The DHCAL for the m2 and m3 prototype

Slides:

Advertisements

Similar presentations

SERIES RESISTOR CIRCUIT. THE EQUIVALENT SERIES RESISTANCE IS : Req = R 1 + R 2 + R 3 THE CURRENT OF THE CIRCUIT IS : I = U / (R 1 + R 2 + R 3 ) THE EQUIVALENT.

Advertisements

Uli Schäfer 1 Ethernet-driven control and data acquisition scheme for the Timepix-based TPC readout C. Kahra, U. Schäfer, M.Zamrowski Uni Mainz.

Julie Prast, DHCAL Meeting, 24 janvier 2008 La carte DIF pour DHCAL (proto au m 2 et au m 3 ) Sebastien Cap, Julie Prast ( LAPP) Christophe Combaret (IPNL)

FPIX2 Project Zhou & JC. Using the Default Firmware 4 Connector (A,B,C,D) on the PMC board A & B SAMTEC Connector in the firmware Only A connector on.

ECE 442 Power Electronics1 Full-Wave Bridge Rectifier.

Circuits Series and Parallel. Series Circuits Example: A 6.00 Ω resistor and a 3.00 Ω resistor are connected in series with a 12.0 V battery. Determine.

CALICE – 12/07/07 – Rémi CORNAT (LPC) 1 ASU and standalone test setup for ECAL MAIA BEE project Overview DAQ dedicated Sensor test In situ debug and maintenance.

1 SBS Spectrometer / GEP5 Conf.. 2 Tracking Requirements Requirements Tracking Technology DriftMPGDSilicon High Rate: MHz/cm 2 (Front Tracker)

CALICE meeting Prague 2007, Hervé MATHEZ 1 DHCAL PCB STUDY for RPC and MicroMegas (Electronics recent developments for the European DHCAL) William TROMEUR,

DCS Detector Control System Hardware Dirk Gottschalk Volker Kiworra Volker Lindenstruth Vojtech Petracek Marc Stockmeier Heinz Tilsner Chair of Computer.

Ciemat Mechanical Structure Proposal for a DHCAL m 3 Prototype. Enrique Calvo Alamillo Paris

2012/03/06 匡建慈. goals  To build a multi-core platform with Hadoop environment.  Hardware architecture  What is Hadoop ?  What to do and what we have.

Tuesday September Cambridge1 GDCC “next replacement of the LDA” Franck GASTALDI.

Large Area Endplate Prototype for the LC TPC 1 D. Attié, P. Baron, D. Calvet, P. Colas, C. Coquelet, E. Delagnes, M. Dixit, A. Le Coguie, R. Joannes, S.

Bart Hommels Univeristy of Cambridge EUDET Annual Meeting, Ecole Polytechnique, Paris JRA3: DAQ Overview Objectives System Overview Status of.

PARALLEL RESISTOR CIRCUIT. The equivalent parallel resistance is: The equivalent parallel resistance when I connect two resistors in a parallel circuit.

4.2.5 Parallel Circuits Wiring for Voltage. Definitions parallel circuit – a circuit in which two or more elements are connected so that each has its.

08/10/2007Julie Prast, LAPP, Annecy1 The DHCAL DIF and the DIF Task Force Julie Prast, LAPP, Annecy.

Catherine Adloff16 June 2009 CALICE Technical Board 1 DHCAL-MICROMEGAS Yannis KARYOTAKIS For the LAPP group.

J. Prast, G. Vouters, Arlington, March 2010 DHCAL DIF Status Julie Prast, Guillaume Vouters 1. Future CCC Use in DHCAL Setup 2. Calice DAQ Firmware Implementation.

Detector Interface (DIF) Status CALICE meeting – DESYDec Mathias Reinecke.

Optical Readout and Control Interface for the BTeV Pixel Vertex Detector Optical interface for the PCI board –1.06 Gbps optical link receiver –Protocol.

Krishna Jhajaria (Presenting) Matt Waldersen T.J. Strzelecki Rick Schuman.

Acquisition Crate Design BI Technical Board 26 August 2011 Beam Loss Monitoring Section William Vigano’ 26 August

Testing of ABC  Not to scale! 100nF Edge Sensor wired to A9, A10 ? ABC nF NB graphic is not an exact match with “ABC_Pads_V5.2.pdf”

Elec467 Power Machines & Transformers Electric Machines by Hubert, Chapter 12 Topic: Self-excited and compound generators, load distribution.

P. Aspell CERN April 2011 CMS MPGD Upgrade …. Electronics 2 1.

CALICE Si-W ECAL (& ILD) power pulsing (cabling) C.Clerc LLR, Ecole polytechnique, Palaiseau R. Cornat P.Mora de Freitas G.Musat J.-F. Roig.

Maurice Goodrick, Bart Hommels EUDET Annual Meeting, Ecole Polytechnique, Paris EUDET DAQ and DIF DAQ overview DIF requirements and functionality.

C. Combaret 27 jan 2010 SDHCAL Power pulsing tests status in lyon C. Combaret, for the IPNL team.

12 September 2006Silicon Strip Detector Readout Module J. Hoffmann SIDEREM SIlicon Strip DEtector REadout Module.

D. Attié, P. Baron, D. Calvet, P. Colas, C. Coquelet, E. Delagnes, R. Joannes, A. Le Coguie, S. Lhenoret, I. Mandjavidze, M. Riallot, E. Zonca TPC Electronics:

7. Direct Current circuits. 11 Find the currents, which flow in all the wires of the circuit in this figure 12  9 V 6 V b a cd 18 

Electric Circuit Types Series and Parallel Circuits.

Julie Prast, Calice Electronics Meeting at LAL, June 2008 Status of the DHCAL DIF Detector InterFace Board Sébastien Cap, Julie Prast, Guillaume Vouters.

D. Attié, P. Colas, E. Delagnes, M. Riallot M. Dixit, J.-P. Martin, S. Bhattacharya, S. Mukhopadhyay Linear Collider Power Distribution & Pulsing Workshop.

C. CombaretSept 2007 Thoughts on DHCAL slabs What we need : Around 40 detector plans stacked in 1 meter Large plans : around 2 m x 1 m (70cm x 70cm for.

Report on dummy detector Equipped with Heater & sensors NA62 GigaTracker Working Group Meeting May 24 th 2011.

Control voltage 0 to 8 V driver supply voltage 3.3 to 5 V 3.3 to 5 V control pulse rising edge (there is a 49.9 Ω term. resistor hidden under here!) 100.

Maurice Goodrick, Bart Hommels CALICE-UK Meeting, Cambridge CALICE DAQ Developments DAQ overview DIF functionality and implementation EUDET.

14th january 2010 Actual Micromegas USB DAQ ASU and DIF

Catherine Adloff28 Jan 2008 SiD Collaboration Meeting 1 DHCAL and MICROMEGAS at LAPP Catherine Adloff Franck Cadoux Sébastien Cap Cyril Drancourt Ambroise.

DHCAL Jan Blaha R&D is in framework of the CALICE collaboration CLIC08 Workshop CERN, 14 – 17 October 2008.

AHCAL Electronics. Status of Integration Mathias Reinecke for the DESY AHCAL developers AHCAL main and analysis meeting Hamburg, July 16th and 17th, 2009.

CALICE/EUDET FEE status C. de LA TAILLE. 31 aug 2009 EUDET SC meeting Status of JRA3 Front End Electronics 2 ILC front-end ASICs : the ROC chips SPIROC.

News from the 1m 2 GRPC SDHCAL collection of slides from : Ch.Combaret, I.L, H.Mathez, J.Prast, N.Seguin, W.Tromeur, G.Vouters and many others.

Proto micromegas au LAPP 14 november 2008The DHCAL Board for the m2 and m3 prototype1 ASU DIF Inter DIF terminaison FPC USB Test Vendredi dernier….

Figure 1.1 A silicon wafer. Figure 1.1 A silicon wafer.

CALICE DAQ Developments

The European DHCAL status

Enrique Calvo Alamillo DAEGU

CEPC 数字强子量能器读出电子学预研进展

CALICE meeting 2007 – Prague

Large Area Endplate Prototype for the LC TPC

Jimin Kim Thinh Nguyen Sen Mao

Status of the DHCAL DIF Detector InterFace Board

DHCAL PCB STUDY For RPC 1 m2 PCB SOLUTION

Power pulsing of AFTER in magnetic field

Tao Hu, Jianbei Liu, Haijun Yang, Boxiang Yu For the CEPC-Calo Group

C. de La Taille IN2P3/LAL Orsay

CALICE/EUDET Electronics in 2007

The DHCAL DIF Board For the M2 Prototype

STATUS OF SKIROC and ECAL FE PCB

CALICE meeting 2007 – Prague

Voltage Divider Circuit

State of developments on Readout interface of European DHCAL

Comparing Series and Parallel Circuits

Example Example 1: An electric lamp is rated 110 W, 200 V. When the lamp is operated at its rated power and voltage, calculate a) the current flowing through.

We are working on developing “cheap” RTD monitoring channels for the CMS Phase-2 requirements. The channels will provide the complete readout for 4-wire.

Presentation transcript:

The DHCAL for the m2 and m3 prototype Detector module in M2 32x48 cm (24 Hardroc) 32x48 cm (24 Hardroc) 32x48 cm (24 Hardroc) 32x48 cm (24 Hardroc) 32x48 cm (24 Hardroc) 32x48 cm (24 Hardroc) 24 January 2008 The DHCAL for the m2 and m3 prototype

The DHCAL for the m2 and m3 prototype Link in M2 DIF Intermediate board connection Samtec DIF Intermediate board connection Samtec , : Flat Printed Circuit : Hardroc chip : Hirose connector : Terminaison board 24 January 2008 The DHCAL for the m2 and m3 prototype

The DHCAL for the m2 and m3 prototype Data flow: DIF Hardroc DIF fpga Driver circuit on intermediate board Resistor on terminaison board 24 January 2008 The DHCAL for the m2 and m3 prototype

The DHCAL for the m2 and m3 prototype Data flow: DIF Hardroc DIF fpga Shunt chain on intermediate board Shunt chain on terminaison board 24 January 2008 The DHCAL for the m2 and m3 prototype

The DHCAL for the m2 and m3 prototype Data flow: DIF Hardroc DIF fpga To Be Defined on intermediate board 24 January 2008 The DHCAL for the m2 and m3 prototype

Power distribution: DIF Hardroc, dectector Micromegas High Voltage : Power connector Low Voltage 24 January 2008 The DHCAL for the m2 and m3 prototype

Proposal prototype for M2 DIF Intermediate board connection Samtec ASU prototype contain 4 hardroc chips Detector size of ASU prototype is 8x32mm Test with 3 ASU prototype (or 2 ASU minimum) , : Flat Printed Circuit : Hardroc chip : Hirose connector : Terminaison board 24 January 2008 The DHCAL for the m2 and m3 prototype