Automotive Development Overview Automotive Development Overview We start here, because the automotive industry is the driving force behind OSEK, and it’s informative to see the special challenges that they are facing, and relate these to more general embedded systems challenges.

Current Applications ABS Air bags Intelligent sunroof Rain-detecting wipers Electrochromic mirror Reverse assist Smart locking Tire pressure warning … 80 ECUs in high-end cars today

Recent/Future Applications Navigation Control Driver recognition Night vision Collision avoidance X-by-wire … Electronics is becoming the differentiator! Drive-by-wire involves the replacement of mechanic/hydraulic systems for steering, braking, throttle and suspension functions, with electronic controllers, actuators and sensors.

Driving Trends Fuel economy (engine control) Safety (ABS) Assembly costs (multiplex busses) Connectivity (GPS, internet) Mechatronics (x-by-wire) Personalisation (smartcards) Cars are getting smarter! “Gas Guzzler” Tax in the US for fuel inefficient cars. Advertising on “safety” of side-airbags recently

Segmentation of Embedded Applications Future or High end car : Multimedia Bus : D2B, MOST, Fire Wire, ... Power Train CAN Bus ABS Gear Box Suspension EMS Keyless Receiver Door Module Lamp Control Radio GSM Multimedia Center (Video, CD,.) Dash board Navigation Bridge Dashboard ISU... In-Cockpit Under the Hood This slide shows the two segments of the automotive electronics in a car. OSes like OSEK will dominate “under the hood” while VXWorks type Oses will be used in the cockpit. OSEK kernels are far smaller than VxWorks and run easily on 16 bit devices. Smaller devices, lower memory costs means lower cost ECUs. CIS however need to show features. Feature rich kernel with connectivity to the world! Body Bus CAN(VAN) Comfort Bus CAN (VAN)

Ford Statement ‘The development of automotive control systems is the critical path that determines the time-to-market of new vehicle models’ Bill Powers, Vice-President Research Ford Motor Company Importance of good embedded software development systems!

The Design ‘V’ Process Integration & Calibration Specification Design Product Verification & Deployment System Requirements Systems Level Integration, Test, Calibration Architectural Design & System Functional Design Design Verification Preliminary Feature Design Shows the typical design process used. Longer development schedules and significant verification efforts versus normal embedded systems Large systems, which need to be formally integrated Subsystem Level Integration & Verification Detailed Feature Design & Implementation Component Verification Realization

The V-cycle Functional Blocks Function Design Calibration Rapid Prototyping Hardware in the Loop Simulation Target Code Generation

Automotive Challenges Increasing Complexity Emission regulations, market demands contributing Trend to use commercial RTOS solutions. Safety-Critical High cost of failure (e.g. ABS) Need for reliable solutions, well tested Longer, Larger Projects Development typically 2-3 years but reduced in recent years Production for 5-10 years Testing/Calibration Critical Dominate for powertrain development Typically 1:1:3 (control:software:calibration) Cost of recalls is huge! Now here are some of the specific challenges and issues that are faced in this market… Increasing complexity means they are being forced to use commercial RTOSes more, and focus on their core competencies. Cost of failure can mean lives… and this means huge product liability!!

Automotive Challenges Multi-vendor Interoperability ECUs from multiple vendors need to talk to each other. Need standard interfaces for communications High Volume Single ECU may be in multiple vehicles Can be > 1 million run-times/project Component Costs Emphasis on reducing cost per unit R&D costs typically less than 5% Focus on code size and optimization Royalty schedules may be an issue with some of these customers!

Broader Challenges These challenges are common to many other industries, including: Safety-Critical – Defence, Aerospace, Medical Instrumentation Large Volume/Low Cost – Consumer electronics (e.g. handsets), Industrial Automation & Control (IMC) Increasing Complexity – All of the above!

Single-Chip Solution Examples Internal Devices Internal RAM Internal ROM MPC555 Timer, Dual CAN, Serial, A/D 32 kbytes 448 kbytes 68HC12-BC32 Timer, Dual CAN, Serial (SCI), A/D, PWM 1 kbyte 32 kbytes 68HC12-DG128 Timer, Dual CAN, Serial (2x SCI), A/D, PWM 8 kbytes 128 kbytes C167-CR Timer, CAN, Serial, A/D, PWM 4 kbytes 128 kbytes Here are some example architectures that are popular… and the memory constraints! TriCore (AUD0) Timer, Serial(4), Dual CAN, J1850, A/D, I/O 72 kbytes 20 kbytes Single-chip solutions add strict resource limitations!

Translating to RTOS Requirements Large Volume Low Unit Cost Goal Single-Chip Solutions Minimal footprint Safety Critical Applications Fast, deterministic timing RTOS Requirements Highly configurable Optimized Memory Usage Increasing Complexity Strong profiling tool support Reliable, well tested components Rigorous Testing Phase Multi-vendor Interoperability Standard APIs Finally, this slide tries to summarize these challenges, and how they translate into generic OS requirements