ITRS 2001 Factory Integration Chapter Model Information ITRS Factory Integation TWG 2019/4/23 ITRS 2001 Factory Integration Chapter Model Information 1. Fab Ramp Model 2. Fab Capital Cost Model 3. Yield and Profit Model 2019/4/23 ITRS Factory Integration TWG FITWG 2000

ITRS Factory Integation TWG 2019/4/23 Factory Integration Scope and Drivers UI Factory Operations Production Equipment Factory Information & Control Systems Facilities AMHS Si Substrate Mfg Wafer Mfg Chip Mfg Product Mfg Distribution Reticle Mfg FEOL BEOL Probe/Test Singulation Packaging Test Increasing cost & Cycle time implications The Factory continues to be driven by Cost, Productivity, and Speed -> Reduce factory capital and operating costs per function remain challenging and important as ASP’s decline and factory are not 100% loaded -> Customers continue to demand fast delivery of new and volume products. Competition dictates that we more quickly and pervasively qualify leading edge process technologies on new products -> We continue to see the need to heavily reuse facilities and equipment to maintain or reduce cost even as we change wafer sizes or add more advanced process technology capabilities Factory is driven by Cost, Productivity, and Speed: Reduce factory capital and operating costs per function Faster delivery of new and volume products to the end customer Efficient high volume production, high reliability, & high equipment reuse Enable rapid process technology shrinks and wafer size changes 2019/4/23 ITRS Factory Integration TWG FITWG 2000

Manufacturing Strategy Evolution ITRS Factory Integation TWG 2019/4/23 Manufacturing Strategy Evolution Throughput center-minded Speed and environment center-minded Specific Tech. Level TR (Eq., AMHS, FICS) Effort Effort Specific Tech. Potential Solution (Eq., AMHS, FICS) Factory Operation Requirement * Manufacturing strategy requires different perspectives to understand requirements, needs, and solutions depending upon which level of the manufacturing hierarchy you look at. * At the Enterprise level, the requirement is to deliver product to the customer from factories starting at design through delivery which is an end to end delivery concept. Cycle time means something very specific at this level and the systems to support it cast a wider net across the entire enterprise including mulitple factories, design and integration, etc. At the technology level, we are concerned with products and equipment at the factory floor which support the high level requirements of the enterprise and which enable the enterprise to deliver. So run rate of process equipment and delivery time of AMHS is important All of this must be integrated to ensure that the enterprise, factory, and equipment/product levels work together and efficiently Enterprise Level Requirement Current values Next generation Values Wider coverage needed FITWG 2000

ITRS Factory Integation TWG 2019/4/23 Search for New Metrics Carrier Delivery Time ECM Facility Technical Element Level Equipment Control AMHS T/F Design AMHS AMHS MTTR & MCBF SCM FICS Eq. Availability & Utilization Production Flexibility Eq. Process Speed X Factor Factory Operation Level NPW Activity NPW-Start Usage Development Speed NPW Control ES & H Productivity Lot Cycle Time For 2003, we have spent a considerable amount of time to understand which metrics are meaningful to suppliers, the Factory, and to the enterprise. We expect more emphasis in 2004 on the enterprise level of metrics and capabilities within the ITRS since the complexities of this level deal directly with the business and economics of semiconductor. Productivity and flexibility measure for high mix Production Methodology and Constraints Consumables and cost reduction Enterprise Level Line capability strategy Floor Space Effectiveness Energy saving Product Development FITWG 2000

Seek Higher Visibility ITRS Factory Integation TWG 2019/4/23 Seek Higher Visibility Newer Requirements (Difficult Challenges) More on Speed Agile manufacturing More on Environment Newer visualization scheme needed Example1: More of fab floor activity for better governance Example2: of B factor in y=Ax+B equation for B reduction Exmaple3: More of fab energy consumption for resource consumption reduction Need newer metrics and domain concept into production CIM frame work Visualization, Fab Transparency We are driving toward higher visability in the ITRS on cause and effect at the various Potential Implementation Solution (System and Contents) Accomodate various production methodology values in ITRS messages FITWG 2000

What Does a Leading Edge 300mm Fab Look Like Today? High product mix operations enabled using automation 100% AMHS Storage and Intrabay Transport Systems in place Aggressive focus on lot cycle time reduction Pervasive use of Standards for carriers, equipment interfaces, and software systems FOUP carrier tracking using ID tags at load ports Some Wafer Level Tracking & Recipe/Parameter Changes Very high use of APC and Yield systems Factory Scheduler And Material Control Data SPC R2R FDC Yield PCS EPT APC, Yield, and E-Manufacturing Capabilities (EEC) Recipes E-Diag Systems Scaled for > 30k wspm Equipment Control Systems Manufacturing Execution Systems Most equipment data feed through SECS/GEM communications All lots and wafers tracked and processed using the MES Equipment Performance Tracking (EPT) Data Partner, Customer Or Supplier Some use of E-Diagnostics

Some Projected Attributes of a 300mm < 45nm Fab Wafer Data Standard For Packaging Data standards and Systems for Rapid Mask Set Creation Very Fast Cycle time Fabs for Hot & Normal lots Equipment & Systems designed for High Mix operation 100% Direct Tool Delivery AMHS Aggressive NPW Reduction & Efficient Spares Mgmt Full Wafer Level Tracking & Recipe/Parameter Changes Systems Scaled for > 50k wspm Ubiquitous APC; Rapid Process Matching & New Product Qualification Manufacturing Execution Systems Equipment Engineering Capabilities Equipment Control Systems Equipment & Process Data SECS Control Line APC FDC SPC Recipes Factory Scheduler And Material Control Yield PCS E-Diag EPT Equipment Data Acquisition (EDA) Standards to get Rich Equipment Data Offline tools to test schedule rules and rapidly put in Mfg Partner, Customer Or Supplier Pervasive E-Diagnostics Standard, Detailed Equipment Performance Tracking (EPT) Data

Fab Ramp Model Assumptions Factory Size Metrics are driven by high-volume factories: 40K+ WSPM (or ~9.2K WSPW) that are either: (a) high-mix factories More than 5 large volume products, with no one product accounting for more than 50% of all wafers in the factory (b) low-mix factories Hot lots : < 2% of all lots for hi-vol/low-mix; and <10% for hi-vol/hi-mix Avg # of wafers per hot lot: 5-10 wafers Ramp rate Based on leading-edge IC makers first high-volume fab for a major technology node (example 180nm to 130nm) ~20K WSPM Alpha tools Beta tools PO for Production capacity 400 WSPM Slope ~ 4900wspm/qtr ~170 mm2 die 12 months 12 months 12 months 2019/4/23 ITRS Factory Integration TWG