Japan Regional Standards Committee (JRSC) Liaison Report March 2012 Prepared by Junko Collins Venue, Location, Date

Contents JRSC General Information Upcoming Japan TC Meetings Highlights from the last meeting (JRSC SEMICON Japan 2011) 2011 Standards Awards Recipients Staff Change & Contact Information

JRSC General Information JRSC Leadership Masaaki Yamamichi /Chair Person (AIST) Mitsuhiro Matsuda/Chair Person (Hitachi Kokusai Electric) Supika Mashiro /Vice Chair Person (Tokyo Electron) Last Meeting (91st Business Meeting) December 5, 2011 @SEMI Japan, Tokyo Next Meeting (92nd Business Meeting) April 20 (14:00-17:00), 2012 @SEMI Japan, Tokyo Organization Chart See next slide

JRSC (Japan Regional Standards Committee) Organization Chart As of Feb. 8, 2012 Coordination Group JRSC Co-Chair: Masaaki Yamamichi (AIST) Co-Chair: Mitsuhiro Matsuda (HKE) Vice Chair: Supika Mashiro (TEL) FPD Coordination Group Yoshitada Nogami (SK Electronics) Makoto Yamamoto (Muratec Automation) Standardization Process Integration (SPI) Supika Mashiro (TEL) I&C C Takayuki Nishimura (DNS) Mitsutoshi Matsuda (Hitachi Kokusai) Silicon Wafer C Naoyuki Kawai (Tokyo Unv.) Tetsuya Nakai (SUMCO) EHS C Hidetoshi Sakura (Intel) Supika Mashiro (TEL) Moray Crawford (Hatsuta Seisakusho） PV Automation C Terry Asakawa (TEL) Emi Ishikawa （Atelier Ishikawa) M. Ishikawa (Nisshinbo) FPD Meteorology C TBD (Sharp) Ryoichi Watanabe (Toshiba Mobile Display) Yuji Yoda (Otsuka Electronics) PI&C C Shoji Komatsu (Acteon) Tsuyoshi Nagashima (Miraial) Tsutomu Okabe (TDK) Compound Semiconductor Materials C Masayoshi Obara (SHE) TBD Gases & Facilities C Hiromichi Enami (Hitachi High-Technologies Isao Suzuki (MKS Japan) PV Materials C Takashi Ishihara (Mitsubishi Ele.) Masaaki Yamamichi (AIST) Kazuhiko Kashima (Covalent Materials) FPD Factory Automation C Yasunobu Otogawa (Daihen) Harumichi Hirose (Shibaura Mechatronics) Metrics C Toshio Murakami ( Murakami Shoji) TBD Packaging C Kazunori Kato (AiT) Yutaka Koma (Advisor) M. Tsuriya (Consultant) Liquid Chemicals C Hiroshi Tomita (Toshiba) Kenji Sugimoto (DNS) FPD Materials & Components C Hisashi Aruga (Seiko Epson) Tadahiro Furukawa (Kyodo Printing) Yoshihiko Shibahara (FUJIFILM) PV C Hiromu Takatsuka (MITSUBISHI HEAVY INDUSTORIES) Kazuhiko Kashima (Covalent Materials) Terry Asakawa (TEL) Masaaki Yamamichi (AIST) Traceability C Yoichi Iga (Renesas Ele.) Tsunobuchi Hirokazu (Keyence) Test C Hiroshi Kaga (Renesas Electronics) Takashi Umenaga (Teradyne) Micropatterning C Iwao Higashikawa (Toshiba) FPD Mask C Atsushi Okazaki (SK-Electronics) Kaname Nitobe (HOYA)

Upcoming Japan TC Meetings (Mar. – Apr.) As of March 27 Event / Meeting Name Event Type Contents Silicon Wafer C Meeting TC March 6, 2012 SEMI Japan, Tokyo Korea FPD Metrology C Meeting March 7, 2012 Seoul, Korea Gases and Facilities C Meeting March 23, 2012 Europe PV Standards Meetings TF/TC March 27-28, 2012 Berlin, Germany (PV Fab Forum) NA Standards Spring 2012 Meetings April 2 -5, 2012 SEMI Headquarters in San Jose, CA PV/ PV Materials C Meeting April 10, 2012 Metrics C Meeting April 11, 2012 PV Automation C Meeting Mircopatterning C Meeting April 12, 2012 Korea I&C C Meeting April 13, 2012 PI&C C Meeting Liquid Chemical C Meeting Information & Control C Meeting April 19, 2012 EHS C Meeting Traceability C Meeting April 26, 2012 FPD Materials & Components C Meeting April 27, 2012 For more information  http://www.semi.org/en/node/9051 Staff Report - Feb 2012

Highlights from the last meeting (JRSC SEMICON Japan 2011) Membership Change JRSC： M. Yamamoto (Muratec Automation) stepped down and M. Matsuda (Hitachi Kokusai Electric) was assigned as new co-chair. Metrics: M. Furukawa (ShinEtsu Polymer) stepped down. Packaging: H. Tabata (Osaka Univ.) stepped down and M. Tsuriya (Consultant) was assigned as new co-chair. PV Automation: M. Ishikawa (Nisshinbo) was assigned as new co-chair. SPI TF LOA limbo situation Proposed to Reg. SC to change the Regulations. (It is discussed among Reg. SC members.)

2011 Standards Awards Recipients SEMI Japan Standards Award JRSC Honor Award Haruo Tabata Osaka University Mitsune Sakakoto Tokyo Electron Mikio Furukawa ShinEtsu Polymer Makoto Yamamoto Muratec Automation

2011 Standards Awards Recipients JRSC Special Award International Collaboration Award Yuji Yoda Otsuka Electronics Masataka Uchidoi Panasonic Minoru　Kagino Toshiba Takashi Ishihara Mitsubishi Electric Keizou Ochi Konica Minolta Sensing Ryoichi Watanabe Toshiba Mobile Satoshi Nakada Sony

Staff Change & Contact Information A. Yamamoto to transfer to PV Department N. Tejima to be transferred from Program Department New Staff responsibilities will be effective in the end of April. Junko Collins Sr. Manager, Standards, EHS & Advocacy jcollins@semi.org 81-3-3222-5819 Operations General Information Committees: JRSC (including SPI TF), Compound EHS, SIGs Naoko Tejima Manager, Standards ntejima@semi.org Committees: EHS, Gases & Facilities, Liquid Chemical, Packaging, Micropatterning, FPD FA, FPD M&C, FPD Metrology, FPD Mask Chie Yanagisawa Sr. Coordinator, Standards cyanagisawa@semi.org Committees: I&C, Metrics BOSS Publication, SEMIViews Hirofumi Kanno Sr. Coordinator, Standards hkanno@semi.org Committees: Silicon Wafer, PI&C, Traceability, PV, PV Automation, PV Materials, Test, SPI TF STD Membership, Web Contents Manager Red: responsibility newly assigned

Overall TC Updates from SJ2011

Org. Name Information Last Meeting: Dec. 9, 2011 (SJ2011) EHS Committee Last Meeting: Dec. 9, 2011 (SJ2011) Next Meeting: SEMI Japan Standards Spring 2012 Meetings Thursday, April 19, 2012 10:00-17:00 SEMI Japan, Tokyo, Japan S19 Revision Task Force: disbanded Technical Ballot Action: 4976A Revision to SEMI S13-0305, Environmental, Health and Safety Guideline for Documents Provided to the Equipment User for Use with Semiconductor Manufacturing Equipment Failed 4712A New Standard: Guide for F-GHG (Fluorinated Greenhouse Gas) Emission Characterization and Reduction Failed 5323 Reapproval of SEMI S21-1106E, Safety Guideline for Worker Protection Passed as balloted Technical Ballots Expected for Review near future 4976B: Revision to SEMI S13-0305, Environmental, Health and Safety Guideline for Documents Provided to the Equipment User for Use with Semiconductor Manufacturing Equipment As early cycle as possible, by S13 Revision Task Force 4712B: New Standard: Guide for GHG (Greenhouse Gas) Emission Characterization As early cycle as possible, by GHG Emission Characterization TF TBD: Reapproval of SEMI S16-0307, Guide for Semiconductor Manufacturing Equipment Design for Reduction of Environmental Impact at End of Life C1-11, by EHS Committee NARSC Report - February 2012

Org. Name Information Last Meeting: Dec. 6, 2011 (SJ2011) Facilities & Gases Last Meeting: Dec. 6, 2011 (SJ2011) Next Meeting: March 23, 2012 15:00-17:00 @SEMI Japan, Tokyo, Japan (SEMI Japan Standards Spring 2012 Meetings) New SNARF Reapproval of SEMI F44-0307, Specification for Machined Stainless Steel Weld Fittings by the TC Reapproval of SEMI F45-0307, Specification for Machined Stainless Steel Reducing Weld Fittings by the TC Technical Ballots Expected for Review near future 5026C: Revision to SEMI F1-96, Specification for Leak Integrity of High-Purity Gas Piping Systems and Components C1-12, by F1 Revision Task Force TBD: Reapproval of SEMI F44-0307, Specification for Machined Stainless Steel Weld Fittings C1-12, by Gases and Facilities Committee TBD: Reapproval of SEMI F45-0307, Specification for Machined Stainless Steel Reducing Weld Fittings C1-12 Gases and Facilities Committee Liquid Chemicals Last Meeting: Dec. 6, 2011(SJ2011) Next Meeting: April 13, 2012 15:00-17:00 @ SEMI Japan, Tokyo, Japan (SEMI Japan Standards Spring 2012 Meetings) New Standard: Test Method for Tensile Strength Applied to Welded Connections Made by PFA Weld Fitting by Welding Fitting Task Force 5067A: New Standard, Test method for Particle Removal Performance of Liquid Filter with Mono-dispersed Polystyrene Latex (PSL) Beads C1-12, by Liquid Filter Task Force 5225: New Standard: Test Method for Counting Efficiency of Liquid-borne Particle Counter for which the Measureable Particle Size is Smaller than 100 nm C1-12, by Liquid-borne Particle Counter Task Force NARSC Report - February 2012

Org. Name Information Last Meeting: Dec. 9, 2011 (2011) I&C Last Meeting: Dec. 9, 2011 (2011) Next Meeting: April 19, 13:30 to 17:00 @SEMI Japan Office, Tokyo (SEMI Japan Standards Spring 2012 Meetings) Technical Ballot Action: 5194: Revisions to SEMI E5-0611E, SEMI Equipment Communications Standard 2 Message Content (SECS-II). Correcting some errors All 4 line items passed as balloted 5227: Reapproval of SEMI E82-1106, Specification for Interbay/Intrabay AMHS SEM (IBSEM) Passed as balloted (Super clean) 5228 Reapproval of SEMI E88-0307, Specification for AMHS Storage SEM (Stocker SEM) Passed as balloted (Super clean) TFOF/SNARF Equipment Information System Security (EISS) Task Force /Leader: M. Sakamoto (TEL) 5367:Line item revision to E87-0709, SPECIFICATION FOR CARRIER MANAGEMENT (CMS). Load Port Transfer Error Indication by GEM300 TF. 5368: Reapproval of SEMI E118-1104E, SPECIFICATION FOR WAFER ID READER COMMUNICATION INTERFACE — The WAFER ID READER FUNCTIONAL STANDARD: CONCEPTS, BEHAVIOR AND SERVICE and SEMI E118.1-1104 SPECIFICATION FOR SECS-I AND SECS-II PROTOCOL FOR WAFER ID READER COMMUNICATION INTERFACE STANDARDS by I&C Committee Sensor Bus TF New task force. /Leader H. Ogihara 5369: Sensor Bus TF Revision to SEMI E54.17-0706 (Reapproved 1211) SPECIFICATION OF SENSOR/ACTUATOR NETWORK FOR A-LINK by Sensor Bus TF Technical Ballots Expected for Review near future 5368: Reapproval for SEMI E118-1104E, SPECIFICATION FOR WAFER ID READER COMMUNICATION INTERFACE — The WAFER ID READER FUNCTIONAL STANDARD: CONCEPTS, BEHAVIOR AND SERVICE and SEMI E118.1-1104 SPECIFICATION FOR SECS-I AND SECS-II PROTOCOL FOR WAFER ID READER COMMUNICATION INTERFACE STANDARDS Cycle 2-12, by I&C Committee 5369: Revision to SEMI E54.17-0706 (Reapproved 1211) SPECIFICATION OF SENSOR/ACTUATOR NETWORK FOR A-LINK Cycle 2-12, by Sensor Bus TF NARSC Report - February 2012

Org. Name Information Last Meeting: Dec. 8, 2011 (SJ2011) Silicon wafer Last Meeting: Dec. 8, 2011 (SJ2011) Next Meeting: March 6, 2012 13:00-17:00 @SEMI Japan Office, Tokyo (SEMI Japan Standards Spring 2012 Meetings) Technical Ballot Action: 5034 Revision of SEMI M71-0310, Specification for Silicon-on-Insulator (SOI) Wafers for CMOS LSI Failed 4766A Revision to SEMI M52-0307 with title change to: Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130 nm to 11 nm Technology Generations Passed as balloted 4846B New Standard: Test Method for Analyzing Organic Contaminants on Silicon Wafer Surfaces Failed 5253A Revision of SEMI M49-0311, Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 22 nm Technology Generation Passed with editorial changes 5321 Revision to SEMI M24-0307, Specification for Polished Monocrystalline Silicon Premium Wafers Line Item 1 Passed with editorial changes 5322 Revision to SEMI M61-0307, Specification for Silicon Epitaxial Wafers with Buried Layers All 3 lineitems passed as balloted SNARF Revisions to SEMI M80-1111, Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers by Int'l 450mm Shipping Box Task Force Technical Ballots Expected for Review near future 5251 Revision of SEMI M1, Specifications for Polished Single Crystal Silicon Wafers (Re:Addition of node-specific guides) C1-12, by Int'l Polished Wafers Task Force 5342 Revision to M62-1011 Specifications for Silicon Epitaxial Wafers (Addition of 450 mm wafer to Table R2-8 Epi wafer guide for 22nm technology Generation) C1-12, by Int'l Epitaxial Wafers Task Force 5034A Revision of SEMI M71-0310, Specification for Silicon-on-Insulator (SOI) Wafers for CMOS LSI C1-12, by Int'l SOI Wafers Task Force 5029B Revision to SEMI M51-0303, with title change from: Test Method for Characterizing Silicon Wafers by Gate Oxide Integrity to: Test Method for Time Zero Dielectric Breakdown Characteristics of SiO2 Films for Silicon Wafer Evaluation C1-12, by Test Method Task Force NARSC Report - February 2012

Org. Name Information Last Meeting: Dec. 9, 2011 (SJ2011) PI&C Last Meeting: Dec. 9, 2011 (SJ2011) Next Meeting: April 13, 2012 @SEMI Japan Office, Tokyo (SEMI Japan Standards Spring 2012 Meetings) Technical Ballot Action: 5205 Revision to SEMI E154-1110, Mechanical Interface Specification for 450 mm Load Port Passed with editorial changes SNARF 5363 Removal of SEMI E31-0093: Specification for Electrical Interface, Japan Only by Global PIC Maintenace TF 5364 Revision to SEMI E162-1111: Mechanical Interface specification for 450mm Front-Opening Shipping Box Load Port by 450 IPIC TF Both have been Submitted to Cycle 1, 2012. NARSC Report - February 2012

Org. Name Information PV Automation Last Meeting: Dec. 6, 2011 (SJ2011) Next Meeting: April 12, 14:00-17:00 @SEMI Japan, Tokyo, Japan (SEMI Japan Standards Spring 2012 Meetings) New Co-Chair Makoto Ishikawa (Nisshinbo Mechatronics) PV Materials Next Meeting: April 12, 2012 10:00-12:00 @ SEMI Japan, Tokyo, Japan (SEMI Japan Standards Spring 2012 Meetings) Metrics Last Meeting: Dec. 8, 2011 (SJ2011) Next Meeting: April 11 @ SEMI Japan, Tokyo, Japan (SEMI Japan Standards Spring 2012 Meetings) Traceability Last Meeting: Dec. 7, 2011 (SJ2011) Next Meeting: April 26 @ SEMI Japan, Tokyo, Japan (SEMI Japan Standards Spring 2012 Meetings) New Task Force Japan PV Traceability Task Force Leaders: Hirokazu Tsunobuchi / Keyence, Yoichi Iga / Renesas Electronics SNARF 5361 Reapproval of SEMI T17-0706, Specification of Substrate Traceability by 5 Year Review TF 5362 Reapproval of SEMI T18-1106, Specification of Parts and Components Traceability by 5 Year Review TF 5365 Revision to T15-0705, General Specification of Jig ID: Concept by JIG and Unit Package ID TF TBD Revision of G83: Specification for Bar Code Marking of Product Packages; add 83.1 for Reduce Space Marking of Product Packages by JIG and Unit Package ID TF All those documents will be submitted for Cycle2, 2012 NARSC Report - February 2012

Thank you for your attention!

Back-up Venue, Location, Date

PV Japan 2011 Seminar/Workshop Workshop on SEMI Standards related to Horizontal Communication between PV Equipment － In pursuit of establishment of global standards on communication interface between adjacent equipment and different field buses － Date: Tue., December 6 13:00–16:00 No Interpretation Venue: Room 303, 3F, Int'l Conference Hall, Makuhari Messe Program Co-Chairs: Makoto Ishikawa, Nisshinbo Mechatronics Takashi Murakami, Tokyo Electron FE Topics Merits gained from standardization Overview of SEMI standards on communication between PV equipment, which are under development Demonstration for communication The latest developments of SEMI standards activities

SEMICON Japan 2011 Seminar/Workshop Seismic Protection and SEMI Safety Guidelines - Seismic protection in SEMI S2/ S17/ S26 and application of SEMI S12 to decontamination of equipment after earthquake Date/Time: Wed., December 7 13:00–17:00 Location: Room 302, 3F, Int'l Conference Hall, Makuhari Messe Program Chair: Hidetoshi Sakura, Intel Supika Mashiro, Tokyo Electron Topics: Seismic protection design section in SEMI S2/ S26 and S17 Case study Application of SEMI S12 to decontamination of equipment after the earthquake

SEMICON Japan 2011 Seminar/Workshop STEP/450: SEMI Standards Technical Education Program on 450 mm Wafer Date: Fri., December 9 13:00–16:45 Venue: Room 302, 3F, Int'l Conference Hall, Makuhari Messe Program Chair: Shoji Komatsu, Acteon Topics 450mm Semiconductor Manufacturing Transition Tom Jefferson, ISMI Overall Concepts of 450mm SEMI Standards Shoji Komatsu, Acteon Corporation Basics of SEMI Standards(G88) on 450mm Packaging Process Sumio Masuchi, DISCO CORPARATION 450mm Silicon Wafers Status Update Mike Goldstein, Intel Corporation Explanations for 450mm FOUP (E158) and MAC (E159), FOSB Tsuyoshi Nagashima, Mirial Co., Ltd. Explanations for 450mm FOUP/ FOSB Load Port(E154) Tsutomu Okabe, TDK Corporation 450mm Process Module Physical Interface Standard Activity Supika Mashiro, TOKYO ELECTRON LTD.

JRSC Planning Meeting 2011 Date: August 26 (Fri.) @ SEMI Japan office JRSC Business Meeting (10:00-12:00) Luncheon & Leadership Training (12:15-13:15) 38 attendees Essential points of Revised Regulations (June, 2011) and Revised PG (July, 2011) Planning Meeting (13:30-17:00) Theme: How can SEMI International Standards Program be self-sustainable? What business model can secure SEMI International Standards Program? 31 participants divided 3 groups for discussion Lively discussion with many comments