Example 12: Micronozzles

Slides:



Advertisements
Similar presentations
Chapter 9b: Example of a Micromachined Device: The SA30 Crash Sensor from SensoNor Picture shows the interior chip assembly of SensoNor’s SA30 Crash Sensor.
Advertisements

Professor Richard S. MullerMichael A. Helmbrecht MEMS for Adaptive Optics Michael A. Helmbrecht Professor R. S. Muller.
Optomechanical cantilever device for displacement sensing and variable attenuator 1 Peter A Cooper, Christopher Holmes Lewis G. Carpenter, Paolo L. Mennea,
MetalMUMPs Process Flow
Design and Simulation of a MEMS Piezoelectric Micropump Alarbi Elhashmi, Salah Al-Zghoul, Advisor: Prof. Xingguo Xiong Department of Biomedical Engineering,
Assignment#01: Literature Survey on Sensors and Actuators ECE5320 Mechatronics Assignment#01: Literature Survey on Sensors and Actuators Electrostatic.
MICROFLEX S Beeby, J Tudor, University of Southampton Introduction to MEMS What is MEMS? What do MEMS devices look like? What can they do? How do we make.
A MEMS Design Project Debby Chang, Randall Evans, Caleb Knoernschild under Jungsang Kim, Ph.D. December 10, 2005 Duke University.
Development of a mover having one nanometer precision and 4mm moving range Y. Morita, S. Yamashita ICEPP, University of Tokyo Y. Higashi, M. Masuzawa,
MESF593 Finite Element Methods HW #2 Solutions. Prob. #1 (25%) The element equations of a general tapered beam with a rectangular cross- section are given.
A novel MEMS platform for a cell adhesion tester Ethan Abernathey Jeff Bütz Ningli Yang Instructor: Professor Horacio D. Espinosa ME-381 Final Project,
Applications: Angular Rate Sensors (cont’d)
Processing and Characterization of Piezoelectric Materials into MicroElectroMechanical Systems Weiqiang Wang.
Sample Devices for NAIL Thermal Imaging and Nanowire Projects Design and Fabrication Mead Mišić Selim Ünlü.
The Anti-Gravity MicroMachine
Bulk MEMS 2013, Part 2
MEMS Fabrication and Applications Brought to you by: Jack Link & Aaron Schiller Date delivered on: Friday the third of May, 2013 ABSTRACT: Taking a brief.
Surface micromachining
Slide # 1 MESA Isolation Source-Drain Contact DEPOSITION Schottky Contact DEPOSITION Bonding Pad DEPOSITION Top Cantilever OUTLINE ETCH BACK POCKET ETCH.
Status and outlook of the Medipix3 TSV project
ISAT 436 Micro-/Nanofabrication and Applications MOS Transistor Fabrication David J. Lawrence Spring 2001.
Capacitive Sensors As noted earlier, the sensor traces can be any number of different shapes and sizes: Buttons, wheels, scroll-bar, joypad, and touchpad.
Tony Hyun Kim April 23, : MEMS Presentation.
Copyright Prentice-Hall Chapter 29 Fabrication of Microelectromechanical Devices and Systems (MEMS)
© Pearson & GNU Su-Jin Kim MEMS Manufacturing Processes MEMS Devices The MEMS(Microelectromechanical systems) devices can be made through the IC Process:
1 M. Chitteboyina, D. Butler and Z. Celik-Butler, Nanotechnology Research and Teaching Facility University of Texas at Arlington
1 Challenge the future The Lateral Motion of Wafer under the Influence of Thin-film Flow Leilei Hu Solid and Fluid Mechanics
Longitudinal Motion Characteristics between a Non- Matched Piezoelectric Sensor and Actuator Pair Young-Sup Lee Department of Embedded Systems Engineering,
Wave Propagation Theories Study
1 MPW Design Introduction Course - Module 4 Process Description Part II Tyre pressure sensor (SensoNor)
Design and Implement a Electro thermal Compliant
Electrochemical Bubble Valves Center for Bio-Mems,State University of NewYork at Buffalo.
MICROCHANNEL DESIGN ISSUES Susan Beatty Anne Samuel Kunal Thaker.
Jongbaeg Kim, Dane Christensen, and Liwei Lin
EMC BWE Proto18 - Orsay Meeting 1 PANDA EMC BWE Proto18 Mikel Catania Goikoetxea, Javier Navarro Medrano, David Rodríguez Piñeiro, Yue Ma, Frank.
Pressure Sensor Lecture
(Chapters 29 & 30; good to refresh 20 & 21, too)
EE141 © Digital Integrated Circuits 2nd Manufacturing 1 Manufacturing Process Dr. Shiyan Hu Office: EERC 731 Adapted and modified from Digital Integrated.
Date of download: 11/12/2016 Copyright © 2016 SPIE. All rights reserved. A sketch of a micro four-point probe with integrated CNTs in situ grown from nickel.
Date of download: 11/12/2016 Copyright © 2016 SPIE. All rights reserved. (a) A close-up SEM of a rotary comb actuated device. The innermost and outermost.
ENGINEERING PHYSICS SEMESTER /2012. ENGINEERING PHYSICS Sub Topics ● Charge units ● Electric field ● Electric force & Coulomb’s Law ● Capacitance.
Linear actuator Cylinders Single acting Double acting
Infineon CoolIR2DieTM Power Module
Applications of Microactuations
Radiant Technologies, Inc. Ferroelectric Test & Technology
Simplified process flow for bonding interface characterization
Mechanics of Micro Structures
Manufacturing Process I
5. Strain and Pressure Sensors
Temperature Sensors on Flexible Substrates
Chapter 1 & Chapter 3.
International Conference on Electrical, Electronics, Signals, Communication and Optimization (EESCO) Optimized Design of Au-Polysilicon Electrothermal.
Unit-2.
Fab. Example: Piezoelectric Force Sensor (1)
Dielectrics.
VLSI System Design LEC3.1 CMOS FABRICATION REVIEW
Dielectrics.
Etch-Stop Techniques : (1) Doping Selective Etching (DSE)
Process flow part 2 Develop a basic-level process flow for creating a simple MEMS device State and explain the principles involved in attaining good mask.
Manufacturing Process I
ECE699 – 004 Sensor Device Technology
Micro-Electro-Mechanical-Systems
(2) Incorporation of IC Technology Example 18: Integration of Air-Gap-Capacitor Pressure Sensor and Digital readout (I) Structure It consists of a top.
SILICON MICROMACHINING
BONDING The construction of any complicated mechanical device requires not only the machining of individual components but also the assembly of components.
Manufacturing Process I
Mechanical Properties Of Metals - I
CSE 87 Fall 2007 Chips and Chip Making
PiezoMEMS Foundry to Support Research Projects
Presentation transcript:

Example 12: Micronozzles Process Flow Cap etched Si nozzle mold Farooqui and Evans, JMEMS 1, 86 (1992)

Process Flow (ctd.) Silicon nitride nozzle with molds still in place Farooqui and Evans, JMEMS 1, 86 (1992)

Process Flow (cntd.) Nozzle with submicron aperture Nozzle with 150 nm aperture Farooqui and Evans, JMEMS 1, 86 (1992)

Example 13: Linear-Motion Microactuator Perspective view Expansion/contraction and net displacement Robins etal., JMM 1, 247 (1991)

Process Robins etal., JMM 1, 247 (1991)

Analysis The model parameters are given as: and N is the number of bars per actuator half section, and L, w, and t are the actuator’s dimensions. Eps is Young’s modulus of poly-Si. Robins etal., JMM 1, 247 (1991)

Analysis (cntd.) The effective force is given by: d13 is the piezoelectric constant of PZT, Epz is its Young’s modulus, and V is the applied voltage. The overall displacement is:

Example 14: silicon Condenser Microphone Process Hijab and Muller, Digest of tech. Papers, Transducers 85, (1995), pp. 178 - 181

SEM photograph of the cross-section of the condenser microphone Hijab and Muller, Digest of tech. Papers, Transducers 85, (1995), pp. 178 - 181

Example 15: Different Types of Pressure Sensors (i) Piezoelectric

(ii) Piezoresistive

(iii) Capacitive

Example 17: Different Types of Microactuators (i) Diaphragm-Based

(ii) Piezoelectric Cantilever-Based

Example 17: Overhanging Microgripper (I) Design The poly-Si microgripper is 2.5 mm thick and 400 mm long. It consists of a closure driver and two drive arms which connect to extension arms that extend to the gripper jaw. The beam widths for the drive arms and comb teeth are 2 mm, but that for the closure drive is 10 mm to provide relative rigidity. When voltage is applied between the closure driver and drive arms, the drive arms tend to close the gripper jaws. Note that the drive arms are at the same potential which avoids current flowing between the gripper jaws when they are fully closed Kim etal., IEEE Solid State sensor and Actuator Workshop (1990)

(II) Force Analysis The size of the force depends upon the initial jaw displacement and on the voltage applied to close it against the specimen; for example, if each gripper jaw needs to close 2 mm to be in contact with the specimen, then 23 V applied between the driver (stator) and the drive arms initially brings the jaws in contact with the object. Voltages higher than 23 V will generate a gripping force. Kim etal., IEEE Solid State sensor and Actuator Workshop (1990)

(III) Process Flow Boron diffusion. Deposition of phosphosilicate glass (PSG); deposition and definition of poly-Si; removal of poly-Si on wafer backside. Deposition of thick PSG; annealing; front-to-back alignment-window etching. Definition of PSG break lines on front-side; definition of Si die and V-groove on backside; etching EDP. Final (times) PSG etching. Kim etal., IEEE Solid State sensor and Actuator Workshop (1990)

Fabrication is complete but the die not yet removed from water. Three conducting lines crossing the end of the support cantilever in the gripper arms. Flexible comb-drive structures, extension arms, and gripper jaws. Kim etal., IEEE Solid State sensor and Actuator Workshop (1990)

Photograph of the packaged gripper SEM picture of a one-celled protozoa being held by the gripper; the object is 40 mm long and 7 mm in diameter. Kim etal., IEEE Solid State sensor and Actuator Workshop (1990)