Typical Al to gold pin solder joint before and after 6 weeks in a 97% R.H. at 50 C. The test is inconclusive as the deposit is probably not a as result.

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Presentation transcript:

Typical Al to gold pin solder joint before and after 6 weeks in a 97% R.H. at 50 C. The test is inconclusive as the deposit is probably not a as result of corrosion. On one of the assemblies there was a noticeable change in the mechanical strength of the joints. This needs to be quantified and the resistance of the assemblies measured. Further tests in a 43% R.H. environment are ongoing.

If the layout is redone and optimised for shortest tape lengths, savings of between 20 and 30% on the tape length will reduce the all copper powertape radiation length to that of the original with a lower voltage drop across the tape.