Condenso Condenso XS / XM / XP / XPHS Condenso XS: New Compact Design Assembly loading from machine front side. Work piece carrier moves with separate axis towards operator for easier loading and handling Smaller footprint than Condenso XM For small / middle sized production, Laboratory / sample production Condenso XM: - shall be replaced by Condenso XS Assembly loading from left side of machine. Work piece carrier moves to the machines left side beside the cooling chamber. Easy access for loading / unloading of work piece carriers. Larger footprint than Condenso XS For small / middle sized production, Laboratory / sample production Condenso XP / XPHS XP: automatic PCB handling (loading / unloading) 1 work piece carrier 1 transport axis XPHS: automatic PCB handling (loading / unloading) 2 carriers / 2 axis system shorter cycle times – loading / unloading during processing 2nd carrier in process chamber

Condenso XS Condenso XS VAC Footprint approx.. 2,50m x 1,95m x 1,59m approx. 4,88m² 27% less than Condenso XM

Condenso XM Footprint approx. 3,42m x 1,95m x 1,59m approx. 6,5m²

Condenso XP / XPHS Footprint approx. 4,15m x 2,66m x 1,69m approx. 8m², conveyor belts ignored

Condenso - outlook Condenso XLine: during the Rehm Technology Days in September 2013 we will show the newly designed Condenso XLine to our customers Official presentation will be on the Productronica Show in November in Munich The system consists of 3 consecutive chambers The work piece carrier will be transported by a handling system from 1 chamber to the other Automatic carrier loading / unloading Empty carriers will be returned on the machines back side All chambers completely inert 1st chamber with Nitrogen option and formic gases available 2nd chamber for soldering process with vacuum option to avoid voids 3rd chamber for convection cooling process, optional water cooled and under nitrogen condition 1st and 3rd chamber can be disconnected from process chamber for easy maintenance access

Condenso XLine Load pcb Unload pcb Assembly transport via work piece carrier 3 chambers completely inert – 1st chamber (nitrogen / formic acid) 2nd chamber Process Chamber (Vacuum, nitrogen) 3rd chamber cooling (optional water-cooled, nitrogen) Load pcb Unload pcb Footprint approx. 5,40m x 2,35m x 2,10m approx. 12,7m²

Condenso XLine open open Chambers can be disconnected from process chamber for easier maintenance access