Environmental, Health and Safety Japan TC Chapter Liaison Report

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Presentation transcript:

Environmental, Health and Safety Japan TC Chapter Liaison Report Taiwan EHS TC Chapter Meeting March, 2017

Leadership Committee Co-chairs Leadership Changes Hidetoshi Sakura/Nuflare GCS voting member EHS Committee representative to the JRSC Moray Crawford/Hatsuta Seisakusho Supika Mashiro/Tokyo Electron Leadership Changes Naokatsu Nishiguchi/SCREEN BSS stepped down from Seismic Protection Task Force. New task force leader is not assigned yet.

TC Chapter Organization EHS Japn TC Chapter Hidetoshi Sakura/ Nuflare Technology Moray Crawford/ Hatsuta Seisakusho Supika Mashiro/ Tokyo Electron STEP Planning WG Kenji Sugihara/ Panasonic S23 Revision Global TF George Hoshi / Tokyo Electron Lauren Crane / Tokyo Electron U.S. Seismic Protection TF TBD GHG Emission Characterization TF George Hoshi / Tokyo Electron SDRCM TF Supika Mashiro/ Tokyo Electron

Previous Meetings Next Meeting Meeting Information 10:00-14:00, December 16, 2016 at Conference Tower, Tokyo Big Site, Tokyo, Japan Next Meeting 13:30-17:00 (TBD), April 25, 2017 at Meeting Room, SEMI Japan, Tokyo, Japan

Technical Ballot and Ratification Ballot Result Doc. 5556B: Line Item Revision to SEMI S2-0715, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment, Revisions to §19 “Seismic Protection” (In Delayed Effective Date Format) Passed with editorial changes and technical changes on June 28 Ratification Ballot to be issued to validate all of the technical changes made by a TC Chapter during adjudication of 5556B Ratification Ballot R5556B was submitted to be voted for Cycle 6 Cleared the condition to pass Also both 5556B and R5556B passed the A&R process, published as S2-1016a

Ballot Result on June 28 and Ratification Ballot Doc. 5947A: Revision to SEMI S23-0813, with title change from “GUIDE FOR CONSERVATION OF ENERGY, UTILITIES AND MATERIALS USED BY SEMICONDUCTOR MANUFACTURING EQUIPMENT” to “GUIDE FOR ENERGY, UTILITIES AND MATERIALS USE EFFICIENCY OF SEMICONDUCTOR MANUFACTURING EQUIPMENT” Passed with editorial changes and technical changes on June 28 Ratification Ballot to be issued to validate all of the technical changes made by a TC Chapter during adjudication of 5947A Ratification Ballot R5947A was submitted to be voted for Cycle 6 Cleared the condition to pass Also both 5947A and R5947A passed the A&R process, published as S23-1116

Upcoming Ballots NONE

5 year Review S16-0307 (Reapproved 0812) Guide for Semiconductor Manufacturing Equipment Design for Reduction of Environmental Impact at End of Life SNARF for reapproval will be prepared. S17-0113 Safety Guideline for Unmanned Transport Vehicle (UTV) Systems SNARF for re-approval will be prepared S18-0312 Environmental, Health and Safety Guideline for Flammable Silicon Compounds SANRF for the item ballot with the title change (PM A4-1) S21-1106E (Reapproved 0612) Safety Guideline for Worker Protection S29-0712 Guide for Fluorinated Greenhouse Gas (F-GHG) Emission Characterization and Reduction The task force will discuss S24-0306 (Reapproved 0811) Safety Guideline for Multi-Employer Work Areas Inactive

TF/ WG/ SG Reports -1 S23 Revision Global Task Force New SNARF for revision to S23, adding the guide for COo2 equivalent conversion (line item) will be discussed among global task force members. Greenhouse Gas (GHG) Emission Characterization Task Force No special update from the last report

Seismic Protection Task Force TF/ WG/ SG Reports -2 Seismic Protection Task Force Recruiting new task force leader Disapproval Comments to R5559B As a result of TF/TC Chapter discussions, five out of eight items are to be addressed as new business in future. STEP Planning Working Group STEP/ SEMI S2 was held on November 22 at SEMI Japan Office.

Thank you! Staff contact Junko Collins SEMI Japan jcollins@semi.org