Flex Status A.Nomerotski, 4 May 2010.

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Presentation transcript:

Flex Status A.Nomerotski, 4 May 2010

Outline Flex status Next steps

General Information Flex Connector: MOLEX 80 pins Accommodates 6 sensors MIMOSA26 Dimensions 205.9 mm x 40.5 mm Polyimide, 50 micron thick Two metal layers, 17 um base copper then plate another 25 um onto this surface copper and through the holes Top: gold/nickel, wedge wire bonding compatible Cover layer with total thickness of 50 um 25 um polyimide film 25 um acrylic adhesive Connector: MOLEX 80 pins 0.4 mm pitch, 1 mm height (when plugged) Flex part: plug Molex 502430-8010 Board part: receptacle Molex 502426-8010 6 ears for mechanical alignment, hole diameter 2 mm Stiffener under connector 25 mm x 24.8(?) mm

Flex Status 12 flexes received from Graphic 10 in Oxford 2 in Strasbourg

Issues with Flexes Overetching of lines Assembly QA in Oxford 75  40 micron, sent feedback to Graphic Assembly QA in Oxford

Other Flex Vendors Same design sent for quotation to Cicorel (Switzerland) OptiPrint (Switzerland) Datex Instruments (US) Received quotation from OptiPrint ~£2500 for 20 flexes – same as Graphic

PCB Flex 3 M26 mounted, one bonded Stiffener mounted

Next Steps PCB flex Kapton flex Flex layout Mount and bond another chip 6 Proper readout at Strasbourg Kapton flex Check bonding Check clock propagation Decide how to proceed Flex layout Investigate variations of layout (Pete) Mirrored design Traces under M26 Thinner traces(?) Order from OptiPrint when PCB version is working (?)