Department of Physics, University of Michigan

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Presentation transcript:

Department of Physics, University of Michigan SNAP NIR Detector Packaging Development: Towards a Universal SiC Detector Package Bruce C. Bigelow Department of Physics, University of Michigan 28 July 2005

SiC NIR Package Design Issues Neither NIR device vendor is producing a package we want to use for SNAP SiC is currently favored for SNAP focal plane components It would be useful to have a common NIR package design for both RSC and RVS detectors These designs shown here have the center of the sensor areas located at the center of the package, per the new detector ICD The Hypertronics connector is offset per the new ICD With the current connector IC, the Rockwell device exceeds the boundaries of the ICD volume Open questions: Connector to PCB electrical interface (solder joint?, bottom or side of connector?) Connector to package mechanical interface (screw to package, not PCB) Add bolt holes to connector? 7/21/05 B. C. Bigelow -- UM Physics

Raytheon and Rockwell Univ. packages 7/21/05 B. C. Bigelow -- UM Physics

Raytheon and Rockwell Univ. packages Aperture mask Raytheon Rockwell PCB sticks out… 7/21/05 B. C. Bigelow -- UM Physics

SiC prototype pedestal 7/21/05 B. C. Bigelow -- UM Physics

SiC package design for quotations 7/21/05 B. C. Bigelow -- UM Physics

SiC coupon drawing for quotations 7/21/05 B. C. Bigelow -- UM Physics