Heat sink analysis: analytically and via ANSYS

Slides:

Advertisements

Similar presentations

Extended Surfaces Chapter Three Section 3.6 Lecture 6.

Advertisements

Conduction Conceptests

Fin Design for Maximum Thermal Dissipation ME 450: Computer Aided Engineering Analysis Instructor: Dr. Nema Group Members: Wei-Yuan Chu, Brad Holtsclaw,

ME 340 Project: Fall 2010 Heat Transfer in a Rice Cooker Brad Glenn Mason Campbell.

Extended Surfaces Chapter Three Section 3.6.

By S Ziaei-Rad Mechanical Engineering Department, IUT.

Chapter 3 Steady-State Conduction Multiple Dimensions

Analysis of PC Chip Heat Sink Design Royce Tatton ME 340 Dr. Solovjov Fall 2006.

Jed Goodell Jesse Williams. Introduction Problem How much heat does a particular heat sink dissipate How many fins are needed to dissipate a specific.

Thermo-fluid Analysis of Helium cooling solutions for the HCCB TBM Presented By: Manmeet Narula Alice Ying, Manmeet Narula, Ryan Hunt and M. Abdou ITER.

MANE 4240 & CIVL 4240 Introduction to Finite Elements Introduction to differential equations Prof. Suvranu De.

CHE/ME 109 Heat Transfer in Electronics LECTURE 12 – MULTI- DIMENSIONAL NUMERICAL MODELS.

Al 2 O 3 Post Combustion Chamber Post Combustion Chamber ANSYS Thermal Model (Embedded Fuel Grain Concept) Outer radius: 1.25” ( m) Inner radius:

Heat sink analysis: analytically and via ANSYS ME 340 Final Project - Dr. Soloviev - Fall 2010 by Mathew Marshal & Kevin Hoopes.

CHE/ME 109 Heat Transfer in Electronics LECTURE 11 – ONE DIMENSIONAL NUMERICAL MODELS.

CHE/ME 109 Heat Transfer in Electronics LECTURE 8 – SPECIFIC CONDUCTION MODELS.

Transient Conduction: The Lumped Capacitance Method

Thermal Analysis Module 6. Training Manual January 30, 2001 Inventory # Thermal Analysis In this chapter, we will briefly describe the procedure.

CHE/ME 109 Heat Transfer in Electronics LECTURE 5 – GENERAL HEAT CONDUCTION EQUATION.

© 2011 Autodesk Freely licensed for use by educational institutions. Reuse and changes require a note indicating that content has been modified from the.

Two-Dimensional Conduction: Flux Plots and Shape Factors

Chapter 4 TRANSIENT HEAT CONDUCTION

by Peter Tu An Engineering Project Submitted to the Graduate

One Dimensional Non-Homogeneous Conduction Equation P M V Subbarao Associate Professor Mechanical Engineering Department IIT Delhi Another simple Mathematical.

1 Calorimeter Thermal Analysis with Increased Heat Loads September 28, 2009.

I-DEAS 11 TMG Thermal and ESC Flow New Features

Non stationary heat transfer at ceramic pots firing Janna Mateeva, MP 0053 Department Of Material Science And Engineering Finite Element Method.

Two Dimensional Steady State Heat Conduction

Transient Thermal Analysis Winter Semester

1 MME3360b Assignment 04 10% of final mark 6 problems, each worth 16.7% of assignment mark Due April 9 th, 2012.

Workshop 7: Thermal Steady State Analysis of a Composite Slab University of Puerto Rico at Mayagüez Department of Mechanical Engineering Modified by (2008):

Two-Dimensional Conduction: Finite-Difference Equations and Solutions

Module 4 Multi-Dimensional Steady State Heat Conduction.

Energy Transport Formal solution of the transfer equation Radiative equilibrium The gray atmosphere Limb darkening.

HOT PLATE CONDUCTION NUMERICAL SOLVER AND VISUALIZER Kurt Hinkle and Ivan Yorgason.

Workshop 6: Thermal Analysis of a Plate with a Hole University of Puerto Rico at Mayagüez Department of Mechanical Engineering Modified by (2008): Dr.

1) Structural Symmetry 2) Bookshelf Problem Jake Blanchard Fall 2009.

Laminar Natural Convection in 2D Glazing Cavities

Chapter 7 External Convection

Develop Epoxy Grout Pourback Guidance and Test Method to Eliminate Thermal/Shrinkage Cracking at Post- Tensioning Anchorages Project Manager Rick Vallier.

9.0 New Features New Coupled-Field Material Property allows Analysis of Peltier Cooling Workshop 6 Thermoelectric Cooler.

9.0 New Features Metal Shaft with Rubber Boot Workshop 7 Load Steps in Workbench.

Convection: Internal Flow ( )

Thermal Analysis Appendix Six. Training Manual General Preprocessing Procedure March 29, 2005 Inventory # A6-2 Basics of Steady-State Heat Transfer.

ME 340 Term Project Winter 2010 Dr. Soloviev Benjamin Parker Cesare Jenkins.

Phase Change Analysis Chapter 9. Training Manual Inventory # March 15, Chapter Overview Phase Change –Terminology –Theory –Material Properties.

Tutorial supported by the REASON IST project of the EU Heat, like gravity, penetrates every substance of the universe; its rays occupy all parts.

Chapter 3 Part 2 One-Dimensional, Steady-State Conduction.

Excel in ME 1-D Transient Heat Conduction Add-in.

Finite-Difference Solutions Part 2

Thermal Analysis Assumptions: Body Temperature (Environment) is 37˚C Heat distribution on outside of device will be modeled via FEA Heat transfer method.

Design and Analysis of Fins with Realistic Boundary Conditions P M V Subbarao Associate Professor Mechanical Engineering Department IIT Delhi Design for.

COUPLED ANALYSES Chapter 7. Training Manual May 15, 2001 Inventory # Fluid-Structure Analysis “One Way” Analysis –Structural deformation effect.

ERT 216 HEAT & MASS TRANSFER Sem 2/ Dr Akmal Hadi Ma’ Radzi School of Bioprocess Engineering University Malaysia Perlis.

Unit 42: Heat Transfer and Combustion Lesson 6: Conduction-Convection Systems.

Chapter Three Sections 3.1 through 3.4

FINITE DIFFERENCE In numerical analysis, two different approaches are commonly used: The finite difference and the finite element methods. In heat transfer.

The Finite Element Approach to Thermal Analysis Appendix A.

Chapter 3: One-Dimensional Steady-State Conduction

TBM thermal modelling status

Extended Surface Heat Transfer

Spencer Ferguson and Natalie Siddoway April 7, 2014

Transient Heat Conduction

What is Fin? Fin is an extended surface, added onto a surface of a structure to enhance the rate of heat transfer from the structure. Example: The fins.

Transient Heat Conduction

Thermal behavior of the LHCb PS VFE Board

Exercises. Introduction to Fins

ANALYSIS OF THE HORN UNDER THERMAL SHOCK – FIRST RESULTS

What are Fins ? Fins are extended surfaces used to increase the rate of heat transfer. It is made of highly conductive materials such as aluminum.

Fourier’s law of heat conduction (one-dimensional) Consider steady state conduction.

Presentation transcript:

Heat sink analysis: analytically and via ANSYS ME 340 Final Project - Dr. Soloviev - Fall 2010 by Mathew Marshal & Kevin Hoopes

Problem definition Intel core i7 processors can dissipate up to 130W under full load They must be kept below 373 K to prevent hardware damage We are given a certain rectangular fin, integral heat sink Find the required convection coefficient to keep the base below 373 K.

Boundary Conditions Base exposed to constant heat input of 130W Sides of base are adiabatic Sides and tops of fins are exposed to convective heat transfer to surrounding atmosphere at 298 K Heat sink is solid Aluminum

ANSYS Solution Define Geometry Apply boundary conditions Mesh Solve

ANSYS Solution Results obtained for initial guess for h Iterated until base temperature reached approximately 373 K h value found to be 37.6 W*K/m^2

Analytical Solution h = 39.8 W*K/m^2

Summary ANSYS Solution – 37.5 Analytical Solution – 39.8

Appendix Analytical Solution ANSYS Log file

*SET,_REMOTE_VIS_ID,'39' /SOL FITEM,2,-6 WPSTYLE,,,,,,,,0 FITEM,2,82 /PREP7 FITEM,2,-83 !DEFINE THE BLOCK !DEFINE ELEMENT TYPE BLC4,0,0,0.042,0.001,0.045 ET,1,SOLID70 FLST,2,1,5,ORDE,1 !MAKE A FIN ET,2,SOLID70 FITEM,2,3 BLC4,0,0.001,0.0021,0.055,0.045 MPTEMP,,,,,,,, !COPY THE FINS MPTEMP,1,0 !DEFINE HEAT FLUX ON BOTTOM OF HEAT SINK FLST,3,1,6,ORDE,1 !DEFINE CONDUCTION COEFICIENT SFA,P51X,1,HFLUX,68783 FITEM,3,2 MPDATA,KXX,1,,250 VGEN,2,P51X, , ,0.004433333, , , ,0 FLST,2,59,5,ORDE,23 FITEM,2,10 FITEM,3,3 FITEM,2,12 /POST1 FITEM,2,-14 FITEM,2,16 FITEM,3,4 FITEM,2,-20 SMRT,6 FITEM,2,22 SMRT,2 FITEM,2,-26 SMRT,1 FITEM,3,5 FITEM,2,28 MSHAPE,1,3D FITEM,2,-32 MSHKEY,0 FITEM,2,34 CM,_Y,VOLU FITEM,3,6 FITEM,2,-38 VSEL, , , , 12 FITEM,2,40 CM,_Y1,VOLU FITEM,2,-44 CHKMSH,'VOLU' FITEM,3,7 FITEM,2,46 CMSEL,S,_Y FITEM,2,-50 VMESH,_Y1 FITEM,2,52 CMDELE,_Y FITEM,3,8 FITEM,2,-56 CMDELE,_Y1 FITEM,2,58 CMDELE,_Y2 FITEM,2,-60 FITEM,3,9 FITEM,2,64 FITEM,2,-65 SOLVE FITEM,2,67 FITEM,3,10 FITEM,2,-81 /GO FLST,2,11,6,ORDE,2 !DEFINE CONVECTION COEFICIENT, THIS IS ITERATED TO OBTAIN THIS SOLUTION FITEM,2,1 FITEM,2,-11 SFA,P51X,1,CONV,37.60,298 VADD,P51X FLST,2,4,5,ORDE,4 FINISH FITEM,2,5