Testbeam Results for GaAs and Radiation-hard Si Sensors

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Testbeam Results for GaAs and Radiation-hard Si Sensors Beam Cal Testbeam Results for GaAs and Radiation-hard Si Sensors M. Ohlerich & FCAL group DESY Zeuthen 1/1/2019 FCAL Paris 07

Outline Motivation Testbeam Darmstadt 2007 GaAs Sensors Si Sensors 1/1/2019 FCAL Paris 07

Motivation BeamCal Beamstrahlung pairs: mean energy @ about 10 MeV Interaction point BeamCal V.Drugakov 6X0 Beamstrahlung pairs: mean energy @ about 10 MeV expected dose ~ 10 MGy/year 1/1/2019 FCAL Paris 07

Testbeam Darmstadt End of June 2007 10 MeV electrons supported by many FCAL members and collaborators 10 MeV electrons Teastbeam Setup accumulated dose up to 5.5 MGy per sample 1/1/2019 FCAL Paris 07

Testbeam Setup 1/1/2019 FCAL Paris 07

Testbeam Setup Beam Collimator Sensor Faraday Cup 1/1/2019 FCAL Paris 07

CCD Setup voltage applied on the sensor sample all the time 1/1/2019 FCAL Paris 07

CCD CCD = mean drift distance related to collected charge via Ramo's theorem ~ CCD counts ADC Channels ~ charge 1/1/2019 FCAL Paris 07

Irradiation Time-Table pCVD diamond (Element 6) up to 5.5 MGy sCVD diamond (GSI DA) up to 2.5 MGy Radiation-hard Silicon (BNL) up to 90 kGy GaAs (JINR) up to 0.9 MGy 1/1/2019 FCAL Paris 07

GaAs Supplied by FCAL group at JINR Produced by Siberian Institute of Technology, Tomsk Two samples semi-insulating GaAs doped by Sn (shallow donor) compensated by Cr (deep acceptor): to compensate electron trapping centers EL2+ and provide i-type conductivity. 1/1/2019 FCAL Paris 07

GaAs 200 V 500 m thick detector is divided into 87 5x5 mm pads, mounted on a 0.5 mm PCB with fanout Metallisation is V (30 nm) + Au (1 m) works as a solid state ionisation chamber; signal eh pairs drifting in the E field structure provided by metallisation (similar to diamond) 1/1/2019 FCAL Paris 07

GaAs - Before Irradiation GaAs2 Pad 4r6 Almost linear IV characteristics → ohmic resistor Rpad  500 MΩ, Pad capacity about 12 pF, Dark Current 1 μA @ 500 V IV curve = temperature dependend due to semi-conducting character 1/1/2019 FCAL Paris 07

GaAs - While Irraditaion CCD vs DOSE for central pad (pad 4 ring 6 @ 200 V) No pumping as for pCVD diamond Before irradiation: CCD = 50% of sensor thickness While irradiation: almost exponential CCD drop After irradtiation (about 1 MGy): CCD = 3% of sensor thickness preliminary 1/1/2019 FCAL Paris 07

GaAs - After Irradiation Spatial CCD distribution correspondes to beam profile Pad with 2 regions - due to collimation while irradiation → No Trap Diffusion Dark Current increased up to about 2 μA @ 500 V 1/1/2019 FCAL Paris 07

Radiation-Hard Silicon guard rings 400 V reverse voltage depletion zone supplied by BNL (Zheng Li) radiation hard, thickness 380 μm, 5x5 mm2 pn-junction in reverse voltage regime works as solid state ionisation chamber, but active volume = depletion zone signal by drifting excess charge carriers guard rings to avoid surface currents 1/1/2019 FCAL Paris 07

Silicon - Before Irradiation depletion voltage: 336 V → operational voltage 400 V 1/1/2019 FCAL Paris 07

Silicon - While Irradiation Signal-to-Noise vs DOSE CCD remained constant Noise increased strongly CCD vs DOSE preliminary 1/1/2019 FCAL Paris 07

Silicon - after Irradiation pn junction character maintained (same depletion voltage) dark current increased no CCD measurement possible due to noise 1/1/2019 FCAL Paris 07

Summary GaAs (JINR): - hugh drop of CCD within 1 MGy, but predictable, signal/noise ok - larger dark currents w.r.t. diamond Radiation-hard Silicon (BNL): - CCD stable in the measured range - ID as pn-junction kept - hugh noise growth with accumulated dose, cooling recommended by manufacturers 1/1/2019 FCAL Paris 07