LEPS Collaboration Meeting in Taiwan Update of TPC Analysis (II) Jia-Ye Chen 2006.1.12

Contents Time Projection Chamber Particle Identification Get Pulses and Form Clusters Set Hits and Find Track Candidates Layer-Clustering (0.46-rk) and Wire-Clustering (0.47b) Wire-Clustering Algorithm Future Work

Time Projection Chamber

Particle Identification Algorithm

Get Pulses and Form Clusters

Set Hits and Find Track Candidates Hit Position 2D

Layer-Clustering and Wire-Clustering

Layer Clustering R32273 Event 1 Layer 0

Layer Clustering R32273 Event 1 Layer 1

Wire Pulses R32273 Event 1

Wire Clustering R32273 Event 1 Cross Layer Same Layer

Wire Clustering R32273 Event 1 Wire 50

Find Track Candidate

0.46 W/O CorrectHit 0.47 W/O Tracking Raw Hits

R32273 Event 1 Raw Hits and Tracking Hits y y x x Tracking Hits Raw Hits

Double-Counted Hits y z y z x x Transverse : x and y Longitudinal : z

Hits Separation dx dy dz (mm) dy dz dz dx dx dy

Pile-up Pulses ΔZ

Wire-Clustering Algorithm High ADC pulse as SEED Find Time-Overlapped pulses on the same or neighboring layers, if time-overlapped pulses on the same layer, ask for neighboring pads. A cluster requires that more than 3 pulses and 3 pads. Hits which their separation, ΔZ, is smaller than 1 mm, are double-counted hits. Small max-ADC hit will be dropped.

Tracking Enhancement 1 hit per layer per track More than 1 hit per layer per track

Future Work To merge Layer-Clustering and Wire-Clustering. To extend tracking algorithm, # of hits per tracks will greater than 14. Hope : Kick event