Nikhef/Bonn LepCol meeting

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Presentation transcript:

Nikhef/Bonn LepCol meeting - Alignment - Manipulation InGrid chips - Field cage single chip module Fred Hartjes NIKHEF Nikhef/Bonn LepCol meeting April 10, 2017

Alignment tooling mostly completed

Vacuum system in preparation One channel operational Waiting for vacuum buffers Leakage problems due to design errors with alignment block Cannot be easily cured New pickup block has to be made

Picking chips with InGrid from the box Manual picking hard Some rubbing of the vacuum tool on the InGrid surface cannot be avoided => damage of the InGrid surface Tool using small XYZ stage in preparation

Previous field cage for single chip detector Made from Semitron ESD 490 HR Gives field deformations due to inhomogeneity of the material

New field cage for single chip detector Field shaping foil with metal strips to be placed inside Strip pitch 1 mm Network from 17 resistors 470 MΩ => ~50 nA leakage current @ 200 V/cm To be mounted in existing Semitron field cage May be verified with N2 laser