Status of Indium Bumped FE-I4B Richard Bates, Craig Buttar, Kate Doonan, John Lipp, Thomas McMullen 28/03/2014.

Slides:



Advertisements
Similar presentations
Quantitative Capability Assessment
Advertisements

Artificial Intelligence 12. Two Layer ANNs
Radiation damage in silicon sensors
ELLIOTT BAY INDUSTRIES
Status of Pixel Test Niigata University/RIKEN Kohei Fujiwara.
TEC X5 Setup (1) 1 Front + 1 Back petal, fully equipped (28 modules F.P modules B.P. + AOH + DOHM) Petal assembly IPN-Lyon (F.P.), RWTH-Aachen I.
STAR Pixel Detector Phase-1 testing. 22 Testing interrupted LBNL-IPHC 06/ LG Lena Weronika Szelezniak born on May 30, 2009 at 10:04 am weighing.
The Connectivity and Fault-Tolerance of the Internet Topology
STATUS OF MEDIPIX-3, PLANS FOR TIMEPIX-2 X. Llopart.
QUAD MODULE TESTING 18 th January 2013 Kate Doonan University of Glasgow.
1 Cosmic Ray Test Stand with Scintillating Cells for Digital Hadron Calorimeter 06/23/2003 Kurt Francis - Northern Illinois University.
Ryan Badman, M. Artuso, J. Wang, Z. Xing July 7 th, 2010 TIMEPIX Characterization with test pulses with the Syracuse test stand.
Timepix Studies: Medipix Collaboration Summary and More Timewalk Plots Alessandra Borgia Marina Artuso Syracuse University Group Meeting – Thursday 20.
1 Scintillating Fibre Cosmic Ray Test Results Malcolm Ellis Imperial College London Monday 29 th March 2004.
JC and Marina 12/18/00 Pixel Detector Simulation with Magnetic Field  Effects with magnetic Field o Deflection o Effective mobility o Non-constant Hall.
Preliminary results from a study of isospin non-equilibrium E. Martin, A. Keksis, A. Ruangma, D. Shetty, G. Souliotis, M. Veselsky, E. M. Winchester, and.
Tera-Pixel APS for CALICE Progress meeting, 17 th May 2006 Jamie Crooks, Microelectronics/RAL.
Status Report For Threshold Scans. Shaper/Sampler Drop Trims As promised new and improved trimming techniques have been developed. As suggested, we will.
Plans for Demonstrator Flip Chip Bonding GTK meeting 9/12/08 1.
MEDIPIX3 TESTING STATUS R. Ballabriga and X. Llopart.
Bump Bonding and Thinning of Hybrid Pixel Detectors Kiyoshi Tanida (RIKEN) Johann M. Heuser (RIKEN) PHENIX upgrade workshop, Aug 2002 Contents Bump bonding.
Summary of CMS 3D pixel sensors R&D Enver Alagoz 1 On behalf of CMS 3D collaboration 1 Physics Department, Purdue University, West Lafayette, IN
1 of 19 09/09/2013 FE-I4B IBL wafer probing results FE-I4 testing meeting 09 September 2013 Marlon Barbero, David-Leon Pohl Introduction Cut definitions.
FPIX_flip_chip_test module calibration tests November 14 th 2012.
Nov. 10, 2005UCSC US ATLAS Upgrade meeting -- Ely, Garcia-Sciveres1 DC to DC Power Converion R. Ely and M. Garcia-Sciveres Atlas Upgrade Workshop Santa.
Pixel Upgrade Status and Plan G.M. Bilei Firenze Mar. 6 th 2013.
Annual Meeting WP2- Sensors Heinz Pernegger / CERN 20 November 2013.
FEI4A Wafer Probing Andrew Stewart 21 September 2012.
SCT Week -CERN- September 23, Defective ASIC’s A. Ciocio - LBNL.
VTT ASSEMBLY 5 CHARACTERISATION KATE DOONAN & RICHARD BATES 2012.
Summary of CMS 3D pixel sensors R&D Enver Alagoz 1 On behalf of CMS 3D collaboration 1 Physics Department, Purdue University, West Lafayette, IN
Update on Micron productions - Comparison of AC & DC coupled devices - Marko Milovanovic*, Phil Allport, Gianluigi Casse, Sergey Burdin, Paul Dervan, Ilya.
2 Silicon pixel part Done and to be written Written! Under way To be done Introduction 1.Hybrid Pixel Assembly Concept 2.Silicon sensor 1.First thinned.
Malte Backhaus – University of Bonn – ??/??/201?1 Approaching FLEX-test PrimList - Upcoming questions Malte Backhaus.
Communications G. Darbo – INFN / Genova IBL MB#15, 5 October 2009 o Bump Bonding Selex / INFN Roma, October, 30 th 2009 G. Darbo - INFN / Genova.
PHASE-1B ACTIVITIES L. Demaria – INFN Torino. Introduction  The inner layer of the Phase 1 Pixel detector is exposed to very high level of irradiation.
Noise study 6/May/’13 Kazuki Motohashi - Tokyo Tech.
G. BrunoOffline week - February Comparison between test- beam data and the SPD simulations in Aliroot G. Bruno, R. Santoro Outline:  strategy of.
ClicPix ideas and a first specification draft P. Valerio.
Sensor testing and validation plans for Phase-1 and Ultimate IPHC_HFT 06/15/ LG1.
USBPix software status and plans Dr. Jens Weingarten.
C.V. S.W. T.S. L.G. X.S. M.S. IPHC-LBL meeting, January 22, Probe Test Results for 5 wafers of Ultimate-2 sensors Outline:  Yield and wafer.
T. Lari – INFN Milan Status of ATLAS Pixel Test beam simulation Status of the validation studies with test-beam data of the Geant4 simulation and Pixel.
3D sensors for tracking detectors: present and future applications C. Gemme (INFN Genova) Vertex 2013, Lake Starnberg, Germany, September 2013 Outline:
Transition to cables Staves Services IP Underside of stave: IBL modules IBL Design.
F Don Lincoln, Fermilab f Fermilab/Boeing Test Results for HiSTE-VI Don Lincoln Fermi National Accelerator Laboratory.
JC and Marina 12/18/00 Pixel Detector Simulation with Magnetic Field  Effects with magnetic Field o Deflection o Effective mobility o Non-constant Hall.
FE-I4 irradiated chip tests at low temperature M. Menouni, P. Breugnon, A. Rozanov (CPPM - Aix-Marseille Université)
The Silicon Pixel Detector (SPD) is part of the Inner Tracking System (ITS) of the ALICE experiment. ALICE is designed to study the properties of strongly.
FBK 3D CMS pixel sensors preliminary lab measurements E. Alagoz 1, A. Krzywda 1, D. Bortoletto 1, I. Shipsey 1, G. Bolla 1, and G. F. Dalla Betta 2, M.
Introduction  Goal: Study noise occupancy of the FE-I4B chips on the quad-module mounted on the stavelet with serial power  About one month ago, observed.
NEWS FROM MEDIPIX3 MEASUREMENTS AND IMPACT ON TIMEPIX2 X. Llopart CERN.
Comparison of the AC and DC coupled pixels sensors read out with FE-I4 electronics Gianluigi Casse*, Marko Milovanovic, Paul Dervan, Ilya Tsurin 22/06/20161.
Gray Room Activities Richard Kass with much help from: Marco B., Jacques C., Giovanni M. 12/4/20121R. Kass (Adventures with USBpix)
PIXEL 2000 P.Netchaeva INFN Genova 0 Results on 0.7% X0 thick Pixel Modules for the ATLAS Detector. INFN Genova: R.Beccherle, G.Darbo, G.Gagliardi, C.Gemme,
29/05/09A. Salamon – TDAQ WG - CERN1 LKr calorimeter L0 trigger V. Bonaiuto, L. Cesaroni, A. Fucci, A. Salamon, G. Salina, F. Sargeni.
Bissi L., Bizzaglia S., Bizzarri M., Farnesini L., Menichelli M., Meroli S., Papi A., Piluso A., Saha A., Scolieri G, Servoli L. INFN Sezione di Perugia.
USBPix Readout System using FE-I4/A Chip Status Update: ToT calibration and Finalization of Tuning Procedure Jimin Kim and Austin Piehl Department of Physics.
Further studies of the FEI3 TDAC Tuning
Study of Indium bumps for the ATLAS pixel detector
Ivan Peric, Christian Kreidl, Peter Fischer University of Heidelberg
PyBAR Firmware Structure and Operation Experience
TPAC1.0 Jamie Crooks.
HR-HV CMOS activities and plans at Glasgow
Eiger characterization results
USBPix Readout System using FE-I4/A chip Status Update: Finalization of Threshold Tuning and Minor updates Jimin Kim and Austin Piehl Department of Physics.
Test Beam Measurements october – november, 2016
Operational Experience with the ATLAS Pixel Detector at the LHC
A new family of pixel detectors for high frame rate X-ray applications Roberto Dinapoli†, Anna Bergamaschi, Beat Henrich, Roland Horisberger, Ian Johnson,
Clustering-based Studies on the upgraded ITS of the Alice Experiment
Presentation transcript:

Status of Indium Bumped FE-I4B Richard Bates, Craig Buttar, Kate Doonan, John Lipp, Thomas McMullen 28/03/2014

Introduction 300μm CPII sensor Indium bump bonded to FE-I4B ROC Set up on probe station in GLADD to readout using USBPix RX Delay and Analog and Digital scans done to test module was working Tuning performed on the module to ascertain number of disconnected/merged bumps and dead pixels RX Delay Analog Digital

Disconnected pixels (criteria: Sigma > 0e and < 200e) This is the case for 6 out of pixels

Merged Bumps Merged pixels (criteria: Crosstalk occurs at 100V) This is the case for 106 out of pixels

Dead Pixels As tuning was not ideal, this is an approximate value by counting pixels with sigma value less than 1e from Threshold 100V from long tuning attempt (see later) 21 pixels dead

Bump Yield DISCONNECTED: 6 MERGED: 106 DEAD: 21 TOTAL: 133 out of BUMP-YIELD: %

Tuning The IBL tuning scheme did not work fully as it uses FAST tunes and all parameter space was not scanned 3000e threshold with 16ke THRESHOLD: Slightly high compared to target. White pixels here are not dead pixels, but pixels which are not reached using a fast tuning.

Tuning Compared to SC (250μm x 50μm) THRESHOLD: 2975e

Tuning Sigma on threshold with 0V bias shows very few pixels with values around 120e (disconnected) Next slide has log Y plot to show pixels with low values of sigma

Tuning Log Y Scale on sigma plot

Tuning Compared to SC (250μm x 50μm) at 100V SIGMA: 119.6e

Tuning TOT: This looks good!

Tuning Compared to SC (250μm x 50μm) TOT: 8.99

Tuning LONG tuning at 100V looked to be problematic: Threshold very high although note the pixels which were white in fast tune are occupied now Sigma very spread out Closer look at individual SCurves of pixels showed very poor fit giving both: HIGH THRESHOLD! LARGE SIGMA! HIGH THRESHOLD! SCurve is evident – fit has failed

Tuning LONG tuning at 100V looked to be problematic: Threshold very high Sigma very spread out Closer look at individual SCurves of pixels showed very poor fit giving both: HIGH THRESHOLD! LARGE SIGMA! Poor fit – sigma actually much smaller!

Tuning I am contacting Malte Beckhaus at CERN to see if there is a method of improving the fit for the SCurves With this issue, the threshold value and sigma value for each pixel is wrong in this case