Module Production Status in Florence Shipping & Receiving: Gabriella Gheri Bonding: Mirko Brianzi, Enrico Scarlini DB: Simone Paoletti Tests: Riccardo Ranieri, Cristiano Marchettini, Andrea Bocci, Florentina Manolescu, Carlo Civinini, Marco Meschini xFLAG: Cristiano Marchettini, Riccardo Ranieiri ModProd Meeting TK-week April 22nd 2004 Carlo Civinini INFN-Firenze

Statistics (up to April 19th) received> 87 (31 L12p) bonded> 78 (22 L12p) ARCtested> 78 (22 L12p) ARC Ok> 76 (22 L12p) LTtested> 74 (19 L12p) LT Ok> 73 (19 L12p) Modules produced following the TIB procedures specified in: http://hep.fi.infn.it/CMS/moduletest/proc_prod/Procedure.html ModProd Meeting TK-week April 22nd 2004 Carlo Civinini INFN-Firenze

Status of Bonding Since March bonded 22 new modules (6 chips). For this L12p modules the loop height is very important, so it took a lot of time to set all the loop parameters and solve some problem. Now a new program for Delvotec is ready and it automatically bonds all the front side of the module, making all the loop shapes more reproducible. The failure rate for these modules lowered from 3 fails/module (repaired) in the beginning down to zero on the last bonded modules. ModProd Meeting TK-week April 22nd 2004 Carlo Civinini INFN-Firenze

Readout bonds Loop heights Specifications: min. 200µm max. 350µm 340 240 Specifications: min. 200µm max. 350µm These are pictures of the loops’ profile... ModProd Meeting TK-week April 22nd 2004 Carlo Civinini INFN-Firenze

Filter Capacitor and Bias bonds 370 420 525 ModProd Meeting TK-week April 22nd 2004 Carlo Civinini INFN-Firenze

Pull Test DAGE 3000 pull test machine Results of Pull Test on Readout bonds for 5 modules Mean force = 11.1g Max Standard deviations = 0.99g Minimum value = 9.0g ModProd Meeting TK-week April 22nd 2004 Carlo Civinini INFN-Firenze

Rejected Modules Two bad Modules detected by ARC: 30200020035163 Voltage breakdown at ~200V 30200020035190 23 contiguous noisy strips One bad (suspicious) Module detected by LT: 30200020035065 Some strange behaviour (affecting Peak Time only) at room temperature then a failure at -15oC followed by intermittent failures with ARC and LT 3/78  rejection rate of 3.8% ModProd Meeting TK-week April 22nd 2004 Carlo Civinini INFN-Firenze

ARC Discarded Modules (i) IV breakdown (after bonding) at 200V No evident anomalies after optical inspection (30200020035163) IV from sensor DB OK (Imax~200nA) ModProd Meeting TK-week April 22nd 2004 Carlo Civinini INFN-Firenze

Module 30200020035190 Noisy strips 148…167 148…167 ModProd Meeting TK-week April 22nd 2004 Carlo Civinini INFN-Firenze

Pinholes One new pinhole (not present in the sensor DB) has been generated after some bonding problems on strip #1  promptly identified by both ARC and LT Another new pinhole has been identified by ARC but it is not apparently related to any bonding problems  not identified by HPK? Both strips have been disconnected At present time no new pinhole has developed during the LT runs. ModProd Meeting TK-week April 22nd 2004 Carlo Civinini INFN-Firenze

IV - ARC Test Taken with ARC-DEPP Extracted from xml-xFLAG Current [nA] Volt ModProd Meeting TK-week April 22nd 2004 Carlo Civinini INFN-Firenze

Defect Statistics The defect analysis has been carried out using the Tony-Riccardo’s macros and xFLAG generated xml files 58 ARC tested modules and 54 LT tested modules have been analyzed and inserted in DB The bad strips distributions are peaked at zero and are dominated by the marginally noisy strips (aka statistical fluctuations noisy strip in only one - out of four - mode) ModProd Meeting TK-week April 22nd 2004 Carlo Civinini INFN-Firenze

Defect Statistics (from DB) out of 31000 strips ARC LT #mod in DB 58 54 # bad strips 79 27 # noisy strips 64 8 # shorted strips 1 # opens 13* 15* # pinholes # ???? 2 * Mainly unbonded pinholes ModProd Meeting TK-week April 22nd 2004 Carlo Civinini INFN-Firenze

Extracted from xml-xFLAG 23 contiguous Bad strips Unstable module After LT ModProd Meeting TK-week April 22nd 2004 Carlo Civinini INFN-Firenze

Extracted from xml-xFLAG ModProd Meeting TK-week April 22nd 2004 Carlo Civinini INFN-Firenze

Module grading by xFLAG ARC 54/58 grade A 2/58 grade B 2/58 grade C  rejected LT 52/54 grade A 1/54 grade B 1/54 grade C  rejected The .xml files have been uploaded into production DB ModProd Meeting TK-week April 22nd 2004 Carlo Civinini INFN-Firenze

Conclusions In Florence we produced 78 TIB modules (56 L34p and 22 L12p) The bonding procedures have been optimized for L34p and L12p modules: no major problems The ARC test follows immediately the module bonding, LT within one week A total of 3 modules have been rejected The bad strips are at the permille level 112 .xml files have been inserted into DB ModProd Meeting TK-week April 22nd 2004 Carlo Civinini INFN-Firenze