MCMs & Hybrids AKA: Level 1½

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Presentation transcript:

MCMs & Hybrids AKA: Level 1½ IT 318: M11 MCMs & Hybrids AKA: Level 1½ IT 318 - M11

Packaging Levels: Chip = 0 Module = 1 Card = 2 Board = 3 MCMs, Hybrids = 1½ IT 318 - M11

Packaging Levels: Chip = 0 Module = 1 Card = 2 Board = 3 MCMs, Hybrids = 1½ IT 318 - M11

MCM Examples IT 318 - M11

MCM Examples IT 318 - M11

MCM Examples IT 318 - M11

MCM Examples IT 318 - M11

Hybrid Examples IT 318 - M11

Hybrid Examples IT 318 - M11

Hybrid/MCM Characteristics Higher frequencies possible Higher power possible Higher density possible Lower failure rates Lower weight Lower flexibility High NRE (Non-Recurring Engineering) costs KGD (Known-Good Die) issues Note: Green = Good; Red = Bad IT 318 - M11