North America Physical Interfaces & Carriers Committee Liaison Report September 2011

PIC Liaison Report - September 2011 Outline Leadership Organization Chart Meeting Information Ballot Results New TFOF/SNARF Upcoming Ballot Task Force Reports Tentative schedule for PIC at Fall 2011 Meetings PIC Liaison Report - September 2011

PIC Liaison Report - September 2011 Leadership Committee Co-chairs Mutaz Haddadin / Intel Matt Fuller / Entegris Technical Architect Open PIC Liaison Report - September 2011

Organization Chart Physical Interfaces & Carriers Committee New C: Mutaz Haddadin (Intel) C: Matt Fuller (Entegris) Global PIC Maintenance TF L: Larry Hartsough (UA Assoc.) International Reticle SMIF Pod and LP Reliability TF L: Astrid Gettel (GLOBALFOUNDRIES) L: Tom Kielbaso (Entegris) L: Koji Oyama (Dainichi Shoji) 450mm ATDP TF L: Stefan Radloff (Intel) New 450 mm IPIC TF L: Mutaz Haddadin (Intel) L: Shoji Komatsu (Acteon) International Process Module Physical Interface (IPPI) TF L: Supika Mashiro (TEL) L: Richard Oechsner (Fraunhofer) 450mm NA Shipping Box TF L: Tom Quinn / Intel L: Eric Olson / Entegris EUV Reticle Handling TF L: Long He – Sematech / Intel L: David Halbmaier – Entegris L: John Zimmerman – ASML 450mm International Shipping Box TF L: Yasuhiro Shimizu (Shimizu Consultant) L: Shoji Komatsu (Acteon) L: Tom Quinn / Intel L: Eric Olson / Entegris RFID Tag Implementation TF L: Win Baylies / BayTech Group PIC Liaison Report - September 2011

PIC Liaison Report - September 2011 Meeting Information Last meeting July 13 for SEMICON West 2011 Meetings San Francisco, California Next meeting October 26 for NA Fall 2011 Meetings San Jose, California PIC Liaison Report - September 2011

PIC Liaison Report - September 2011 Ballot Results Doc. # 5108 - New Auxiliary Document: 450mm SEMI Standards Overview Passed PIC Liaison Report - September 2011

PIC Liaison Report - September 2011 New TFOFs & SNARFs [1/2] TFOF International Process Module Physical Interface Task Force SNARFs 450 mm IPIC TF 5263, Revision to SEMI E158 (450 FOUP) and SEMI E159 (450 MAC) EUV Reticle Handling TF 5262, Revision to SEMI E152 (EUV Pod for 150 mm EUVL reticles) International Reticle SMIF Pod / Load Port 5261, Revisions to SEMI E111 (RSP150), E112 (MRSP150), E19 (SMIF), E19.4 (200 mm SMIF) PIC Liaison Report - September 2011

PIC Liaison Report - September 2011 New TFOFs & SNARFs [2/2] New SNARFs Global PIC Maintenance TF 5254, Reapproval for E1.9 5255, Withdrawal of E7 (electrical interfaces, U.S.) 5256, Reapproval for E47 5257, Reapproval for E47.1 5258, Reapproval for E62 5259, Reapproval for E64 5260, Reapproval for 119 5264, Revision to E144 (RFID) PIC Liaison Report - September 2011

PIC Liaison Report - September 2011 Upcoming Ballots Technical Ballots to be reviewed at the NA Fall 2011 Meetings Voting Period: Cycle 6 5262, Revision to SEMI E152 (EUV Pod for 150 mm EUVL reticles) 5263, Revision to SEMI E158 (450 FOUP) / SEMI E159 (450 MAC) 5254, Reapproval for E1.9 5255, Withdrawal of E7 (electrical interfaces, U.S.) 5256, Reapproval for E47 5257, Reapproval for E47.1 5258, Reapproval for E62 5259, Reapproval for E64 5260, Reapproval for 119 5264, Revision to E144 (RFID) PIC Liaison Report - September 2011

PIC Liaison Report - September 2011 Task Force Reports [1/3] New Task Force: International Process Module Physical Interface (IPPI) TF Charter The TF is formed to discuss standardization of physical interface and other interoperability related specification for the 450mm (vacuum) process modules and transfer module of the cluster tool. Scope: The TF will assess the industry needs and necessary extent for standardization of physical interface and other interoperability related specification for the 450mm (vacuum) process modules and transfer module of the cluster tool. For the area that are agreed upon a need for standardization, the TF is expected to develop Standards that define physical interface and other interoperability related specification between the process chamber and the different modules (e.g. transfer module) of a cluster tool, which may be 450mm equivalent of or similar to E21.1 and E22.1 (So-called 300mm MESC Standards). PIC Liaison Report - September 2011

PIC Liaison Report - September 2011 Task Force Reports [2/3] North America 450mm Shipping Box Task Force / 450 mm IPIC Task Force Submitted E158 (450 FOUP) and E159 (450 MAC) revision ballot for Cycle 6 Reticle SMIF Pods and Loadport Reliability Task Force Continuing development of E111, E112, E19, and E19.4 revision ballot (#5261) Improving RSP sensing on RSP load ports PIC Liaison Report - September 2011

PIC Liaison Report - September 2011 Task Force Reports [2/3] Global PIC Maintenance Task Force Submitted 5-year review ballots for Cycle 6 EUV Reticle Task Force Submitted E152 (EUV Pod) revision ballot (5262) for Cycle 6 PIC Liaison Report - September 2011

NA Standards Fall 2011 Meetings October 24-28 SEMI Headquarters in San Jose, California Inviting local companies willing and able to host some of the meetings to maintain one-week format PIC/SiW meetings at Intel (Santa Clara) EHS meetings at Applied Materials (Santa Clara) Final schedule to be announced soon PIC Liaison Report - September 2011

NA Standards Fall 2011 Meetings October 24-27 Sunday Monday Tuesday Wednesday Thursday Friday Saturday 23 24 25 26 27 28 29 NARSC EH&S Facilities & Gases HB-LED Information & Control MEMS/NEMS Metrics Photovoltaic Physical Interfaces & Carriers Silicon Wafer Traceability 3DS-IC Locations - SEMI - AMAT - Intel - Hynix PIC Liaison Report - September 2011

NA Standards Fall 2011 Meetings Meeting Schedule for PIC (tentative) Monday, October 24 0800-1000: Int'l 450mm Shipping Box TF 1000-1200: NA 450mm Shipping Box TF 1300-1700: Int’l Process Module Physical Interface TF Tuesday, October 25 0800-1100: Int'l 450mm PIC TF 1100-1200: Global PIC Maintenance TF 1300-1500: Reticle SMIF and LP Reliability TF 1500-1700: EUV Reticle TF Wednesday, October 26 0800-1200: NA PIC Committee PIC Liaison Report - September 2011

NA Standards Staff Changes Paul Trio Sr. Manager, NA Standards Operations Operations Committees: NARSC / I&C / ATE / MEMS / Microlithography, HB-LED / 3DS-IC Meetings & Events Planning General Information STEPS/Workshops and Sponsorships Kevin Nguyen Manager, NA Standards Committees Committees: Facilities / Gases / PV / PV Automation / PV Materials / Silicon Wafer / Traceability Standards Website Provisional: Contact Paul Trio (ptrio@semi.org) or Kevin Nguyen (knguyen@semi.org) Committees: Compounds Semiconductor Materials / EHS / FPD / Liquid Chemicals / Metrics / PIC Ian McLeod has moved to a new company. New hire for Standards Engineer in progress. PIC Liaison Report - September 2011

PIC Liaison Report - September 2011 Thank You! For more information or participate in any NA I&C activities, please contact Paul Trio at SEMI (ptrio@semi.org) PIC Liaison Report - September 2011