Laboratory: A Typical Wet Etching Process

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Presentation transcript:

Laboratory: A Typical Wet Etching Process

- Prepare chemicals.

- Mix chemicals in the proper ratios.

- Heat chemical mixture.

- Etch wafer.

- Remove wafer from the chemical etch solution.

- Rinse wafer.

A Typical Dry Etching Process

- Prepare chamber.

- Load wafers.

-Plasma etch.

- Remove wafers.

A Typical Diffusion Process

- Prepare the source wafers (e. g - Prepare the source wafers (e.g., ceramic wafers of LnP5O14 , which is a mixture of Ln2O3 and P2O5, as a source of P2O5 for P-doping).

- Verify that the diffusion furnace temperature is set (~ 850 °C for P ).

- Using teflon or teflon-tipped tweezers, carefully load the wafers into the quartz boat.

- The wafers should be inserted such that the device side of each is facing an P2O5 source wafer. There are two wafer slots between sources, allowing for a device wafer facing both sides.

- Return quartz boat, which now contains the wafers and sources, to the phosphorus furnace using the quartz boat loader.

- The phosphorus furnace needs to be heated to the temperature (~850 °C for P-doping) at which the diffusion will be performed.

- Begin nitrogen flow through the tube by setting the gas flow rate to a reasonable value (~3000 sccm).

- At the end of the process remove the boat from the furnace and allow the wafers to continue to cool before removing them from the wafer carrier.