FEE Electronics progress

Slides:



Advertisements
Similar presentations
Advanced Implantation Detector Array (AIDA): Update & Issues Tom Davinson School of Physics & Astronomy The University of Edinburgh presented by Tom Davinson.
Advertisements

Design Review Team Digital Burnout Senior Design Fall 2011 Analog Gauge w/ Digital Display.
Large Area, High Speed Photo-detectors Readout Jean-Francois Genat + On behalf and with the help of Herve Grabas +, Samuel Meehan +, Eric Oberla +, Fukun.
4 Dec 2001First ideas for readout/DAQ1 Paul Dauncey Imperial College Contributions from all of UK: result of brainstorming meeting in Birmingham on 13.
Uli Schäfer 1 Production modules Status Plans JEM: Status and plans.
Mind Board Company Profile Company Profile. Meets the challenge of Meets the challenge of creating complex designs PCB DESIGN CENTER.
Status of LAV FEE electronics G. Corradi, C. Paglia, D. Tagnani & M. Raggi, T. Spadaro, P. Valente.
Various Topics Related to FEB Liang Han, Ge Jin University of Science and Technology of China Dec.21,2013.
31st July 2008AIDA FEE Report1 AIDA Front end electronics Report July 2008 Progress Virtex5 FPGA choice Milestones for prototype delivery.
Status of the digital readout electronics Mauro Raggi and F. Gonnella LNF Photon Veto WG CERN 13/12/2011.
9th October 2008AIDA FEE progress report P.J.Coleman-Smith 1 AIDA Frontend Electronics progress report. Mezzanine to FEE64 connection. Mezzanine Layout.
Electronics for PS and LHC transformers Grzegorz Kasprowicz Supervisor: David Belohrad AB-BDI-PI Technical student report.
AIDA annual meeting,Vienna, 26th March 2014Václav Vrba, Institute of Physics, Prague 1  design of sensors for production submission  design of the readout.
Advanced Implantation Detector Array (AIDA): Project Summary & Status Tom Davinson School of Physics & Astronomy The University of Edinburgh presented.
Leo Greiner IPHC testing Sensor and infrastructure testing at LBL. Capabilities and Plan.
Uni-Heidelberg, KIP, V.Angelov 1 International Workshop TRDs – Present & Future September, Romania Wafer Tester, Optical Link, GTU V. Angelov Kirchhoff.
FEE Electronics progress Mezzanine manufacture progress FEE64 testing and VHDL progress Test mezzanine. Trial mechanical assembly 10th November 2009.
AGATA Pre-processing team report AGATA Week, July 2008.
AIDA FEE64 development report August 2010 Progress after Texas CAD work Manufacturing 25th August
Understanding Data Acquisition System for N- XYTER.
12th May 2008AIDA FEE Report1 AIDA Front end electronics Report May 2008 Progress Data compression Plan for prototype delivery.
R&D for First Level Farm Hardware Processors Joachim Gläß Computer Engineering, University of Mannheim Contents –Overview of Processing Architecture –Requirements.
Status of Global Trigger Global Muon Trigger Sept 2001 Vienna CMS-group presented by A.Taurok.
Update on the HBD Craig Woody BNL DC Meeting June 8, 2005.
27 th September 2007AIDA design meeting. 27 th September 2007AIDA design meeting.
11th March 2008AIDA FEE Report1 AIDA Front end electronics Report February 2008.
CMS ECAL End Cap Meeting CERN 18 Oct to 22 Oct ECAL End Cap High Voltage and Fibre Optic Monitoring Systems Progress. Progress on High Voltage and.
FEE Electronics progress PCB layout progress VHDL progress in TBU Prototype fixtures FEE64 commissioning A few of the remaining tasks 16th July 2009.
Leo Greiner PIXEL Hardware meeting HFT PIXEL detector LVDS Data Path Testing.
Status of NA62 straw electronics Webs Covers Services Readout.
Beam diagnostics developments at LAPP: Digital part CTF3 Collaboration Meeting Louis Bellier, Richard Hermel, Yannis Karyotakis, Jean Tassan,
Bottom half – ch 0-5 placed & routed FE PS PROC FIFO TRIG OSC RX/SHAP ADC DAC VME.
DOM Main PCB Testing Gerald Przybylski October 23, 2002 Lawrence Berkeley National Laboratory.
1 SysCore for N-XYTER Status Report Talk by Dirk Gottschalk Kirchhoff Institut für Physik Universität Heidelberg.
XLV INTERNATIONAL WINTER MEETING ON NUCLEAR PHYSICS Tiago Pérez II Physikalisches Institut For the PANDA collaboration FPGA Compute node for the PANDA.
AIDA FEE64 production report January 2011 Manufacturing Power Supply FEE64 revision A “3 hour test” 19th January
B.Satyanarayana Department of High Energy Physics Tata Institute of Fundamental Research Homi Bhabha Road, Colaba, Mumbai,
FEE Electronics progress Mezzanine layout progress FEE64 progress FEE64 initial testing Test mezzanine. A few of the remaining tasks 2nd October 2009.
STAR Pixel Detector readout prototyping status. LBNL-IPHC-06/ LG22 Talk Outline Quick review of requirements and system design Status at last meeting.
FEE Electronics progress PCB layout 18th March 2009.
European DHCAL development European DHCAL development CIEMAT,IPNL,LAL, LAPP,LLR, PROTVINO, SACLAY CIEMAT,IPNL,LAL, LAPP,LLR, PROTVINO, SACLAY Status :
Julie Prast, Calice Electronics Meeting at LAL, June 2008 Status of the DHCAL DIF Detector InterFace Board Sébastien Cap, Julie Prast, Guillaume Vouters.
Preparations to Install the HBD for Run 6 Craig Woody BNL PHENIX Weekly Meeting January 26, 2006.
FEE Electronics progress PCB layout progress VHDL progress in TBU Prototype fixture for software 9th June 2009.
Rutherford Appleton Laboratory September 1999Fifth Workshop on Electronics for LHC Presented by S. Quinton.
DAQ ELECTRONICS 18 March 2015MEG Collaboration Meeting, Tokyo Stefan Ritt.
DOM Electronics (Digital Optical Module) 1 WPFLElectronics PPMDOM ElectronicsF. Louis.
Week 22: Schematic Week 23-Week 27: Routing Gerber files have been available since 9th July 1st prototype: – PCB manufacturer: supervised by KIT – Cabling:
AIDA: introduction Advanced Implantation Detector Array (AIDA) UK collaboration: University of Edinburgh, University of Liverpool, STFC Daresbury Laboratory.
SVD FADC Status Markus Friedl (HEPHY Vienna) Wetzlar SVD-PXD Meeting, 5 February 2013.
ECAL electronics schedule JFMAMJJASONDJFMAM Prototype 2 boards Design Layout Fabrication and assembly Testing, including VFE prototype tests Production.
Organization for Micro-Electronics desiGn and Applications HGCAL Front-End Electronics Christophe de LA TAILLE, Marcello MANNELLI sept 2015.
MADEIRA Valencia report V. Stankova, C. Lacasta, V. Linhart Ljubljana meeting February 2009.
CLAS12 DAQ & Trigger Status
Jinfan Chang Experimental Physics Center , IHEP Feb 18 , 2011
Production Firmware - status Components TOTFED - status
96-channel, 10-bit, 20 MSPS ADC board with Gb Ethernet optical output
GTK-TO readout interface status
THE PROCESS OF EMBEDDED SYSTEM DEVELOPMENT
Status of the DHCAL DIF Detector InterFace Board
10/month is the present production rate 2 FTE + sporadic contributions
FEE Electronics progress
VELO readout On detector electronics Off detector electronics to DAQ
Assembly order PCB design
University of California Los Angeles
FEE Electronics progress
HallD Collaboration Meeting Jefferson Lab December 11-13, 2003
TELL1 A common data acquisition board for LHCb
Readout Systems Update
Presentation transcript:

FEE Electronics progress Mezzanine layout progress FEE64 progress FEE64 initial testing Test mezzanine. VHDL progress in TBU A few of the remaining tasks 3rd September 2009

Mezzanine Layout Progress Layout complete. Checked :- ASICs can be mounted. Board is manufacturable. Board passes DRC. Check :- Layout and design is acceptable for ASIC and mechanics. 3rd September 2009

FEE64 progress targets September 3rd : September 21st : October 31st : PCB manufactured and shipped to assembler and DL. September 21st : Assembled boards delivered this week. Commissioning commences - PJCS, MK, LM. October 31st : Milestone --- Decision to proceed with experiment. 3rd September 2009

Initial testing of FEE64 Power supplies – 28 : Check for noise, stability, accuracy, efficiency…. FPGA – Check configuration via JTAG. Check processor operates with internal memory and terminal. Check configuration from EEPROM. DDR2 Memory Run test system developed by DSDG. Check results and optimise access speed for best performance. Gbit Ethernet ASIC communications and discriminator output timing Analog buffers and ADCs 3rd September 2009

Test mezzanine The board is to allow the exercising of the FEE64 analog and digital inputs. All active signals will be routed with identical lengths and consideration of type. Target is to produce them by Mid October. 3rd September 2009

Collaboration with Detector Systems Development Group (DSDG) of TBU Collaboration with Detector Systems Development Group (DSDG) of TBU. (Technology Business Unit ) Completed : Gbit data rate from memory on the devkit => 240Mbit/sec . System boots with fallback to golden copy. Created a DMA peripheral with transfer rate of 1.1Gbytes/sec. Pin allocation of FEE64 memory and Gbit signals checked. Create a memory test and configuration system. Review the FEE64 schematic and pcb layout Next steps : Commissioning 3rd September 2009

A few of the remaining Tasks Manufacture Mezzanine. Complete Mechanical design. ( Is waiting for final component heights ) Test documentation. Commission first FEE64 units VHDL for first experimental use. Full Linux processor with peripherals and DMA ( from DSDG work ) ASIC communications ( from prototype work ) ASIC multiplexed readout. ( from prototype work ) Timestamped based on discriminator signals. Formatted and transferred to processor memory as four time ordered data streams. FEE64 design documentation. Prepare for production. 3rd September 2009