Silicon Wafer Japan TC Chapter Liaison Report For NA Silicon Wafer TC Chapter Meeting In conjunction with NA Spring Standards Meetings

Leadership Committee Co-chairs Leadership Changes Naoyuki J. Kawai/ Independent Tetsuya Nakai/ SUMCO Leadership Changes None 2

TC Chapter Organization Japan Silicon Wafer Naoyuki Kawai (Independent) Tetsuya Nakai (SUMCO) Int’l Test Method TF Ryuji Takeda (GlobalWafers Japan) Int’l AWG TF Satoshi Akiyama (Raytex Optima) Japan Test Method TF Ryuji Takeda (GlobalWafers Japan) Tsuyoshi Otsuki (Shin-Etsu Handotai) Mikako Omata (SCAS) Int’l Polished Wafers TF Yasuhiro Takamori (Global Wafer Japan) JWG TF Satoshi Akiyama (Raytex Optima) Masanori Yoshise (Freelance) Int’l Epitaxial Wafers TF Naohisa Toda (Shinetsu Handotai) Surface Metal Chemical Analysis WG Ryuji Takeda (Global Wafers Japan) Ryo Machida (SCAS) Int’l ASI TF Masami Ikota (Hitachi High Technologies) GOI WG Tsuyoshi Otsuki (Sinetsu Handotai) Int’l Annealed Wafers TF Koji Araki (Global Wafers Japan) Int’l 450mm Shipping Box TF Shoji Komatsu (Acteon NEXT) BMD DZ WG Satoshi Akiyama (Raytex Optima) Kazuo Moriya (Raytex Optima) Surface Organic Contaminant Analysis WG Mikako Omata (SCAS) Int’l SOI Wafers TF Atsushi Ogura (Meiji Univ) Tetsuya Nakai (SUMCO) JA Shipping Box TF Shoji Komatsu (Acteon NEXT) Tsuyoshi Nagashima (Miraial) Fiducial Mark Interoperability TF Tetsuya Nakai (SUMCO) Bulk Heavy Metal Analysis By Electrical Measurement WG Masaru Akamatsu (KOBELCO) Shingo Sumie (KOBELCO) Int’l Terminology TF Tetsuya Nakai (SUMCO)

Meeting Information Past/Last Meeting Next Meeting December 15, Thursday, 2016 at Conference Tower, Tokyo Big Site, Tokyo, Japan March 10, Friday, 2017, SEMI Japan Office Next Meeting June 16, Friday, 2017, SEMI Japan Office

JSNM Japan Society of Newer Metals (JSNM) takes over the functionality of the Committee, including management related to JIS standards based on JEITA standards JSNM Material Standards Study Group for Semiconductor Supply- Chain(M4S) is established on April 1, 2016 to take over JETTA Silicon Wafer Technology Committee. Three standardization activities are on going for Measurement for Low carbon concentricity upto 5E14atoms/cm3 in silicon mono crystalline by FT-IR. (Starting for RR test) Measurement for Low Carbon concentricity upto 1E13 atoms/cm3 in silicon mono crystalline by Photo Luminescence Technology.(Discussing test procedures) Measurement for resistivity in Epi layer with 1% accuracy. (Not yet started)

Ballot Review at the meeting on December 15 Ballots passed the TC Chapter Review 6043, Line Item Revision to SEMI MF28-0707 (Reapproved 0912) Test Methods for Minority Carrier Lifetime in Bulk Germanium and Silicon by Measurement of Photoconductivity Decay –passed as is 6044, Line Item Revision to SEMI MF673-1014 Test Methods For Measuring Resistivity Of Semiconductor Wafers Or Sheet Resistance Of Semiconductor Films With A Noncontact Eddy-current Gauge –passed as is 6045, Line Item Revision to SEMI MF928-1014 Test Methods For Edge Contour Of Circular –passed as is 6046, Line Item Revision to SEMI MF1982-0714 Test Methods For Analyzing Organic Contaminants On Silicon Wafer Surfaces By Thermal Desorption Gas Chromatography – passed as is 6047, Reapproval of SEMI MF728-1106 (Reapproved 1111) Practice for Preparing an Optical Microscope for Dimensional Measurements –passed as is (super clean) 6048, Reapproval of SEMI MF978-1106 (Reapproved 1111)Test Method for Characterizing Semiconductor Deep Levels by Transient Capacitance Techniques – passed as is (super clean) Ballot failed the TC Chapter Review 6042, Line Item Revision to SEMI MF1763-0706 (Reapproved 1111)Test Methods for Measuring Contrast of a Linear Polarizer – failed

Authorized Activities at the meeting on December 15 Line Item Revision to SEMI M1, MF-1390 and M 59, to be consistency among these three document for Bow Metrics and add illustration of Shape Metrics in M1 (International AWG) Note that this proposal will be withdrawn and separate proposal for line item revision just for MF1390 will be introduced at the NA TC Chapter meeting in conjunction with NA Spring Standards Meetings. March 10, 2017 Reapproval of M31-0708 Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers Note: Line-item ballot is appropriate for this document with accordance with Table A4-1-5 in the PM. This will be addressed at the next meeting.

Five-year Review Reapproval of M31-0708 Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers Note: Line-item ballot is appropriate for this document with accordance with Table A4-1-5 in the PM. This will be addressed at the next meeting.

SNARF Project Period Review Extended a project period 5737: Revision of SEMI MF1391-1107, Test Method for Substitutional Atomic Carbon Content of Silicon by Infrared Absorption The following documents will be reviewed at the next TC Chapter meeting 5769: New Standard: Test Method for Nitrogen Content in Silicon by Infrared Absorption 5770: Test Method for Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers 5772: Revision of MF391-0310: Test Methods for Minority Carrier Diffusion Length in Extrinsic Semiconductors by Measurement of Steady-state Surface photovoltage 5774: Sample Preparation Method for Minority Carrier Diffusion Length Measurement in Silicon Wafers by Surface Photovoltage Method

TF/ WG/ SG Reports -1 International 450mm Shipping Box Task Force / JA Shipping Box Task Force The TF decided not to address on standardization for re-use 300mm shipping. International Advanced Wafer Geometry Task Force / Japan AWG Task Force Activity to be consistency of Bow Metrics between M1 and MF1390. International Test Method Task Force / Japan Test Method Task Force Doc.5737B :Revision of SEMI MF1391-1107 (Reapproved 0912), Test Method for Substitutional Atomic Carbon Content of Silicon by Infrared Absorption will be submitted to earlier ballot cycle in 2017 International Advanced Surface Inspection Task Force Drafting Doc. 6096: Line Item Revision to SEMI M53-0216 Practice for Calibrating Scanning Surface Inspection Systems Using Certified Depositions of Monodispere Reference Spheres on Unpatterned Semiconductor Wafer Surfaces (Addition of a related information section to SEMI M53 regarding the relationship of calibrated sizes assigned to defects by surface inspection systems to their actual physical size )

TF/ WG/ SG Reports -2 International Terminology Task Force No special report from the task force but Japan TC Chapter discussed how to maintain terminology in future and candidate options are: To maintain as Aux document, this idea was withdrawn To keep M59 with inactive status and new terminology will be defined in each document To continue to reapprove and issue the revision ballot when needed In any cases, there are some issues to be discussed and Silicon Water Global Technical Committee needs to get some consultation from Regulations Subcommittee. Following the discussion during NA Spring Standards Meetings, the Japan TC Chapter will develop the proposal at the next meeting Formal discussion will be held at GCS in SEMICON WEST

TF/ WG/ SG Reports -2 International SOI Wafers Task Force No special report International Polished Wafers Task Force International Epitaxial Wafers Task Force International Annealed Wafers Task Force Fiducial Mark Interoperability Task Force This task force is under process of disbandment. Japan Silicon Wafer TC Chapter agreed to disband this task force with all agreement of other Technical Committees in Japan chapter, PI&C, I&C, Packaging and Traceability.

Other topics Proposal of New Standards, Specification for Lamella Carriers Used in Transmission Electron Microscopes According to the decision at the EU TC Chapter meeting in October during SEMICON Europa 2016, the meeting to introduce proposal was held on December 13 at SEMI Japan Office in conjunction with SEMICON Japan 2016 Back ground of this standardization Presentation on “Enabling HVM TEM metrology support - standards for TEM lamella carriers” Proposed drafts of SNARF and TFOF Conducting Survey has been decided at the Japan PI&C TC Chapter Meeting Currently contents of survey form is under drafting.

Thank you! Staff Contact Junko Collins SEMI Japan jcollins@semi.org