North America Compound Semiconductor Materials Technical Committee Chapter Liaison Report May 26, 2017

Committee Co-chairs Leadership Russ Kremer / Freiberger Compound Materials Jim Oliver / Northrop Grumman

Current Committee Structure North America Compound Semiconductor Materials Technical Committee Chapter Silicon Carbide TF Electrical Properties TF

Meeting Information Last meeting Next meeting May 24 for CS MANTECH 2017 at Hyatt Regency Indian Wells Palm Springs, California Next meeting May 9 for CS MANTECH 2018 Austin, Texas More info at www.csmantech.org/

Document Review Summary CS MANTECH 2017 Meeting * Cycle 1, 2017 * Doc # Description TC Action 6132 Line Item Revision of SEMI M79-0211 Specification for Round 100 mm Polished Monocrystalline Germanium Wafers for Solar Cell Applications Passed 6133 Line Item Revision of SEMI M10-0816 Terminology For Identification Of Structures And Features Seen On Gallium Arsenide Wafers 6134 Reapprovals of SEMI M23-0811 — Specification For Polished Monocrystalline Indium Phosphide Wafers, SEMI M23.1 0211, SEMI M23.2 0211, SEMI M23.4 0211, SEMI M23.5 0211, and SEMI M23.6 0211

Task Force Updates GaN TF Electrical Properties TF Silicon Carbide TF Document 4979A (New Standard: Specification for Polished Monocrystalline C-Plane Gallium Nitride Wafers) published as SEMI M86-0915. TF was disbanded Electrical Properties TF ASTM F1.15 Subcommittee on Compound Semiconductors Exploring GaN reference materials. Survey will be conducted. Silicon Carbide TF Liaison with Europe TC Chapter

Thank You! For more information or to participate in any NA CSM activities, please contact Kevin Nguyen at SEMI (knguyen@semi.org)