Japan Environmental, Health and Safety Committee Liaison Report

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Presentation transcript:

Japan Environmental, Health and Safety Committee Liaison Report NA Spring Meetings 2012 April 5, 2012 SEMI, San Jose, CA., U.S.A.

Leadership Committee Co-chairs Supika Mashiro/ Tokyo Electron Hidetoshi Sakura/ Intel GCS voting member EHS Committee representative to the JRSC Moray Crawford/ Hatsuta Seisakusho

Committee Organization EHS Committee Supika Mashiro/ TEL Hidetoshi Sakura/ Intel Moray Crawford/ Hatsuta Disbanded FPD System Safety TF Ikuo Goto/ Murata Machinary Naokatsu Nishiguchi/ DNS S13 Revision TF Shigehito Ibuka/ TEL S19 Revision TF Shigehito Ibuka/ TEL Takao Nojima/ Intel S17 Revision TF Norio Nakashima/ Murata Machinery Shigehito Ibuka/ TEL STEP Planning WG Kenji Sugihara/ Panasonic S23 Revision TF Shigehito Ibuka/ TEL Lauren Crane/ KLA-Tencor Seismic Protection WG Shigehito Ibuka/ Tokyo Electron GHG Emission Characterization TF Shigehito Ibuka/ TEL Minoru Kagino/ Toshiba S18 Revision TF Supika Mashiro/ TEL Moray Crawford/ Hatsuta

Meeting Information Last Meeting Next Meeting December 9, 2011 in conjunction with SEMICON Japan at Makuhari Messe, Chiba, Japan Next Meeting April 19, 2012 at SEMI Japan, Tokyo, Japan

Recently Published Standards SEMI S18-0312 Environmental, Health, and Safety Guideline for Silane Flammable Silicon Compounds

Ballot Results Passed Committee Review as balloted Doc.#5323, Reapproval of SEMI S21-1106E, Safety Guideline for Worker Protection Will be forwarded to the ISC A&R SC for procedural review. Failed Committee Review Doc.#4976A, Revision to SEMI S13-0305, Environmental, Health and Safety Guideline for Documents Provided to the Equipment User for Use with Semiconductor Manufacturing Equipment Doc.#4712A, New Standard: Guide for F-GHG (Fluorinated Greenhouse Gas) Emission Characterization and Reduction

Recent and Upcoming Ballots Cycle 1 – to be reviewed in April Doc.#5374, Reapproval of SEMI S16-0307, Guide for Semiconductor Manufacturing Equipment Design for Reduction of Environmental Impact at End of Life Cycle 2 – to be reviewed in April Doc.#4976B, Revision to SEMI S13-0305, Environmental, Health and Safety Guideline for Documents Provided to the Equipment User for Use with Semiconductor Manufacturing Equipment Doc.#4712B, New Standard: Guide for F-GHG (Fluorinated Greenhouse Gas) Emission Characterization and Reduction

TF/ WG/ SG Reports (1/5) S13 Revision Task Force Background: Appendix and Related Information sections were deleted from Doc.#4976 submitted for Cycle 5, 2010, but there was a reject vote saying those sections should not be deleted. With support from the NA MESCC last spring, TF decided to retain most of Appendix and Related Information sections as they are in the current published version with as many updates as possible and Doc.#4976A was submitted for Cycle 6, 2011. There was a reject vote saying those sections add no value, and the NA EHS Committee supported this position last fall. Doc.#4976A failed committee review at SEMICON Japan. Doc.#4976B was submitted for Cycle 2, 2012 to see whether or not SEMI S13 should keep Appendix and Related Information sections. To be reviewed in April.

TF/ WG/ SG Reports (2/5) S17 Revision Task Force SNARF (#5353) to revise SEMI S17-0311 was approved in September. No progress has been made yet. S18 Revision Task Force Doc.#4400C, Revision to SEMI S18-1102: Environmental, Health and Safety Guideline for Silane Family Gases Handling with title change to “Environmental, Health and Safety Guideline for Flammable Silicon Compounds” was submitted for Cycle 5, 2011, and passed the committee and subsequent procedural review by the ISC A&R SC. Published as SEMI S18-0312, Environmental, Health, and Safety Guideline for Silane Flammable Silicon Compounds. Will work on Japanese translation.

TF/ WG/ SG Reports (3/5) S19 Revision Task Force Worked on Japanese translated version of SEMI S19-0311. Disbanded as all the missions were completed. S23 Revision Task Force Worked on Japanese translated version of SEMI S23-0311. Concluded to give up inclusion of hibernation mode in SEMI S23. Committee approved to discontinue remaining activities based on SNARF #4977. Intends to include other components such as refrigerated chillers to Related Information 2. Started discussion with chiller makers. As proposal related to equipment idle mode have been brought up to the NA I&C Committee, coordination efforts has been made between the S23 Revision TF and the NA I&C Committee.

TF/ WG/ SG Reports (4/5) FPD System Safety Task Force Worked on Japanese translated version of SEMI S26-0311. No other particular activities. Greenhouse Gas (GHG) Emission Characterization Task Force Doc.#4712A, New Standard: Guide for GHG (Greenhouse Gas) Emission Characterization was submitted for Cycle 47, but failed committee review. Doc.#4712B was submitted for Cycle 2, 2012. To be adjudicated in April.

TF/ WG/ SG Reports (5/5) STEP Planning Working Group Successfully conducted STEP/SEMI S2 in November, 2011 at SEMI Japan, Tokyo with 70 attendees. Seismic Protection Working Group Kick-off meeting was held in March, 2012. Reviewed the results of Workshop “Seismic Protection and SEMI Safety Guidelines” held at SEMICON Japan 2011. Started discussion on what are necessary for SEMI Safety Guidelines.

Topics The workshop titled “Seismic Protection and SEMI Safety Guidelines – Seismic protection in SEMI S2/ S17/ S26 and application of SEMI S12 to decontamination of equipment after earthquake –” was held during SEMICON Japan. The workshop was quite successful, approximately 70 people attended. It included introduction of SEMI Safety Guidelines applicable to seismic protection and damages after earthquakes, case studies from users (TSMC, Fujitsu), equipment suppliers (TEL), a clean room construction company (Takenaka), damage recovery specialist (Belfore), and panel discussion involving all the speakers. In the panel discussion, it was pointed out that certain parts of SEMI S2 may not be sufficient for necessary seismic protection, especially HPM tools, and that discussion may be necessary on the value provided by current SEMI S2 as guidance. Also, there was a discussion that a separate facility safety guideline may be necessary for seismic protection, which covers issues such as bracing of piping system. Check http://www.semiconjapan.org/en/sessions/standards/CTR_040573 for the details.

Thank you! For more information, please contact: Akiko Yamamoto, SEMI Japan ayamamoto@semi.org Naoko Tejima, SEMI Japan ntejima@semi.org