Presented To: Customer Name Company Name Rev 09.10.08

ECMG At a glance Business created in CY 2001 Major focus on printed circuit boards Represent six (6+) complementary China based PCB fabricators Five (5) offices in North America, two (2) in Europe and one (1) in Asia Seven (7) outside sales, Three (4) quotation analysts, Three (3) CSRs; Fourteen (14) employees total ECMG is atypical of most electronics representatives Provide Global coverage for customers and Principals alike

ECMG’s Principals Guang Dong Ellington Electronics Technology Co. ,Ltd Complementary Principals with minimal overlap in product offering, becase we know no one shop can build all technology. Focused on rigid printed circuit boards (All China based) Guang Dong Ellington Electronics Technology Co. ,Ltd Ellington 2 to 12 layer Low-med. Tech (LMHV) Large volume Shenzhen Sun&LYNN Circuits Electronic Co. ,Ltd Sun & Lynn 2 to 12 layer Low-med tech HMLV (low MOV) Shenzhen Fastprint Circuit Technology Co Ltd SFPC up to 50 layer All technologies, time critical/QTA Shop BoardTek Electronic Corporation BoardTek 2 to 26 layer Hi tech, Exotic Material, HDI & Metal Backed Shenzhen Desow Technology Co. ,Ltd Desow SS to 28 Layers HMLV PCB & FPC Shenzhen Shennan Circuits Co., Ltd. Shennan 2 to 42 layer Hi tech, heavy Cu, XL format HD-FLEX TECHNOLOGY CO., LTD H-D Flex 1 to 8 layer LMLV FLEXIABLE PCBS Tat Chun Printed Circuit Board Co., Ltd. Tat Chun SS to 6 layer Low tech/hi volume Extensive due diligence and customer feedback, world class pricing and quality

ECMG’s Other Sources Other Items sourced in China LCD/LCM PCBA & Sub-Assembly Cable Assemblies Sheet metal & Stamping Plastic Injection Modeling CNC machines tooling Full Box build assembly Heat Sinks & RFI Shields Antennas Cable Assemblies: Semi-Rigid RF Cables and Flex RF Cables Earphones Medical Cables Wire Harnesses Wireless and Mobile Antennas Fiber Optical Turnkey Solutions / System Integrations: Electro-Mechanical Assemblies Box Build and Sub-Systems Engineering Services Surface Mount and Through Hole Capability

How is ECMG different? PCB experts Significant investment in hardware and software Centralized hub for quoting, order entry/status and technical queries Global footprint Maintain own ftp site for large data package upload and dissemination to principals Direct sales/sales affiliate combination equates to 30+ sales people globally ECMG has an employee based in China

The ECMG Advantage Our Principal’s missions are to provide customers with the highest quality products at world class prices ECMG’s mission is to provide a world class link between our Principals and our customers Asian pricing/ with domestic expertise. Ability to deal with customers during the day in local language and the factories at night “A Western face with Eastern advantages”

The ECM Group, LLC Global Footprint Europe Headquarters The ECM Group, LLC Castrum House Lechner Ödön fasor 3, B 8/2 1095 Budapest Hungary Tel     +36 1 7898532 Fax    +36 1 8012558 Montreal, PQ (2) Budapest , HU (3) St. Louis, MO (6) Longmont , CO (1) New England Area (2) Hong, Kong CN (1) Philippines (4) Asia Pacific Headquarters The ECM Group, LLC 2nd Floor, FCIE Fire Station Bldg First Cavite Industrial Estate Brgy. Langkaan, Dasmarinas Cavite 4114 Philippines Phone: +6346-402-0984 Fax: +6346-402-0391 N. America Headquarters The ECM Group, LLC 7 Document Drive St. Louis, MO. 63144 Tel: 314-961-7400 Fax: 314-997-4606 info@theecmg.com Index

ECMG Major Customers

Ellington Electronics Technology Co., Ltd.

Ellington Electronics Technology Co., Ltd. Location No. of Employees Years in business Capabilities Capacity Approvals Zhongshan, Guangdong, PRC 7000 6 Double-sided and Multi-layer to 12 FR1, FR2, CEM1, CEM3, FR4 HAL, Ni/Au plating, OSP ENIG, immersion silver Carbon paste surface print Peelable mask Single-sided PTH HDI, Laser Drilling 2,000,000 SqFt. per month ISO 9001, 14001, TS 16949

Ellington Electronics Technology Co., Ltd. Items Production Prototype(<35ft 2 ) Panel Size 22 ” × 27 ” 24 ” × 30 “ Max Layer Counts 20 24 Board Thickness (max) 0.25 ” 0.25 “                                 (min) 0.012 “ 0.010 ” Core Thickness(min) 0.003 “ 0.002 “ Drill Size Mechanical (min) 0.008 ” 0.006‘' Drill Size Laser(min) 0.004 ” Aspect Ratio 0.334027778 0.500694444 Line Width Spacing 1/3 oz (outer) 3.5mil/3.5mil 3mil/3mil Line Width Spacing 1/2 oz (inner) 2.5mil/2.5mil Layer to Layer Registration 0.003 ” Soldermask Plug Hole Hole Diameter: 24mil Hole Diameter: 32mil Min Soldermask Dam 0.004 “ Impedance Control (50/60/70/100/110/120)+/-10% (50/60/70/100/110/120)+/-8% Multilayer : Copper Weight (inner) (outer) 4oz 5 oz   3oz Double Side: Copper Weight 5oz 6oz Buried Via Yes Blind Via Rambus 28 Ohm +/-10% 28 Ohm ± 8% HDI 1+N+1 4mil Via hole 2+N+2 4mil Via hloe Items Production Prototype(<35ft 2 ) Surface Finishing  HASL   Selective immersion gold plating     Entek  HASL  Immersion Gold v Flash Gold   Contact Finger Gold Plating   Glicoat  Carbon Ink  Immersion Gold   Immersion Sliver  Flash Gold  Immersion Tin  Contact Finger Gold Plating Green Technology  OSP  Laminate for lead-free processing  Immersion Gold  Halogen free material  Immersion Silver Rev 06.30.08

SHENZHEN SUN & LYNN CIRCUIT CO., LTD

SHENZHEN SUN & LYNN CIRCUIT CO., LTD Location No. of Employees Years in business Capabilities Capacity Approvals Bao An region of Shenzhen 1700 10 Double-sided and Multi-layer to 12 FR1, FR2, CEM1, CEM3, FR4 HAL, Ni/Au plating, OSP ENIG, immersion silver Carbon paste surface print Peelable mask Single-sided PTH 700,000 SqFt. per month ISO 9001, 14001, TS 16949

Shenzhen Fastprint Circuit Technology Co., LTD. Largest QTA/Proto/small volume shop in China 24 hour to 7 day turns

Shenzhen Fastprint Circuits Co., LTD. Location No. of Employees Years in business Capabilities Capacity Approvals Shenzhen, Guangdong, PRC 300 18 Material: FR4,Halogen Free, Different material mixing laminating Max panel size: 23inch*35inch The standard PCB thickness: 8.3-220mil Max Aspect Ratio:1:12.5 Min layer by layer spacing: 2mil Min track width/ gap 3/ 3mil Min pad size: 16mil Surface finishes HASL, Flash Gold, Immersion Gold, Gold finger, OSP Gold Fingers : Ni/Au plated: (Ni>5um, Au>0.75um) Select immersion Ni/Au or Chemical : Ni/Au: Ni>4um, Au>0.05um Flash gold plated: Ni>5um, Au>0.075um Solder mask thickness: 9 +/- 2 um OSP(ENTEK) thickness: 0.30-0.16um  Via holes of Solder mask Via holes solder mask covered. Via holes of BGA solder mask plugged, No Sn/Pb in the via holes. Impedance Control PCB Controlled Impedance tolerance: up to 50Ω +/- 5 Ω; over 50 Ω +/- 10% 100,000 SqFt. per month, 4000 new jobs tooled monthly ISO 9001, 14001,

Shenzhen Shennan Circuits Co., LTD.

Shenzhen Shennan Circuits Co., LTD. Location No. of Employees Years in business Capabilities Capacity Approvals Shenzhen, Guangdong, PRC 800 22 Double-sided to Multi-layer up to 42 Large format backplanes up to 0.300” FR1, FR2, CEM1, CEM3, FR4, RCC Mixed Materials, high frequency, Aluminum backed PCBs HAL, Ni/Au plating, OSP Immersion Gold Plating HDI microvia blind and buried Controlled Impedance One of first IPC members in China Peelable mask Single-sided PTH 750,000 SqFt. per month ISO 9001, 14001, TS 16949, TL 9000

Tat Chun PCB Co., Ltd. Begin with a strong opening, relevant to the topic and your audience. Appeal to your audience’s interests. Your energy and attitude set the tone and provide momentum for the meeting. Facilitation is a process that helps people communicate and work together. Establish an open environment conducive to problem solving and change.

Tat Chun PCB Co., Ltd. Location No. of Employees Years in business Capabilities Capacity Approvals Zhongshan, Guangdong, PRC 2500 18 Single-sided & Double-sided, Multi-layer up to 6 XPC, FR1, FR2, CEM1, CEM3, FR4 HAL, Ni/Au plating, OSP Immersion Gold Plating Carbon paste surface print Silver through hole Peelable mask Single-sided PTH 3,000,000 SqFt. per month ISO 9001, 14001, TS 16949

H-D Flex Technology Co., LTD.

H-D Flex Technology Co., LTD. Location No. of Employees Years in business Capabilities Capacity Approvals Doumen, Guangdong, PRC 400 3 Single Sided, double sided, multi layer flexible circuits and multi layer rigid flex PCBs Number Of Layer Flexible 1~8 Rigid-Flex 2~10 Material PI PET FR-4 BT Copper Thickness 1/3oz 1/2oz 1oz max 2oz Min Board thickness 2mil Max. Board Thickness 126mil Max Panel Size 18 X 24inch (460mm x 616mm) Min. Trace line width and spacing Single Sided 2mil / 2mil Double Sided 3mil / 3mil 4 Layers 3mil / 3mil 6 Layers 3mil / 3mil 8 Layers 3mil / 3mil Min. Hole Diameter 0.05mm(2mil) Punching 0.30mm(12mil) 240,000 SqFt. per month ISO 9001-2000, ISO 14000

H-D Flex Technology Co., LTD. Location No. of Employees Years in business Capabilities Capacity Approvals Doumen, Guangdong, PRC 400 3 Single Sided, double sided, multi layer flexible circuits and multi layer rigid flex PCBs Number Of Layer Flexible 1~8 Rigid-Flex 2~10 Material PI PET FR-4 BT Copper Thickness 1/3oz 1/2oz 1oz max 2oz Min Board thickness 2mil Max. Board Thickness 126mil Max Panel Size 18 X 24inch (460mm x 616mm) Min. Trace line width and spacing Single Sided 2mil / 2mil Double Sided 3mil / 3mil 4 Layers 3mil / 3mil 6 Layers 3mil / 3mil 8 Layers 3mil / 3mil Min. Hole Diameter 0.05mm(2mil) Punching 0.30mm(12mil) 240,000 SqFt. per month ISO 9001-2000, ISO 14000

BoardTek Electronic Corporation Multilayer PCB - BoardTek's main product. To differentiate with most of the PCB shop in Taiwan or Asia, BoardTek take a lot of effort in R&D to fulfill our customer's needs! BoardTek provide higher layer count, blind/buried vias, high performance material, heavy copper foil, impedance control, edge plating, multi-tier, castellation… into traditional multilayer PCB. High performance laminate material BoardTek can process various material for different application. It includes High Tg, low Dk, low loss, low water absorption like GETEK, Polyimide, Cyanate ester, BT, PPE, and many others. We also specialize in mix-dielectric (or hybrid dielectric) multilayer (Please refer to RF/microwave PCB) High speed circuits or impedance control PCB BoardTek worked for high speed module like Rambus memory module (RIMM) for many years. We can control the circuit characteristics in single-ended as well as differential impedance control with very tight tolerance (see below). For some application like RIMM, we also control the delta impedance (ΔZ0), propagation delay (Tpd), and ΔTpd by monitor the laminate dielectric constant and thickness. Blind/buried via PCB For high density PCB application, BoardTek can build multilayer board by sequential lamination and laser via (please refer to Microvia PCB ) Heavy copper BoardTek can process multilayer PCB with very thick copper foil in inner or outer layer for high power PCB application. High layer count BoardTek keep working with our customer in high layer count multilayer PCB. To improve the layer-to-layer registration, we installed the pin lamination system for this purpose. BoardTek is also plan to setup a new wet process line to increase the board thickness up to 0.25" or even higher. Others: Laminate material: FR-4, high Tg FR-4, FR-5, GETEK, BT, Polyimide, PPE, PTFE(Teflon), Polyester (GIL), Cyanate ester, Green laminate (halogen free), Ohmega-ply, Resin coated copper foil (RCC), Thermal clad, T-clad Surface finishing: HASL, OSP, immersion Ni/Au, bondable Ni/Au, immersion Ag, immersion Sn Special offer: Castellation, multi-tier, pin insertion, selective plating, press-fit, edge plating… Charlotte Ku BoardTek Electronic Corporation TEL: 886-3-4839611 EXT,1411 FAX: 886-3-4839620 E-MAIL: charlotte@mail.boardtek.com.tw Click on picture for PDF brochure

BoardTek's Capability Specification Standard Critical Layer count 2~22 28~32 Minimum Line/space 4/4 3/4 Minimum innerlayer core thickness 0.004" 0.003" Minimum finished hole size (Mechanical drilling) 0.008" 0.006" Minimum finished hole size (Laser drilling) Maximum aspect ratio (conventional) 6:1 10:1 Maximum aspect ratio (laser via) 0.5:1 0.7:1 Hole size dimension tolerance +/-0.003" +/-0.002" Minimum pad size (mechanical drilling) 0.018" 0.016" Minimum pad size (laser drilling) 0.014" 0.012" Maximum board thickness 0.250" 0.275" Minimum board thickness (2L) 0.010" 0.005" Minimum board thickness (4L) Minimum board thickness (6L) 0.022" Minimum board thickness (8L) 0.028" 0.024" Maximum copper foil thickness (IL) 4 oz 5 oz Maximum copper foil thickness (OL) 8 oz Impedance control tolerance +/-10% +/-6% Maximum panel size 18" x 22" 22" x 28" Contour routing dimension tolerance +/-0.005" Depth control routing tolerance +/-0.004"

ECMG Contact Information Name Title Employee First Name Middle Initial Employee Last Name Nick Name/AKA Company Name Division Title Mr. Kevin C. Arns KC The ECM Group, LLC. Electronics Division President/Principal Paul S. Director of Operations Oscar   Cabahug Inside Sales/Technical Service Ms. IVYMAE CONCHAS Ivy Inside Sales/Customer Service Dundee A Espina Cocoy Asian Sales Manager Timothy Esposito Tim Venture Group VP of Business Development Brenda M. Hampton Corporate Controller Mrs. Susan E. Hledin Sue Inside Sales Manger Anne Keating Customer Service Christopher Chris European Sales Manager Michael Mike European Account Manager Arturo H. Lopez Art Vanessa Martinez Robert J. Mills Bob Daniel R. Pontis Dan Director of Sales - West USA Bipin G. Shah

ECMG Principal Contact Information Tat Chun: Dominic Leung Tat Chun Printed Circuit Board Co., Ltd. 31/F., Aitken Vanson Centre, No. 61 Hi Yuen Road, Kwun Tong, Kowloon, Hong Kong. Tel: +852 3579 6017 Fax: +852 2415 3158 Mobile: +852 9228 6593 / +86 136 5238 4229 Email: dominicleung@tatchunpcb.com.hk Ellington Mr David Ng Guangdong Ellington Electronics Technology Co. Ltd. 88 Gaoping Industrial Zone, Sanjiao town of Zhongshan City, Zhongshan Guangdong province China 528445 Tel. +86-760-540-9988 Email: david.ng@ellingtonpcb.com Shennan: Jackie Sun Sales and Marketing Department Shenzhen Shennan Circuits Co., Ltd. The CATIC Shahe Industrial Zone, Shenzhen, 518053, China Tel:        86-755-8610 6462  86-755-8609 5314 Fax:        86-755-8609 5224 Cell Phone: 86-13480616906 Website:    www.shennan.com.cn E-mail:     jackie@shennan.com.cn SFPC: Mrs. Tracy Leung  Sales Engineer Shenzhen Fast-print Circuit Tech Co., Ltd is TEL: +86-755-26073471 FAX:+86-755-26074417 or +86-755-26074446 E-mail: ossales2@chinafastprint.com HD FLEX: Ms Shouyan Xu (Megan) Sales Engineering HD-FLEX TECHNOLOGY CO., LTD Zhufeng Road, Qian Wu Town Doumen District Zhuhai City, Guangdong Province China shouyan.xu@hd-flex.com shouyan1111@126.com MSN:shouyan1111@hotmail.com skype:shouyan1111@hotmail.com Phone: 86 756 3933780-227 Fax: 86 756 3933778 WWW.HD-FLEX.COM 　Email： HD-FLEX@HD-FLEX.COM Sun & Lynn PCB Nancy Li SHENZHEN SUN & LYNN CIRCUIT CO., LTD Sun & Lynn industrial zone, Jin Xiu Heyi, shajing town Bao'an District ,Shenzhen ,Guangdong province, China 518128 Tel：+86-755-27280399 Fax：+86-755-27507268 E-mail: nancy@slpcb.net www.slpcb.com

ECMG Secondary Offerings Information on all items below can be sent upon request: Other Items sourced in China LCD/LCM PCBA & Sub-Assembly Cable Assemblies Sheet metal & Stamping Plastic Injection Modeling CNC machines tooling Full Box build assembly Heat Sinks & RFI Shields Antennas Cable Assemblies: Semi-Rigid RF Cables and Flex RF Cables Earphones Medical Cables Wire Harnesses Wireless and Mobile Antennas Fiber Optical Turnkey Solutions / System Integrations: Electro-Mechanical Assemblies Box Build and Sub-Systems Engineering Services Surface Mount and Through Hole Capability

Thank You Very Much!