Introducing Chulsoon Hwang

Slides:



Advertisements
Similar presentations
Faculty of Information Engineering and Technology IET Majors Orientation Prof. Yasser Hegazy Dean of IET.
Advertisements

Advanced Java and Android Introduction Prof. John Cole Senior Lecturer The University of Texas at Dallas.
Instructional Model, Circuits/Intro to ECE vs Biomedical Circuits and Signals Section 1, Prof. 1, TA 1,2 35 Students Section 2, Prof. 2, TA 1,2 35 Students.
Analog VLSI Design Nguyen Cao Qui.
VLSI Curriculum Workshop
Background: G Renee Managemen Corporation is a privately held engineering consulting firm located in Coconut Grove, Fl specializing in the design and development.
Presenters: Adam Andy Andy Rachel
John D. Cressler 9/ st Century Communications Market - wireless devices + computer links + transportation + space +... Frequency bands pushing higher.
1 Computer Engineering Department College of Computer Sciences and Engineering Tuesday 18 November 2008 King Fahd University of Petroleum & Minerals.
OVERVIEW OF THE ELECTRICAL ENGINEERING DEPARTMENT.
Digital Circuit Simulations Deborah Barnett, Tidehaven High School Tidehaven ISD Dr. Peng Li, Assistant Professor (faculty mentor) Department of Electrical.
Assignment II Integrated Circuits Design Ping-Hsiu Lee Reagan High School, Houston I. S. D. Deborah Barnett Tidehaven High School, Tidehaven I. S. D. Faculty.
King Fahd University of Petroleum & Minerals Department of Electrical Engineering.
School of Engineering University of Bridgeport Computer Science & Engineering Department University of Bridgeport Computer Science & Engineering Department.
California State University East Bay
Industrial & Operations Engineering, University of Michigan1 Industrial & Operations Engineering (IOE) Resources for Improved Healthcare Mark Van Oyen.
“Electrical Engineering focuses on the fundamental aspects of the discipline such as network analysis, electronics, electronic system design, signal processing,
Department of Electromagnetic Field Faculty of Electrical Engineering Czech Technical University in Prague
1 CMPE1 Hands-on Computer Engineering Stephen Petersen Richard Hughey.
International Master of Science Program in System-on-Chip (SoC) Design at KTH SoC Masters Axel Jantsch Royal Institute of.
Department of Electrical Engineering, Southern Taiwan University of Science and Technology Chi-Jo Wang Professor and Associate Chair December 17, 2012.
WATERLOO ELECTRICAL AND COMPUTER ENGINEERING 30s: Silicon Devices and Integrated Circuits 1 WATERLOO ELECTRICAL AND COMPUTER ENGINEERING 30s Silicon Devices.
National Science Foundation WHERE DISCOVERIES BEGIN Simulation Tools for Underwater Acoustic Network Analysis Sumit Roy Dept. of Electrical Eng. Fundamentals.
Signal Intel CDC Columbia, SC 11WW14 Hendrick, Matt R Gregory, Adam
Nilufa Rahim C2PRISM Fellow Sept. 12, What is Engineering? Engineering is the field of applying Science and Mathematics to develop solutions that.
National Chiao Tung University EECS International Graduate Program Engineer Your Future for Global Technology.
On Behalf of the BSEE Curriculum Committee Profs. R. Gary Daniels, Gustavo de Veciana, Brian L. Evans, Gary Hallock, Jack Lee, and Rebecca Richards-Kortum.
M. McCorquodale University of Michigan Electrical Engineering & Computer Science Mobius Integrated Systems Corporation Ann Arbor, MI January, 2001 Michael.
Presenters: Adam Andy Andy
KFUPM-COE Industrial Advisory Council Meeting 31/5/ Department of Computer Engineering (COE) College of Computer Sciences and Engineering (CCSE)
THE DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING Joseph Picone, PhD Professor and Chair, Department of Electrical and Computer Engineering College.
TIG Fair, Overview: Electromagnetics Technical Interest Group Glenn S. Smith Chairman, Electromagnetics TIG School of Electrical and Computer Engineering.
1. Hardware: each component on the microcontroller will need to be tested individually using multi-meters, logic analyzers, and circuit probe analysis.
KOPEX SCREENFORCE SYSTEMS. Applications: 1. Nuclear power plants and installations. 2. Military applications, naval frigate refurbishment. 3. Military.
Computer and Electronics Engineering CEEN. University of Nebraska-Lincoln College of Engineering.
OVERVIEW OF THE ELECTRICAL ENGINEERING DEPARTMENT.
Prof R T KennedyEMC & COMPLIANCE ENGINEERING 1 EET 422 EMC & COMPLIANCE ENGINEERING.
VISION INNOVATIVE SYSTEMS, #26, 4 th Cross, 1 st Main, Ittamadu, BSK 3 rd Stage (Near SAI Motors on Kathriguppe 100ft Ring road), Bangalore – ,
Sponsored by: Institute of Electrical and Electronics Engineers Dr. Patricia A. Nava Assistant Professor of Electrical & Computer Engineering The University.
Coupling and Cross-talk Analysis in High Speed Interconnects
Computer Engineering Department (KFUPM) Computer Engineering Department Sadiq M. Sait College of Computer Sciences and Engineering.
Overview of Electrical and Computer Engineering Timothy Grotjohn Professor and Chairperson.
Introduction to “Future Internet” Course Kyung Hee Univ. & Chonnan National Univ. & Tsinghua Univ.
Wired and Wireless network management 1. outline 2 Wireless applications Wireless LAN Wireless LAN transmission medium WLAN modes WLAN design consideration.
Dr.F. Arteche EMC DEPFET Project: A general overview.
CS203 – Advanced Computer Architecture Introduction Daniel Wong, Assistant Professor Department of Electrical and Computer Engineering Cooperating Faculty,
By Prof. Dr. Mousa A. Abd-Allah Electromagnetic Compatibility.
CS161 – Design and Architecture of Computer Systems Introduction Daniel Wong, Assistant Professor Department of Electrical and Computer Engineering Cooperating.
PROJECT BASED LEARNING
Pre-requisite for 20+ ECE Courses
Electrical Engineering
2017 CSU Counselor Conference
High-density impedance spectroscope for single cell analysis
Microcontroller Evolution
EE 442 POWER ELECTRONICS I Introduction Dr. Said A. Deraz
VLSI Tarik Booker.
SEMINAR 1. Title : Integration and characterization of long term stable novel graphene devices 2. Speaker : Byoung Hun Lee 3. Time : 16:00~17:00 4. Place.
SEMINAR 1. Title : Introduction of Emotional Image Quality Metrology Technology 2. Speaker : Seungbae LEE, Master (Samsung Display) 3. Time : 15:00 – 18:00,
CS203 – Advanced Computer Architecture
Parametric study of CMOS Photodetectors Computer Aided Lab CL2
Electrical and Computer Engineering Department
EMC problems of DSOI device and circuits
Metropolitan State University of Denver
Overview of VLSI 魏凱城 彰化師範大學資工系.
Electronic Signals How do electronic signals convey information?
SJSU: Largest provider of engineers to Silicon Valley
Common curriculum-Communications C. Burkley
Microcontroller Evolution
CS161 – Design and Architecture of Computer Systems
WHY DO CHOOSE ELECTRICAL ENGINEERING?
Presentation transcript:

Introducing Chulsoon Hwang Presentation to the Academy of Electrical and Computer Engineering, April 20, 2017

Professional Background BS, KAIST, `07 MS, KAIST, `09 Ph.D, KAIST, `12 KAIST: Korea Advanced Institute of Science and Technology, Korea Samsung Electronics, `12-15 Designed mobile phones (desens) Missouri S&T, `15-present Visiting Research Professor, `15-16 Assistant Professor, `16-present

Signal / Power Integrity Research Interests Signal / Power Integrity Signal propagation Power delivery (noise) IC / Package / PCB Electromagnetic Interference (EMI) Intra-EMI Inter-EMI Cell phones / vehicles

Center for EMC (Electromagnetic Compatibility) S&T heads an NSF I/UCRC on Electromagnetic Compatibility with more than 20 Industry partners 6 tenured/tenure track faculty 7 research faculty >40 students

Project #1 Intra EMI Funded by Samsung, Sony, and ASUS An Early Warning System for RF Sensitivity Design Pre-Design Assessment Hardware Debugging performance = target ? no yes Release Noise Radiation and Coupling Physics

Project #2 Inter EMI Funded by John Deere Full Vehicle EMI Estimation Cable bundle test Equivalent Source Model Radiation Physics Full vehicle EMI

Project #3 Silicon-Level Signal/Power Integrity Seeking Funds from NSF, etc Electrical Performance of 3D-IC/TSV Power Noise Impact on Signal Propagation Through Silicon Via (TSV) 3D-IC Silicon Metal SiO2

Future Research Directions Vehicle EMI SI/PI in 3D-ICs / Silicon Interposers

Instructional Focus EE2200: Introduction to Electronic Devices Fundamentals on devices (Diode, BJT, and FET) CpE5210: Introduction to VLSI Physical layer design for VLSI Emphasis on design practice using CAD tools Future Plan Advanced Signal/Power Integrity focused on circuit analysis