SNAP NIR Detector Packaging Development: Universal SiC Package

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Presentation transcript:

SNAP NIR Detector Packaging Development: Universal SiC Package Bruce C. Bigelow Department of Physics, University of Michigan 30 June 2005

SiC NIR Package Design Issues Neither vendor is producing a package we want to use for SNAP SiC is currently favored for focal plane components Need a package design that can accommodate either RSC or RVS designs Main details are package size, connectors, and interface to FP 8 June 2005 B. C. Bigelow -- UM Physics

Current Rockwell Package Design 8 June 2005 B. C. Bigelow -- UM Physics

Current Rockwell Package Design H2RG package and mounting details 8 June 2005 B. C. Bigelow -- UM Physics

Current RVS Package Dimensions 8 June 2005 B. C. Bigelow -- UM Physics

B. C. Bigelow -- UM Physics Current RVS Package Raytheon Proprietary / Competition Sensitive 8 June 2005 B. C. Bigelow -- UM Physics

UM SNAP NIR Package Design 8 June 2005 B. C. Bigelow -- UM Physics

UM SNAP NIR Package Design 8 June 2005 B. C. Bigelow -- UM Physics

UM SNAP NIR Package Design 8 June 2005 B. C. Bigelow -- UM Physics

UM SNAP NIR Package Design 8 June 2005 B. C. Bigelow -- UM Physics