Liaison Report February 2011 North America 3DS-IC Committee (Three-dimensional Stacked Integrated Circuits) Liaison Report February 2011

Outline Leadership Organization Chart Meeting Information Task Force Updates February 2011 NA 3DS-IC Committee

Leadership Committee Co-chairs Urmi Ray (Qualcomm) Andy Rudack (SEMATECH) Chris Moore (Semilab) February 2011 NA 3DS-IC Committee

Organization Chart NA 3DS-IC Committee Wafer Bonded Stacks TF C: Urmi Ray (Qualcomm) C: Andy Rudack (SEMATECH) C: Chris Moore (Semilab) Wafer Bonded Stacks TF L: Andy Rudack (SEMATECH) Inspection & Metrology TF L: Chris Moore (Semilab) Thin Wafer Handling TF L: Urmi Ray (Qualcomm) February 2011 NA 3DS-IC Committee

Meeting Information Last meeting Next meeting January 12, 2011 (kick-off meeting) Via teleconference/web meeting Next meeting March 29 for NA Spring 2011 Meetings San Jose, California February 2011 NA 3DS-IC Committee

NA 3DS-IC Committee Kick-off Meeting Held Jan 12 via teleconference/web meeting Attendance 37 participants Companies represented include: Amkor, Applied Materials, ASE, Brooks Automation, Corning, DISCO, eda 2 asic, Entegris, eSilicon, EVG, ITRI, KLA-Tencor, Lasertec, Miraial, Nitto Denko, Olympus, Qualcomm, SEMATECH, Semilab, Sharp, SUMCO, TI Discussed formation of three (3) proposed task forces Wafer Bonded Stacks TF Inspection & Metrology TF Thin Wafer Handling TF February 2011 NA 3DS-IC Committee

Task Force Updates 3DS-IC Wafer Bonded Stacks TF Approved late January 2011 Charter: The BWS Task Force will actively create and/or modify specifications that reflect bonded wafer stacks parameters and the wafer bonding process. Scope: Identify new wafer parameters that reflect adequate ranges for bonded wafer stacks Modify/create document to reflect adequate ranges for bonded wafer stacks Identify other SEMI standards that are adversely affected by BWS parameters Update referenced standards: create/modify standards to reflect BWS parameters February 2011 NA 3DS-IC Committee

Task Force Updates 3DS-IC Wafer Bonded Stacks TF (cont’d) First meeting held February 23 Presentation on 3D lessons learned Discussion on 3D standards gap associated with bonded wafer pairs Members tasked to submit standardization proposals for consideration Target SNARF (Standards New Activity Report Form) submission at NA Spring 2011 meetings Next TF meeting March 9 via teleconference/web meeting to prioritize standardization proposals February 2011 NA 3DS-IC Committee

Task Force Updates 3DS-IC Inspection & Metrology TF Approved late January 2011 Charter: Develop standards for metrology and inspection methods to be used in measuring the properties of TSV’s, bonded wafer stacks, and dies used in the 3DS-IC manufacturing process. Scope: Examples of needed standards include (but are not limited to): TSV physical properties (i.e., depth, top, bottom CD, side wall, etc.) Bonded wafer stack properties (i.e., overlay, bond inspection) Defect metrology Dies Next Meeting: Early March 2011 February 2011 NA 3DS-IC Committee

Task Force Updates 3DS-IC Thin Wafer Handling TF Approved late January 2011 Charter: Develop standards for reliable handling and shipping of thin wafers, dies (e.g., Micro-pillar Grid array -MPGA) used in 3DS-IC high-volume manufacturing (HVM) Define thin wafer handling requirements including physical interfaces used in 3DS-IC manufacturing Define shipping requirements, including packaging, reliability, and other relevant criteria. This will also include MPGA ship/handle requirements February 2011 NA 3DS-IC Committee

Task Force Updates 3DS-IC Thin Wafer Handling TF (cont’d) Scope: Formulate a common set of requirements and prioritize critical areas for standardization, resulting in a short-list of required standards (inspection, shipping etc) in the topics listed below. Other topics may be added based on additional inputs Thin wafer and Die Shipping related activities: Examples: Shipping carriers for thin wafer (wafer cassette, box or frame), Shipping carrier for dies (MPGA), Reliability Test methods Transportation vibration testing Drop-shock Other – new tests? Thin wafer handling-related activities: Examples: Process and Metrology Tools and Test methods Whole wafer inspection for damage (crack, break etc)Macro level Damage to features – microbump, pad etc micro level Universal carrier concept Automation February 2011 NA 3DS-IC Committee

Task Force Updates 3DS-IC Thin Wafer Handling TF (cont’d) First meeting held February 16 Companies represented: Amkor, ASE, Brooks, Corning, Elpida, Intel, SEMATECH, SUSS, TOK Reviewed and finalized TF charter and scope Discussed which existing SEMI Standards can be leveraged for wafer spec and handling Next TF meeting TBD, via teleconference/web meeting February 2011 NA 3DS-IC Committee

NA 3DS-IC Spring 2011 Meeting Schedule [DRAFT] Tuesday, March 29 at SEMI HQ in San Jose, CA Wafer Bonded Stacks TF (8:00 AM to 12:00 noon) Inspection & Metrology TF (8:00 AM to 12:00 noon) Thin Wafer Handling TF (8:00 AM to 12:00 noon) NA 3DS-IC Committee (1:00 PM to 5:00 PM) http://www.semi.org/en/Standards/ctr_042107 February 2011 NA 3DS-IC Committee

Thank You! For more information or participate in any NA 3DS-IC activities, please contact Paul Trio at SEMI (ptrio@semi.org) February 2011 NA 3DS-IC Committee

Participating Companies Albany Nanotech Altera AMD Amkor ANjAY Technology Applied Materials ASE Attoscopy Brooks Automation Corning DAETEC Dynaloy Entegris EVG Fraunhofer GlobalFoundries IBM IMEC Intel ITRI Lasertec Maxim Metryx MoSys Neocera Olympus-ITA Planarity Qualcomm Raytex Rudolph Technologies Samsung Sematech Semilab SigmaTech Soitec Sonix SUSS Tamar Technology TechSearch TerePac Tezzaron TOK America TSMC WaferMasters February 2011 NA 3DS-IC Committee

SEMI Staff Contacts James Amano Director, SEMI International Standards +1 (408) 943 – 7977 jamano@semi.org Paul Trio Sr. Manager, North America Standards Operations +1 (408) 943 – 7041 ptrio@semi.org February 2011 NA 3DS-IC Committee