CREAM Scholarship Program in Secure Embedded Systems

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Presentation transcript:

CREAM Scholarship Program in Secure Embedded Systems Providing advanced degrees in cybersecurity Developing solutions to cyber threats Producing skilled workforce in cyber Center for Reverse Engineering and Assured Microelectronics (CREAM) Scholarship Opportunity! Eligibility Requirements U.S. Citizen 18 years of age or older by August 1, 2019 Able to participate in summer internships at DoD facilities Willing to accept post-graduate employment with DoD Cumulative GPA > 3.2 for undergraduate juniors and seniors and GPA > 3.5 for graduate applicants Have interest in secure embedded systems and cybersecurity Complete CAE Cybersecurity course requirements Benefits: Awarded Participants receive…. Full tuition and educated related fees Annual stipend at a rate $20K - $30K (dependent upon degree pursued and can be prorated) Summer research internships Laptop Book Allowance Faculty and Professional Mentorship Employment Placement after graduation Application Deadline is February 16, 2019 11:00PM EST ONLINE Application weblink is https://searchlightpa.com/form/cyber_scholarship Please contact Dr. Michel Reece via phone: 443-885-4732 or email: michel.reece@morgan.edu for more info. Student Awards are expected to be announced by July 2019