LPKF Laser Direct Structuring System Speciality Products and Services Group Electrical functionalisation of non conductive 3D Structures Electrical tracks produced on 3D structures - allowing SMT assembly, die attach, wire bonding etc. LPKF – Laser Direct Structuring of 3D devices. Metallised Fingers for Robotic Hand

LPKF Laser Direct Structuring System Tyndall Fabrication Process 3D Design and drawing. 3D part fabrication. Conductive layer design and drawing. Part Coating – ProtoPaint epoxy layer. Laser Direct structuring as per design. Copper plating Post processing – NiAu plating, Flip chip bonding, SMT, wire bonding etc.

LPKF Laser Direct Structuring System Fabrication Principle

LPKF Laser Direct Structuring System 3D Design In-house 3D design of parts Autocad used to produce .step files which can be imported to LPKF system. Autocad used to produce .dwg files for fabrication in mechanical workshop.

LPKF Laser Direct Structuring System 3D Part Fabrication In-house mechanical workshop fabrication from 3D designs. Parts fabricated from metals or plastic materials. 3D designs can be used to fabricate parts using standard 3D printers

LPKF Laser Direct Structuring System Conductive layer design Autocad produces .stp files with both the 3D part and associated conductive layer. LPKF system used .stp file to laser write the conductive layer on a ProtoPaint epoxy layer which is applied to 3D part surface.

LPKF Laser Direct Structuring System Part Coating – ProtoPaint epoxy layer. Spray coating of 3D part surface. Multiple layer build up to produce a smooth surface finish. Low temperature oven bake to cure epoxy. Coating on conductive and non conductive materials. Possible materials include metals, plastics, glass, FR4 etc.

LPKF Laser Direct Structuring System Laser Direct Structuring – Laser writing LPKF system laser etches the conductor design in the top surface of the ProtoPaint epoxy. The laser removes some of the epoxy material exposing metal particles in the ProtoPaint layer. These metal particles can act as a seed layer for deposition of Cu layer.

LPKF Laser Direct Structuring System Laser Direct Structuring – Protopaint Metal particles exposed by the laser Copper, palladium, Chromium and Magnesium Seed Layer

LPKF Laser Direct Structuring System Copper plating Electroless copper plating of seed layer exposed by laser etching of the ProtoPaint top surface. Layer thickness is a time-temperature dependent build up of copper.

LPKF Laser Direct Structuring System Copper plating

LPKF Laser Direct Structuring System Copper plating Test coupons used to check track resistance and isolation between tracks. Different track and gap widths were designed to look at the effect of this on electrical measurements. Typical track resistance of <1 ohm Typical isolation of > 2K ohm Part Type Plating Thickness Track Resistance Ω Fingers Resistance Ω 200 µm TG 9 µm 0.8 Open Circuit >2000 0.9 1.0 500 µm TG 5 µm 0.5 100 µm TG 6 µm 0.6 3 µm 1.4

LPKF Laser Direct Structuring System Post Processing - Solder Copper plating provides a solderable finish Allowing post process SMT assembly, solder flip chip etc. Solder ball Placement Element ID size x (um) size y (um) SIZE X (inch) SIZE Y (inch) Area 10-4 (inch square) Mil-883-J Requirement (Kg) Measured Shear Force (Kg) SMT 1 1200 500 0.0472 0.0197 9.30 0.37 3.12 SMT 2 2.72 SMT 3 4.12 SMT 4 3.08

LPKF Laser Direct Structuring System Post Processing - Solder Solderable finish allows for in house Laser Assisted Solder Jetting (SB²)

LPKF Laser Direct Structuring System Post Processing - NiAu Plating NiAu Plating on the copper surface Increased solderability Wire bondable finish Bond No. Strength (gf) Military Standard (gf) (1) 5.35 3.00 (2) 6.45 (3) 8.30 (4) 4.55 (5) 5.90 (6) 5.65 (7) 9.10 (8) 4.95 (9) 5.15 (10) 6.20

LPKF Laser Direct Structuring System Post Processing - NiAu Plating

LPKF Laser Direct Structuring System Post Processing - NiAu Plating – Assisted Solder Jetting (SB²)

Demonstrator 1 – Antenna on housing LPKF Laser Direct Structuring System Demonstrator 1 – Antenna on housing Antenna fabricated directly on surface of 3D printed component housing.

Demonstrator 2 – Chemical Sensor LPKF Laser Direct Structuring System Demonstrator 2 – Chemical Sensor PCB Equivalents Flip chip over hole based micro electrode chemical sensor 3D substrate Demonstrator Silicon based Micro electrode arrays. Complete Design and Fabrication in Tyndall Machined plastic substrate Silicon Sensor die

Demonstrator 2 – Chemical Sensor LPKF Laser Direct Structuring System Demonstrator 2 – Chemical Sensor Electrodes Protopaint application Laser Patterning Copper plating Machined plastic substrate Solder flip chip Underfill sealing of sensor

Email: ken.rodgers@tyndall.ie Email: finbarr.waldron@tyndall.ie LPKF Laser Direct Structuring System Contact Information Ken Rodgers Phone: +353 21 2346898 Email: ken.rodgers@tyndall.ie Finbarr Waldron Phone: +353 21 2346093 Email: finbarr.waldron@tyndall.ie