Comments to the SVD4 structure 8 June 2009 Toru Tsuboyama Slides from M.Friedl, T.Bergauer, C. Irmler, P. Valentine, T. Tsuboyama
Sensor with slant layers 8 July 2009 T. Tsuboyama (KEK)
APV25 distribution 8 July 2009 T. Tsuboyama (KEK)
Sensors and APV chips Layer # Ladders Rect. Sensors [50μm] [75μm] Wedge Sensors APVs 6 17 68 850 5 14 42 560 4 10 20 300 3 8 16 192 Sum: 49 130 41 1902 Unit Cost: 2k€ 400€ NRE Cost: 40k€ Total Cost: 72k€ 300k€ 122k€ 761k€ Total: 1255k€ (1.7oku¥) 8 July 2009 T. Tsuboyama (KEK)
Comparison FADC cards SVD1 SVD2 SVD4 Ladders 8+10+14=32 6+12+18+18=54 8+10+14+17=49 DSSD sensors 8*2+10*3+14*4=102 6*2+12*3+18*5+18*6=246 8*2+10*3+14*4+17*5=187 Hybrids 32*4=128 54*4=216 187 Readout chips VA1 (128*5=640) VA1TA (216*4=864) APV25 (1902) Number of hybrid cables 128 216 8*4+10*(4+1)+14*(4+2)+17*(4+3)=285 (Max) Repeater 4+4=8 (DOCK) 5+5=10 (DOCK) Not decided Cooling Dock+Endring Dock+Endring+Ladder FADC cards 32 (4 Hybrids1 FADC) 36 (24 VA1 1 FADC) 119 (16 APV25 1 FADC) 8 July 2009 T. Tsuboyama (KEK)
SVD1/SVD2 sensors were made from 4” wafers. Why Number of sensors is smaller? Answer：Sensors are made from 6” wafer SVD1/SVD2 sensors were made from 4” wafers. 8 July 2009 T. Tsuboyama (KEK)
Origami concept Chip-on-sensor concept for double-sided readout Flex fan-out pieces wrapped to opposite side (hence “Origami“) All chips aligned on one side single cooling pipe Side View (below) 8 July 2009 T. Tsuboyama (KEK) 26 June2009
Ladder shape (side view) First sketch (to scale) of outermost ladder Zylon rib Cooling pipe Nanonics connectors Flex circuits Cooling block (end ring) 8 July 2009 T. Tsuboyama (KEK) 26 June2009
Expanded view Rib Cooling tube APV25 chips Flex for bottom side signal readout Rohacel DSSD Normal hybrids Kapton flex Nanonics Connectors Support parts 8 July 2009 T. Tsuboyama (KEK) 26 June2009
Disassembled Zylon rib APV25 chips (100µm=thin) Cooling pipe Rohacell APV25 chips (300µm=thick) TPG Nanonics connectors Flex circuits T. Tsuboyama (KEK) 8 July 2009
Water tube not necessary in L3 T. Tsuboyama (KEK) 8 July 2009
Comments by S. Koike and N. Sato I consulted KEK engineers, S. Koike and N. Sato, who designed and constructed SVD 1 and SVD 2 and asked their general idea of the SVD structure. 8 July 2009 T. Tsuboyama (KEK)
Ribs and cooling pipe The combination of a Zylon rib and a cooling pipe is not appropriate for stable structure Temperature dependence may be large Precision of pipe-bending is not that good. 8 July 2009 T. Tsuboyama (KEK)
Two ribs Zylon is extremely strong in expansion. Not strong to the bending force. The following structure is weak in horizontal force 8 July 2009 T. Tsuboyama (KEK)
Two ribs + with roof With appropriate roof, structure will be stiff. 8 July 2009 T. Tsuboyama (KEK)
Is it possible to change ladder structure as follows? The Rohacell layer makes the structure weak. Roof (Zylon or CFRP) Zylon rib 8 July 2009 T. Tsuboyama (KEK)
Ladder mount procedure It must be difficult, if not impossible, to install the last ladder to the support structure. SVD1 / SVD2 Only barrel type sensors. SVD4 Slant sensor complicates the procedure 8 July 2009 T. Tsuboyama (KEK)
Solution Ladder mount is done while support structure is divided to two halves. After ladder mount is completed in left and right halves, they are put together around the beam pipe. Ladder mount procedure becomes much easier. How to keep precision between left-right and forward-backward support structure. 8 July 2009 T. Tsuboyama (KEK)
Summary Exchange of idea of the SVD structure has started. Detail design is still far. 8 July 2009 T. Tsuboyama (KEK)