Japan Packaging Committee Liaison Report May, 2011 SEMI Japan Venue, Location, Date

Contents Committee Meeting Information Committee Structure Publications Ballot Result Ballots for Cycle 4 Task Force Reports

Committee Meeting Information Previous Committee Meeting 20 April, 2011 at SEMI Japan Office Next Committee Meeting 5 August, 2011 at SEMI Japan Office

Committee Structure Disbanded

Publications Published Standards SEMI G88-0211, New Standard: Specification for Tape Frame for 450 mm Wafer Developed by Japan 450mm Assembly Test Die Preparation TF SEMI G89-0211, New Standard: Specification for Leadframe Strip Size Developed by Leadframe Strip Size Stds TF

Ballot Results 5 years review New Standard 37 Reapproval ballots passed For more information, please see the minutes or the Committee Express Report (CER) on the website. New Standard Doc.4563A, New Standard: Specification for 300mm Wafer Coin-Stack Type Shipping Container used for Test and Packaging Processes passed.

Ballots in Cycle 4 Doc.4814, New Standard: Specification for Tape Frame Cassette for 450 mm Wafer Doc.4965, New Standard: Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in Backend Process The two ballots will be adjudicated at the next committee meeting.

TF Reports: Japan 450mm Assembly Test Die Preparation Task Force The TF developed the following ballots. Doc.4814, New Standard: Specification for Tape Frame Cassette for 450 mm Wafer Doc.4965, New Standard: Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in Backend Process

TF Reports: Wafer Shipping Container for Assembly &Packaging Task Force Doc4563A, Specification for 300 mm Wafer Coin-stack Type Shipping Container Used for Test and Packaging Processes was balloted in Cycle 2 and passed at the previous committee meeting. will be published soon.

TF Report: Leadframe Strip Size Stds Task Force SEMI G89-0211, New Standard: Specification for Leadframe Strip Size was published. The TF was disbanded at the previous committee meeting.

TF Report: Pd PPF Solder Wettability Measurement Task Force The TF meets once every two months. A SNARF will be submitted in the near future.

TF Report: Solder Sphere Size Measurement Task Force New SNARF for Measurement Method for Solder Sphere Size for Ball Grid Array Package Will be submitted at the next committee meeting.

TF Report: Other Task Forces DFM Study Group did not meet. Electromagnetic Characterization Study Group Mikio Kiyono (ATE), who is the Study Group leader, decided to be TF member of 3DIC and HBLED committees. Handling & Packaging Materials for Assembling Advanced Electronic Device under Clean Environment Task Force Packages & Packaging Materials Eco-efficiency Task Force

SEMI Japan, Standards coordinator Question? Thank you. SEMI Japan, Standards coordinator Hirofumi Kanno Email: hkanno@semi.org