Preliminary control integration

Slides:

Advertisements

Similar presentations

Large-scale motions in the ocean and the atmosphere case of stable stratification (ocean, stratosphere)

Advertisements

Honors Biology Chapter 7Section 3 Cell Boundaries

CMOS Fabrication EMT 251.

Educational program: Mechanic - electrician Title of program: Technical training II. class The loudspeakers Worked out: Bc. Chumchal Miroslav Projekt.

Juan Bisquert Nanostructured Energy Devices: Equilibrium Concepts and Kinetics CRC Press 1 1Introduction 2Electrostatic and thermodynamic potentials of.

Microfluidic Valve Innovation Jo Falls Porter, RET Fellow 2009 West Aurora High School RET Mentor: Dr. David T. Eddington, PhD NSF- RET Program Introduction.

Top-down technique Toshitake Takahashi 03/09/2009 EE235.

Maastricht, January 25-29, MEMS 2004 Website: Plastic Micropump using Ferrofluid and Magnetic Membrane Actuation C. Yamahata and M.

A PDMS DIFFUSION PUMP FOR ON-CHIP FLUID HANDLING IN MICROFLUIDIC DEVICES Mark A. Eddings and Bruce K. Gale Department of Bioengineering, University of.

Overview of processes.

– GTK Working Group Meeting – GTK Cooling: Status of the Micro-Channel Option Feb 2 nd /21 GTK COOLING: STATUS OF THE MICRO-CHANNEL OPTION Paolo.

Basic Silicone Chemistry (II)

Connectors 13/03/2013Collaboration meeting CERN - CSEM1.

Development of a Modular Peristaltic Microfluidic Pump and Valve System 3/13/2007 BME 273 Group 20: Adam Dyess, Jake Hughey, Michael Moustoukas, Matt Pfister.

Device Design: Stage 2 (Modified Microchannel Design) Device Objective –To test the viability of a two-level passive micro-fluidic device Modifications.

G.K.BHARAD INSTITUTE OF ENGINEERING DIVISION :D (C.E.) Roll Number :67 SUBJECT :PHYSICS SUBJECT CODE : Presentation By: Kartavya Parmar.

Logic Gates It’s Only Logical. Logic Gates Are the switches that computers and similar devices use. They hold their state until something changes. Are.

Device Design: Stage 2 (Modified Microchannel Design) Device Objective –To test the viability of a two-level passive micro-fluidic device Modifications.

Presentation Outline February 25 th 20112Microfabrication Design Challenge 2011.

1 Chapter 5. Metal Oxide Silicon Field-Effect Transistors (MOSFETs)

Metallic Bonding This is the type of bonding found in metals.

Ren Yang, Seok Jae Jeong, and Wanjun Wang

IC Processing. Initial Steps: Forming an active region Si 3 N 4 is etched away using an F-plasma: Si3dN4 + 12F → 3SiF 4 + 2N 2 Or removed in hot.

Stage st Trial Problems Thickness of PDMS layers Interconnects Delamination Air bubbles.

Development of a Modular Peristaltic Microfluidic Pump and Valve System 1/30/2007 BME 273 Group 20: Adam Dyess, Jake Hughey, Michael Moustoukas, Matt Pfister.

C D R 5/17/ PI MEETING FOR LEGGED LOCOMOTION AND MUSCLE-LIKE ACTUATORS Main ideas: Use novel layered prototyping methods to create compliant biomimetic.

Process Sequence: Pressure-Actuated Valve ENMA490 October 14, 2003.

EE 587 SoC Design & Test Partha Pande School of EECS Washington State University

Students understand the relation of hydropower compared to wind power. How does energy develop through the flow of current (water) moving through a generator?

Multilayer Microfluidics ENMA490 Fall 2003 Brought to you by: S. Beatty, C. Brooks, S. Dean, M. Hanna, D. Janiak, C. Kung, J. Ni, B. Sadowski, A. Samuel,

MICROCHANNEL DESIGN ISSUES Susan Beatty Anne Samuel Kunal Thaker.

 Regulates what enters and leaves the cell, provides protection and support  Double layered sheet called a LIPID BILAYER.

Figure 11.1 (p. 260) Trends of power supply voltage V DD, threshold voltage V T, and gate oxide thickness d versus channel length for CMOS logic technologies.

Multilayer Microfluidics ENMA490 Fall 2003 Brought to you by: S. Beatty, C. Brooks, S. Dean, M. Hanna, D. Janiak, C. Kung, J. Ni, B. Sadowski, A. Samuel,

Multilayer Microfluidics ENMA490 Fall 2003 Brought to you by: S. Beatty, C. Brooks, S. Dean, M. Hanna, D. Janiak, C. Kung, J. Ni, B. Sadowski, A. Samuel,

PACKAGE FABRICATION TECHNOLOGY Submitted By: Prashant singh.

Field Effect Transistors

Multilayer Microfluidics ENMA490 Fall 2003 Brought to you by: S. Beatty, C. Brooks, S. Dean, M. Hanna, D. Janiak, C. Kung, J. Ni, B. Sadowski, A. Samuel,

Cell Membrane Notes. Cell Membrane - Plasma Membrane – Phospholipid Bilayer.

What is the Internet? The Internet is a computer network that interconnects millions of computing devices throughout the world.

CMOS Fabrication EMT 251.

Current Channeling – End View, Vertical Section, Not to scale

Mask Design for Molds.

Fluid Resistance: Micro-channels of the Valve Design

LOCKERBIE ACADEMY PHYSICS DEPT

Overview of Issue

Date of download: 12/22/2017 Copyright © ASME. All rights reserved.

Materials and Devices for Neural Systems and Interfaces

See what the future has in store for you!

Flow chart: Tissues.

Cell Boundaries.

The Human Heart and Blood Flow

Device Design: Stage 2 (Modified Microchannel Design)

Pressure Actuated Valve Test Design

MOSFET POWERPOINT PRESENTATION BY:- POONAM SHARMA LECTURER ELECTRICAL

FIELD EFFECT TRANSISTOR

Overview of processes.

Western Electricity Coordinating Council

Applications and Acknowledgements

Western Electricity Coordinating Council

POWER CHALLENGES Several Ways To Solve 7 CHALLENGES.

LOCKERBIE ACADEMY PHYSICS DEPT

WILF: To know about appliances that use batteries.

WILF: To know about appliances that use batteries.

Substrate Nonuniformity And Other Structural Effects

Similarities Differences

Mask Design for Molds.

Boundary Layer Correction

Multilayer Microfluidics

Presentation transcript:

Preliminary control integration Membrane(located behind the cross-section) Substrate (pyrex) Fluid control Membrane Microchannel (test fluid) Hidden fluid control

Control Channels vs. Independent On/Off valves Control Channels (yellow) On/Off valves

Control Flow Channels and Piezoelectric Challenges One control channel will manipulate 3 of the microchannels, giving us less control. Unless we develop a logic system. The membrane will need to be thin, making it difficult to peel away the layer from the mold. The electrical interconnects will be throughout the device. Will there be a way to integrate metal and polymer. If we have a peel and layer process, how will we insert the piezoelectric (or similar material) into the device?