3D silicon package structure

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Presentation transcript:

3D silicon package structure Coupled Electrical-Thermal Co-analysis of Power Delivery Networks in Si3D Structure Jianyong Xie, Daehyun Chung, Madhavan Swaminathan Objectives DC IR drop analysis of power delivery network in Si3D structures Coupled electro-thermal analysis of PDN Electro-thermal analysis tool development and tradeoffs design guideline Accomplishments Developed the procedure for static coupled electro-thermal analysis Simulation of electro-thermal problem for power plane A 3D package 3D silicon package structure Procedure for electro-thermal analysis Recent results IR drop and temperature trends with iterations of stacked chips Future work Develop static electro-thermal analysis tool for 3D structure Transient electro-thermal analysis Develop or employ new method for coupled electro-thermal analysis IR drop trend and final voltage distribution Hot spot trend and final on-chip temperature distribution IR drop with iterations

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