The PRELEG WIRE SYSTEM Application

Cut required length of Preleg Wire and strip both ends. Step One Cut required length of Preleg Wire and strip both ends. Perform and insert bare ends of wire in PC board hole for wave soldering or manually solder where needed.

Determine the location of the first spot bond. Step Two Determine the location of the first spot bond. Contact Preleg Iron tip over the Preleg Wire in perpendicular position reflowing the adhesive to the PC board using light but firm force for about one second.

Step Three While the iron is in contact with the PC board, route the wire from the tip to the next spot bond location forming either a straight line or an angle as needed.

Step Four Tilt the iron about 45 degrees for an additional second for cooling, while continuing to hold the wire in place. The wire must be held in full contact with the board and not moved during the cooling period for sufficient bond strength. Use the procedure to make as many spot bonds as desired along the length of the Preleg Wire. For best results, bonds should always be routed away from vias or hot spots.

Step Five Perform second end and insert bare wire in PC board hole for wave soldering or manually solder where needed.

Note After attaching each Preleg Wire jumper, wipe Preleg Iron tip on the Preleg Cleaner to remove all residual adhesive. Wipe all four sides of the tip on the Preleg Cleaner cord surface. Then wipe the end of the tip so as to cause the slot at the end of the tip to be cleaned by engaging one of the cord coils. This procedure is very important because residual adhesive will carbonize if not promptly removed. Should carbonized adhesive occur it can be removed with the brass brush.