Liaison Report February 2011 North America 3DS-IC Committee (Three-dimensional Stacked Integrated Circuits) Liaison Report February 2011

Outline Leadership Organization Chart Meeting Information New TFOF/SNARF Task Force Updates February 2011 NA 3DS-IC Committee

Leadership Committee Co-chairs Urmi Ray (Qualcomm) Andy Rudack (SEMATECH) Chris Moore (Semilab) February 2011 NA 3DS-IC Committee

Organization Chart NA 3DS-IC Committee Wafer Bonded Stacks TF C: Urmi Ray (Qualcomm) C: Andy Rudack (SEMATECH) C: Chris Moore (Semilab) Wafer Bonded Stacks TF L: Andy Rudack (SEMATECH) Inspection & Metrology TF L: Chris Moore (Semilab) Thin Wafer Handling TF L: Urmi Ray (Qualcomm) February 2011 NA 3DS-IC Committee

Meeting Information Last meeting Next meeting January 12, 2011 (kick-off meeting) Via teleconference/web meeting Next meeting March 29 for NA Spring 2011 Meetings San Jose, California February 2011 NA 3DS-IC Committee

NA 3DS-IC Committee Kick-off Meeting Held Jan 12 via teleconference/web meeting Attendance 37 participants Companies represented include: Amkor, Applied Materials, ASE, Brooks Automation, Corning, DISCO, eda 2 asic, Entegris, eSilicon, EVG, ITRI, KLA-Tencor, Lasertec, Miraial, Nitto Denko, Olympus, Qualcomm, SEMATECH, Semilab, Sharp, SUMCO, TI Discussed formation of three (3) proposed task forces Wafer Bonded Stacks TF Inspection & Metrology TF Thin Wafer Handling TF February 2011 NA 3DS-IC Committee

Task Force Updates 3DS-IC Wafer Bonded Stacks TF Approved late January 2011 Charter: The BWS Task Force will actively create and/or modify specifications that reflect bonded wafer stacks parameters and the wafer bonding process. Scope: Identify new wafer parameters that reflect adequate ranges for bonded wafer stacks Modify/create document to reflect adequate ranges for bonded wafer stacks Identify other SEMI standards that are adversely affected by BWS parameters Update referenced standards: create/modify standards to reflect BWS parameters Next Meeting: February 23 (5:00 PM to 7:00 PM, Pacific) via teleconference/web meeting February 2011 NA 3DS-IC Committee

Task Force Updates 3DS-IC Inspection & Metrology TF Approved late January 2011 Charter: Develop standards for metrology and inspection methods to be used in measuring the properties of TSV’s, bonded wafer stacks, and dies used in the 3DS-IC manufacturing process. Scope: Examples of needed standards include (but are not limited to): TSV physical properties i.e. depth, top, bottom CD, side wall…. Bonded wafer stack properties i.e. overlay, bond inspection Defect metrology Dies ??? Next Meeting: TBD February 2011 NA 3DS-IC Committee

Task Force Updates 3DS-IC Thin Wafer Handling TF Approved late January 2011 Charter: Develop standards for reliable handling and shipping of thin wafers, dies (e.g., Micro-pillar Grid array -MPGA) used in 3DS-IC high volume manufacturing (HVM) Define thin wafer handling requirements including physical interfaces used in 3DS-IC manufacturing. Define shipping requirements, including packaging, reliability, and other relevant criteria. This will also include MPGA ship/handle requirements Next Meeting: February 16 (5:00 PM to 6:00 PM Pacific) via teleconference/web meeting February 2011 NA 3DS-IC Committee

Task Force Updates 3DS-IC Thin Wafer Handling TF (cont’d) Scope: Formulate a common set of requirements and prioritize critical areas for standardization, resulting in a short-list of required standards (inspection, shipping etc) in the topics listed below. Other topics may be added based on additional inputs Thin wafer and Die Shipping related activities: Examples: Shipping carriers for thin wafer (wafer cassette, box or frame), Shipping carrier for dies (MPGA), Reliability Test methods Transportation vibration testing Drop-shock Other – new tests? Thin wafer handling-related activities: Examples: Process and Metrology Tools and Test methods Whole wafer inspection for damage (crack, break etc)Macro level Damage to features – microbump, pad etc micro level Universal carrier concept Automation February 2011 NA 3DS-IC Committee

NA 3DS-IC Spring Meeting Schedule [DRAFT] Tuesday, March 29 Wafer Bonded Stacks TF (8:00 AM to 12:00 noon) Inspection & Metrology TF (8:00 AM to 12:00 noon) Thin Wafer Handling TF (8:00 AM to 12:00 noon) NA 3DS-IC Committee (1:00 PM to 5:00 PM) SEMI Headquarters San Jose, CA February 2011 NA 3DS-IC Committee

Thank You! For more information or participate in any NA 3DS-IC activities, please contact Paul Trio at SEMI (ptrio@semi.org) February 2011 NA 3DS-IC Committee