Microelectronics Research Group

Slides:



Advertisements
Similar presentations
1 Laboratoire d'Analyse et d'Architecture des Systèmes du CNRS Welcome.
Advertisements

RF and AMS Technologies for Wireless Communications Working Group International Technology Roadmap for Semiconductors Radio Frequency and Analog/Mixed-Signal.
Bandgap Engineering of the Amorphous Wide Band-Gap Semiconductor (SiC)1-x(AlN)x Doped with Rare Earths and its Optical Emission Properties Roland Weingärtner.
Eija Tuominen Siena TEST BEAM RESULTS OF A LARGE AREA STRIP DETECTOR MADE ON HIGH RESISTIVITY CZOCHRALSKI SILICON Helsinki Institute of Physics,
Eija Tuominen DEVELOPMENT OF RADIATION HARD DETECTORS Helsinki Institute of Physics (HIP) In close cooperation with: Microelectronics Centre,
Silicon Wafer in Production: Type and Specification By Assoc. Prof. Dr. Uda Hashim School of Microelectronic Engineering.
Report for China Frontier Workshop (June 22nd 2006 Beijing) Wang Zhanguo Key Lab. of Semiconductor Materials Science, Institute of Semiconductors, Chinese.
Ch.1 Introduction Optoelectronic devices: - devices deal with interaction of electronic and optical processes Solid-state physics: - study of solids, through.
Silicon Nanowire based Solar Cells
ECE 695V: High-Speed Semiconductor Devices Peide (Peter) Ye Office: Birck Tel: Course website:
Markets for Silicon Carbide Devices Olivier Nowak, WTC – Wicht Technologie Consulting, Munich EPE 2005 September 12, 2005.
1 NATIONAL SCIENTIFIC SOCIETY “MICRO & NANO” Established: July 2004 Founding members: 5 Institutions (Research Institutes,  5 Institutions (Research Institutes,
07 Feb Feb Contribution to IBPOWER Presentation WP 4.
Microelectronics & Device Fabrication. Vacuum Tube Devices Thermionic valve Two (di) Electrodes (ode)
NIST Nanofabrication Facility. CNST Nanofab A state-of-the-art shared-use facility for the fabrication and measurement of nanostructures –19,000 sq ft.
Introduction to microfabrication, chapter 1
Nitride Materials and Devices Project
Zyvex Microassembly Capability Micro-interferometer 7 July 2005 Matt Ellis Senior Scientist James Wylde Applications Engineer
Presentation by Maria Rangoussi, Dean, Faculty of Engineering ( ( ) “SENS-ERA” Project Kick-off Meeting Georgian Technical.
Computer Chips: A World of Microelectronics
Institute of Solid State Physics of the Bulgarian Academy of Sciences 1784 Sofia, 72, Tzarigradsko Chausse Fax: ;
Crystal Growth of III/V Semiconductor Nanowires Kobi Greenberg.
Importance of Materials Processing  All electronic devices & systems are made of materials in various combinations  Raw materials are far from the final.
Microsystems at Georgia Tech Electronics and classical physics Electronic sciences and solid-state physics microelectronics microsystems.
High Electron Mobility Transistor (HEMT)
Heterostructures & Optoelectronic Devices
ITC-irst Researchers 217 Post docs 13 PhD students MM area FCS – Physics & Chemistry of Surfaces and Interfaces MIS – Microsystems IT area SRA –
Nanostructures with quantum wells and quantum dots Prof. Dr. Alexander L. Gurskii B.I.Stepanov Institute of Physics, National Academy of Sciences of Belarus.
Facilities in the Molecular and Materials Physics group Bill Gillin Dept of Physics.
13 Nov Dimitris LOUKAS Name of the Institution : NCSR Demokritos Contact person: Dimitris LOUKAS
Fabrication Process for Micro Structures
Evolution of Microelectronics. Applications LANs WANs Routers Hubs Switches WorkstationsInternet Servers Video Games Voice Over IP Digital Cameras Wireless.
The Development of the Microwave Vacuum Electronics at BVERI
Antenna Project in Cameron clean room Wafer preparation, conductor deposition, photolithography.
Paolo Michelato, Workshop on High QE Photocathodes, INFN-Milano LASA, 4 – 6 October Photocathodes: Present status and future perspectives Paolo Michelato.
P RESENTATION ON MONOLITHIC MICROWAVE INTEGRATED CIRCUITS PASSIVE COMPONENTS SUBMITTED BY:- AJAY KAUSHIK(088/ECE/09 ) NAMAN KUMAR(082/ECE/09 )
Introduction to microfabrication, chapter 1 Figures from: Franssila: Introduction to Microfabrication unless indicated otherwise.
Semiconducting  -FeSi 2 Presented by Srujana Aramalla.
Lecture 2: Wafer and Epitaxy Techniques Semiconductor Substrate Production: Si, GaAs, InP, GaP, InAs, InSb……. SiC, Sapphire, GaN Wafer Growth: (1)Czochralski.
Evaluation of Polydimethlysiloxane (PDMS) as an adhesive for Mechanically Stacked Multi-Junction Solar Cells Ian Mathews Dept. of Electrical and Electronic.
Chapter 9. Optoelectronic device
ECE 695V: High-Speed Semiconductor Devices Peide (Peter) Ye Office: Birck Tel: Course website:
UNDERGRADUATE COURSES USING THE SMU CLEAN ROOM
Pulse energy measurement for the CTF lasers.
POSITION OF MRG IN EUROPEAN MICROELECTRONICS
E-beam Lithography for Optical Gratings and Waveguides
VISTA work in Ulm since Jan. 2002
Electrical magnetic and optical properties of technological important oxides.
DILBERT.
Basics Semiconductors
SiC processing In Corial 200 series.
Molecular Beam Epitaxy (MBE) C Tom Foxon
TopGaN Ltd. company profile
1.3µm Optical Interconnect on Silicon: A Monolithic III-Nitride Nanowire Array Photonic Integrated Circuit MRSEC Program; DMR A feasible.
Global Gallium Arsenide Wafer Market Report : Trends, Forecast and Competitive Analysis 1.
Materials Conductive materials – valence band overlaps the conduction band Non conductive materials – valence band is separated from conduction.
Recess etch for HEMT application
Advanced Wireless Semiconductor Company
X-BAND & S-BAND FOR MARINE RADAR
Yingjie Ma, Jian Cui*, Yongliang Fan, Zhenyang Zhong, Zuimin Jiang
Semiconductor Substrate Production: Si, GaAs, InP, GaP, InAs, InSb…….
ECE 695V: High-Speed Semiconductor Devices Peide (Peter) Ye Office: Birck Tel: Course website:
Metamaterials Fabrication
Sensor Technology group
Metal Organic Chemical Vapour Deposition
Microfabrication of 100 GHz Test Structures
Epitaxial Deposition
Power Electronics: cooking up group IV semiconductor materials.
Student Design Competition
Presentation transcript:

Microelectronics Research Group FORTH/IESL 20 person-team Since 1986 Microelectronics Research Group 6 senior researchers 5 technical staff + students and post-docs     Compound semiconductors GaAs, SiC, GaN Si Objective : material and device technology of compound semiconductors

Unique facility in Greece Material Growth GaAs SiC GaN Characterisation Device processing Microelectronics HEMTs, MMICs, RF-MEMS Optoelectronics LDs, LEDs, Detectors

Equipment I 200 m2 of clean rooms (class 1000) GaAs SiC GaN 3 molecular beam epitaxy systems

Equipment II Full processing line for microelectronic and optoelectronic devices Lithography down to 0.3 mm E-gun metal evaporator UV mask aligner PECVD RIE

Equipment III Characterisation Optical (including at cryogenic temp.) Structural (AFM, XRD…) Electrical (including RF-measurements up to 20 GHz)