2.1 DFM / 4L SBL FR4 RCC(80/12㎛) FR4(0.5t 1/1oz) (Unit : ㎛)

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Presentation transcript:

2.1 DFM / 4L SBL FR4 RCC(80/12㎛) FR4(0.5t 1/1oz) (Unit : ㎛) 500 (Unit : ㎛) 300 150 100 100 100 100 100 100 600 100 100 100 S/R Min 15 35(±10) FR4 RCC(80/12㎛) Min 15 80 (-α ) 37(±10) 300 300 FR4(0.5t 1/1oz) 500(± ) 810 Min 15 Min 15 37(±10) 80(-α ) 125 125 600 125 35(±10) 475 575 725 725 575 S/R Min 15 Item SPEC. Tolerance Item SPEC. Tolerance PCB Thickness 0. 81mm ±0.08mm Outer Layer trace width (BOT) 100㎛ ±20㎛ PCB Array Size ±0.15mm Inner Layer trace width (BOT) 100㎛ ±20㎛ PCB PCS Size ±0.15mm Laser Via Annular Ring Min. 30㎛ - Surface Treatment Ni : Min 3㎛ / Au : Min 0.03㎛ - NC Via Annular Ring Min. 50㎛ - Peel Strength ≥ 1.4 kgf/cm - Conduct Trace Edge S/R Thickness Min. 5㎛ - LG Electronics / DMC Division

2.2 DFM / 6L LC-MBL FR4 RCC(65/12㎛) FR4 RCC(65/18㎛) FR4(0.36t 1/1oz) (Unit : ㎛) 300 (Max 400) 500(450) 150 (Max 200) 250 100 600 100 100 100 S/R Min 15 35(±10) FR4 RCC(65/12㎛) Min 15 65(-α ) 37 (±10) FR4 RCC(65/18㎛) 65(-α) 300 35(±10) FR4(0.36t 1/1oz) Min 15 360(± ) 784 35(± ) 65(-α) 37 (±10) 65(-α ) 35(±10) 100 100 100 100 S/R Min 15 475 500 600 650 550 Item SPEC. Tolerance Item SPEC. Tolerance PCB Thickness 0.81mm ±0.08mm Outer Layer trace width (BOT) 100㎛ ±20㎛ PCB Array Size ±0.15mm Inner Layer trace width (BOT) 100㎛ ±20㎛ PCB PCS Size ±0.15mm Laser Via Annular Ring Min. 30㎛ - Surface Treatment Ni : Min 3㎛ / Au : Min 0.03㎛ - NC Via Annular Ring Min. 50㎛ - Peel Strength ≥ 1.4 kgf/cm - Conduct Trace Edge S/R Thickness Min. 5㎛ - LG Electronics / DMC Division

2.3 DFM / 6L SBL FR4 RCC(80/12㎛) FR4(0.2t 1/1oz) (Unit : ㎛) 500 (Unit : ㎛) 300 150 100 100 100 100 100 100 600 100 100 100 S/R Min 15 35(±10) FR4 RCC(80/12㎛) Min 15 80(-α) 0.5oz 37(±10) 2116 110(±10) 300 300 35(±10) FR4(0.2t 1/1oz) Min 15 200(± ) 784 Min 15 35(± ) 2116 110(±10) 0.5oz 37(±10) 80(-α) 125 125 600 125 35(±10) 475 575 725 725 575 S/R Min 15 Item SPEC. Tolerance Item SPEC. Tolerance PCB Thickness 0.81mm ±0.08mm Outer Layer trace width (BOT) 100㎛ ±20㎛ PCB Array Size ±0.15mm Inner Layer trace width (BOT) 100㎛ ±20㎛ PCB PCS Size ±0.15mm Laser Via Annular Ring Min. 30㎛ - Surface Treatment Ni : Min 3㎛ / Au : Min 0.03㎛ - NC Via Annular Ring Min. 50㎛ - Peel Strength ≥ 1.4 kgf/cm - Conduct Trace Edge S/R Thickness Min. 5㎛ - LG Electronics / DMC Division

2.4 DFM / 8L MBL FR4 RCC(65/12㎛) FR4 RCC(65/18㎛) FR4(0.3t 1/1oz) 300 (Max 400) (Unit : ㎛) 500(450) 550 150 (Max 200) 250 100 600 100 100 100 S/R Min 15 Min 15 Min 15 300 35(±10) FR4 RCC(65/12㎛) 65(-α) 37(±10) FR4 RCC(65/18㎛) 65(-α) 0.3oz 35(±10) 2116 300 FR4(0.3t 1/1oz) 540(± ) 974 2116 0.3oz 35(± ) 600 65(-α) 37(±10) 65(-α) 100 100 100 100 35(±10) 475 500 600 650 550 S/R Min 15 Item SPEC. Tolerance Item SPEC. Tolerance PCB Thickness 1.0mm ±0.10mm Outer Layer trace width (BOT) 100㎛ ±20㎛ PCB Array Size ±0.15mm Inner Layer trace width (BOT) 100㎛ ±20㎛ PCB PCS Size ±0.15mm Laser Via Annular Ring Min. 30㎛ - Surface Treatment Ni : Min 3㎛ / Au : Min 0.03㎛ - NC Via Annular Ring Min. 50㎛ - Peel Strength ≥ 1.4 kgf/cm - Conduct Trace Edge S/R Thickness Min. 5㎛ - LG Electronics / DMC Division

2.5 DFM / 8L Staggered Build-up PCB (Unit : ㎛) 300 (Max 400) 700 550 450 150 (Max 200) 350 600 100 100 100 S/R Min 15 100 Min 15 100 Min 15 35(±10) FR4 RCC(65/12㎛) 65(-α) Min 15 35 (±10) FR4 RCC(65/12㎛) 65(-α) 0.5oz 300 35(±10) 2116 Min 15 300 FR4(0.3t 1/1oz) 540(± ) 974 2116 0.5oz 35(± ) 600 65(-α) 35 (±10) 65(-α) 100 150 150 125 125 100 100 35(±10) 500 500 350 350 575 550 S/R Min 15 Item SPEC. Tolerance Item SPEC. Tolerance PCB Thickness 1.0mm ±0.10mm Outer Layer trace width (BOT) 100㎛ ±20㎛ PCB Array Size ±0.15mm Inner Layer trace width (BOT) 100㎛ ±20㎛ PCB PCS Size ±0.15mm Laser Via Annular Ring Min. 30㎛ - Surface Treatment Ni : Min 3㎛ / Au : Min 0.03㎛ - NC Via Annular Ring Min. 50㎛ - Peel Strength ≥ 1.4 kgf/cm - Conduct Trace Edge S/R Thickness Min. 5㎛ - LG Electronics / DMC Division