North America Physical Interfaces & Carriers Committee Liaison Report April 2011

Outline Leadership Organization Chart Meeting Information Ballot Results New TFOF/SNARF Upcoming Ballot Task Force Reports Tentative schedule for PIC at Spring 2011 Meetings April 2011 NA PIC Liaison Report

Leadership Committee Co-chairs Technical Architect Mutaz Haddadin / Intel Matt Fuller / Entegris Technical Architect Open April 2011 NA PIC Liaison Report

Organization Chart Physical Interfaces & Carriers Committee New C: Mutaz Haddadin (Intel) C: Matt Fuller (Entegris) New Global PIC Maintenance TF L: Larry Hartsough (UA Assoc.) International Reticle SMIF Pod and LP Reliability TF L: Astrid Gettel (GLOBALFOUNDRIES) L: Tom Kielbaso (Entegris) 450mm ATDP TF L: Stefan Radloff (Intel) EUV Reticle Handling TF L: Long He – Sematech / Intel L: David Halbmaier – Entegris L: Yoshio Gomei – Canon L: John Zimmerman – ASML 450 mm IPIC TF L: Mutaz Haddadin (Intel) L: Shoji Komatsu (Acteon) 450mm NA Shipping Box TF L: Tom Quinn / Intel L: Eric Olson / Entegris Integrated Measurement Module - PIC TF L: Len Kamlet / MKS Instruments DISBANDED 450mm International Shipping Box TF L: Yasuhiro Shimizu (Shimizu Consultant) L: Shoji Komatsu (Acteon) L: Tom Quinn / Intel L: Eric Olson / Entegris Int’l 300 mm Shipping Box TF L: Louise Courtois / IBM L: Harry Lawrence / Entegris RFID Tag Implementation TF L: Win Baylies / BayTech Group April 2011 NA PIC Liaison Report

Meeting Information Last meeting Next meeting 2010/03/29 at the SEMI NA Spring 2011 Meetings Santa Clara, CA (Intel) Next meeting 2010/07/13 at SEMICON West 2011 San Francisco, CA (SF Marriott Marquis Hotel) April 2011 NA PIC Liaison Report

Ballot Results None. April 2011 NA PIC Liaison Report

New TFOFs and SNARFs TFOFs SNARFs None. April 2011 NA PIC Liaison Report

Upcoming Ballots (Cycles 1 and 2-11) None. However, the committee recommended that the Global PIC Maintenance Task Force ballot the following for reapproval: SEMI E1.9-1106E, Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers SEMI E47-0301 (R1106), Specification for 150 mm/200 mm Pod Handles SEMI E47.1-1106, Mechanical Specification for FOUPS Used to Transport and Store 300 mm Wafers SEMI E62-1106, Specification for 300 mm Front-Opening Interface Mechanical Standard (FIMS) SEMI E119-0706, Mechanical Specification for Reduced-Pitch Front-Opening Box for Interfactory Transport of 300 mm Wafers SEMI E144-0306, Provisonal Specification for RF Air Interface Between RFID Tags in Carriers and RFID Readers in Semiconductor Production and Material Handling Equipment Authorizations for these will be handled by GCS if necessary. April 2011 NA PIC Liaison Report

Task Force Reports [1/3] North America 450mm Shipping Box Task Force Awaiting closure on LOA’s for E159 Entegris 450 MAC LOA Two patents dropped (related to cantilever wafer support) and 1 added (cushioned wafer container) The 2 patents that were dropped were not related to the MAC. SEMI following up on remaining outstanding LOA Key discussion topics for future document revision (once published) are: Clamping conditions during wafer handling Loadport Frame Pin/Carrier hole tolerance mismatch Wafer Set Down/Pick Up descriptions/figures Next meeting not scheduled at this time pending status of LOA closure. April 2011 NA PIC Liaison Report

Task Force Reports [2/3] Reticle SMIF Pods and Loadport Reliability Task Force TF will focus first on pod sensing issue Different opinions exist amongst TF members about appropriate approach TF will issue a straw poll in the industry to get input on the direction to go Distribution in March, review results in April Define first steps for technical work in April/May Face-to-face meeting at SEMICON West April 2011 NA PIC Liaison Report

Task Force Reports [3/3] EUV Reticle Task Force Global PIC Maintenance Task Force Larry Hartsough (UA Associates) has agreed to replace John Davies (T D Systems) as TF co-leader EUV Reticle Task Force Plans to submit SNARF for NA PIC approval based on revision plans TF teleconference every other week Face-to-face meeting at SEMICON West with focus on automation issues Yellow ballot submission for Cycle 6-2011. April 2011 NA PIC Liaison Report

SEMICON West 2011 Meeting Schedule for PIC (tentative) Monday 0800-1200: Int'l 450mm Shipping Box TF 1300-1500: NA 450mm Shipping Box TF 1500-1700: EUV Reticle TF Tuesday 0800-1200: Int'l 450mm PIC TF 1300-1600: Reticle SMIF and LP Reliability TF 1600-1700: Global PIC Maintenance TF Wednesday 0800-1200: NA PIC Committee April 2011 NA PIC Liaison Report

Regional Staff Contact Information Name Ian McLeod E-mail imcleod@semi.org Phone 408.943.6996 Location SEMI HQ, San Jose, CA Committees etc. Compound Semiconductor Materials Environmental, Health, and Safety Flat Panel Display (inactive) Liquid Chemicals Metrics Physical Interfaces and Carriers Membership April 2011 NA PIC Liaison Report