWB Assemblies IT 318 - M13

Soldering Through-hole SMT (Surface-Mount Technology) Place components, then wave solder Screen-print solder paste, then place components, then reflow SMT (Surface-Mount Technology) For 2-sided: Glue bottom side components, then wave solder Top side = screen print solder paste, place components, reflow And variations of the above Most common solder material today: SAC 305 3% Ag, .5% Cu, 96.5% Sn IT 318 - M13

IT 318 - M13

IT 318 - M13

IT 318 - M13

Intermetallics IT 318 - M13

Hand Soldering Essentials for good solder joints: 1. Clean (no oils, oxides, dirt); rosin 2. Mechanically stable Steps for good solder joints: 1. Clean tip of soldering iron 2. Make sure component is mechanically stable 3. Apply tip to joint; use a bit of solder for heat transfer 4. Apply solder to other side of joint 5. Continue adding solder until fillets full 6. Remove solder, then remove iron 7. Let cool naturally – do not blow 8. About 5 seconds/joint IT 318 - M13

PWB Assembly Challenges Fine-pitch parts Screen-printing solder paste Lead-free solder Faster pick-&-place Lower cost ESD (Electro-Static Discharge) protection Higher quality IT 318 - M13