Non-Arc Welding Processes Resistive heating, chemical reactions, focused light and electrons, sound waves, and friction can also be used to join materials.

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Presentation transcript:

Non-Arc Welding Processes Resistive heating, chemical reactions, focused light and electrons, sound waves, and friction can also be used to join materials –Resistance welding –Oxy-Fuel Welding –Friction welding (&Solid State) –Laser and electron beam welding –Brazing and soldering –Plastics joining –Adhesive bonding Introduction

Adhesives Thermosets form long polymer chains by chemical reaction (curing) –Heat is the most common means of curing –Ultraviolet light, oxygen - acrylics –Moisture - cyanoacrylates Thermoplastics (hotmelts) –Adhesive is heated until it softens, then hardens on cooling -Polyethylene, PVC T

Curing of Adhesives Thermosets form long polymer chains by chemical reaction (curing) –Heat (epoxy) –Ultraviolet light, oxygen (acrylics) –Moisture (superglue) Adhesive Bonding

Stress Modes - Best to Worst 4. Peel 5. Cleavage 2. Shear1. Compression3. Tension T

Why Adhesive Bonding? Dissimilar materials –Plastic to metal Materials that can be damaged by mechanical attachments Shock absorption or mechanical dampening Laminate structures –Skin to honeycomb structure Adhesive Bonding

Adhesive Selection Adhesive selection is based primarily on –Type of substrate –Strength requirements, type of loading, impact requirements –Temperature resistance, if required Epoxy Cyanoacrylates Anaerobics - metals Urethanes Silicones Pressure sensitive adhesives (PSAs) Adhesive Bonding

Advantages Joining dissimilar materials - plastic to metal Materials that can be damaged by mechanical attachments Blind joints Shock absorption or mechanical dampening Temporary alignment Laminated structures Thin substrates - skin-to-honeycomb construction Stress distribution T

Limitations Adhesives dont do work, they distribute work; they are not structural materials Environmental degradation –Temperature –Oxidation Difficult to repair Curing or setting time Surface preparation Adhesive Bonding